• The monthly packaging world
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• s.190
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• pp.64-68
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• 2009

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.278-279
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• 2007

본 논문에서는 메조포러스 백금 전극이 적용된 무효소 혈당센서를 실리콘 기판 위에 제작하여 향후 CMOS 회로와의 집적이 가능하도록 설계하였으며, 초소형 무효소 혈당센서 구조의 최적화를 위하여 동일한 면적에서 여러 가지 구조의 센서를 설계 및 제작을 하고 그 결과를 비교 분석하였다. 제작된 무효소 혈당센서는 3전극시스템으로 구성되고 그 특성은 작동전극과 타 전극사이의 간격에 가장 민감한 변화를 보였다. 최적화된 구조를 갖는 센서는 11.1mM glucose실험에서 12.9${\mu}A$의 응답전류를 얻었으며 이 값은 효소를 사용한 센서와 비교하여도 월등히 큰 응답임을 알 수 있었다. 또한 제작된 센서들은 구조 최적화를 위하여 $9mm^2$로 동일한 크기로 실험을 하였지만, 이 크기는 응답전류가 매우 크므로 더욱더 소형화가 가능함을 알 수 있다.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.9-17
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• 2011

Nano-composite solders have been studied to improve the properties of Pb-free solder joints. The nanoparticles in the composite solders were carbon nanotubes(CNTs), metals (Ag, Ni, Cr, etc.), ceramics (SiC, $ZrO_2$, $TiB_2$, etc.). To fabricate the nano-composite solders, mechanical mixing methods and in-situ fabrication method has been used for well-dispersed nano phase. The characteristic properties of the nano-composite solders were high creep resistance, low undercooling, low IMC growth rate and fine microstructures. More researches on the nano-composite solders are required to improve the processibility and the reliability of the nano-composite solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.1-6
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• 2017

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• The monthly packaging world
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• s.356
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• pp.69-73
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• 2022

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1541_1542
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• 2009

본 논문에서는 바이오/환경센서 응용을 위해 실리콘 기판위에 나노 동공구조 백금 전극을 작동전극으로 갖는 소형화된 용존산소센서를 설계 및 제작하고 그 특성을 분석하였다. 제작된 용존산소 센서는 15 mm $\times$ 8 mm $\times$ 0.6 mm의 소형화된 크기를 가졌으며, -0.9 V의 인가전위 시에 각각 산소 포화 상태와 무산소 상태에서 2.14 mA와 0.8 mA의 환원전류 특성을 보였다. 또한, 다양한 산소 농도상태에서 각기 다른 전류응답 차이를 보였다. 이를 통해서 다양한 산소농도에 대한 센싱특성을 검증하였다. 한편, 제작된 용존산소 센서는 전극제작에 사용된 나노 동공구조 백금 전극의 높은 촉매 특성에 기인하여 90% 전류응답시간이 7초 이내로 기발표된 다른 연구들에 비해 현저히 향상된 응답특성을 보였다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.59-63
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• 2010

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.