Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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On-chip Decoupling Capacitor for Power Integrity

전력 무결성을 위한 온 칩 디커플링 커패시터

  • Cho, Seungbum (Graduate School of Nano-IT Design Convergence, Seoul National University of Science and Technology) ;
  • Kim, Sarah Eunkyung (Graduate School of Nano-IT Design Convergence, Seoul National University of Science and Technology)
  • 조승범 (서울과학기술대학교 나노IT디자인융합대학원) ;
  • 김사라은경 (서울과학기술대학교 나노IT디자인융합대학원)
  • Received : 2017.09.15
  • Accepted : 2017.09.22
  • Published : 2017.09.30
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Abstract

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.

Keywords

References

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