• Proceedings of the Korean Magnestics Society Conference
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• 2016.11a
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• pp.120-120
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• 2016

• Korean Journal of Optics and Photonics
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• v.17 no.2
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• pp.203-206
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• 2006

Femtosecond laser-induced nano-patterning of an Al surface coated on a slide glass is reported in this paper. It was found that the period of the laser-induced nano-patterning was much dependent on the incident laser power and pulse number. Through finely adjusting the laser power and pulse number, uniform nano-patterns could be formed on the Al surface. It is based on the interference of the incident laser beam with some form of a surface scatted electromagnetic wave. It was also found that an Al oxide layer played an important role in forming the nano-patterning on the Al surface.

• International Journal of Advanced Culture Technology
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• v.3 no.1
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• pp.13-20
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• 2015

The self-cleaning properties of nano-zinc oxide on cotton fabrics have been investigated. The cotton fabric has been prepared by pad-dry method. The nano-zinc oxide was encapsulated in the polystyrene particle by mini-emulsion process prior used. The loading amount of zinc oxide particles into the mini-emulsion were various from 1% wt to 40%wt. The particles sizes of ZnO-encapsulated polystyrene mini-emulsion were determined using dynamic light scattering. It was showed that the particle size of the mini-emulsion was in the range of 124-205 nm. The topography and morphology of ZnO-encapsulated polystyrene which coated on cotton fabrics was observed using scanning electron microscopy. The crystal structure of ZnO-coated on cotton fabrics was explored by X-ray diffraction spectroscopy. The photocatalytic activities of zinc oxide were present through the self-cleaning properties. The presents of the zinc oxide on cotton fabrics significantly showed the improving of the self-cleaning properties under UV radiation.

• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.144-149
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• 2013

In this research, we developed a biosensor to detect lung cancer-specific biomarker using Anodic Aluminum Oxide (AAO) chip based on interference and nano surface plasmon resonance (nanoSPR). The nano-porous AAO chip was fabricated $2{\mu}m$ of pore-depth by two-step anodizing method for surface uniformity. NanoSPR has sensitivity to the refractive index (RI) of the surrounding medium and also provides simple and label-free detection when specific antibodies are immobilized to the Au-deposited surface of nano-porous AAO chip. To detect the lung cancer-specific biomarker, antibodies were immobilized on the surface of the chip by Self Assembled Monolayer (SAM) method. Since then lung cancer-specific biomarker was applied atop the antibodies immobilized layer. The specific reaction of the antigen-antibody contributed to the change in the refractive index that cause shift of resonance spectrum in the interference pattern. The Limit of Detection (LOD) was 1 fg/ml by using our nano-porous AAO biosensor chip.

• Corrosion Science and Technology
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• v.9 no.4
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• pp.171-174
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• 2010

MAO (micro-arc oxidation) is an eco-friendly convenient and effective technology to deposit high-quality oxide coatings on the surfaces of Ti, Al, Mg and their alloys. The roles of the electrolyte concentration and relative cathode electrode area sizes in the grown oxide film during titanium MAO were investigated. The higher the concentration of the electrolyte, the lower the $R_{total}A$ value. The oxide film produced by the lower concentration of the electrolyte is thinner and less uniform than the film by the higher concentration, which is thick and porous. The cathode area size must be bigger than the anode area size in order to minimize the voltage drop across the cathode. The ratio of the cathode area size to the anode area size must be bigger than 8. Otherwise, the cathode will be another source for voltage drop, which is detrimental to and slows down the oxide growth.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.2
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• pp.120-126
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• 2005

We have proposed a characteristic method to estimate real composition when multi component oxide films are deposited by ALD. Final atomic concentration ratio was theoretically calculated from the film densities and growth rates for $HfO_2$ and $Al_2O_3$ using ALD processed HfxAhOz mms.W e have transformed initial source feeding ratio during deposition to fins] atomic ratio in $Hf_xAl_yO_z$ films through thickness factors ($R_{HFO_2}$ ami $R_{Al_2O_3}$) ami concentration factor(C) defined in our experiments. Initial source feeding ratio could be transformed into the thickness ratio by each thickness factor. Final atomic ratio was calculated from thickness ratio by concentration factor. It has been successfully confirmed that the predicted atomic ratio was in good agreement with the actual measured value by ICP-MS analysis.

• Resources Recycling
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• v.27 no.2
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• pp.32-37
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• 2018

This study was conducted as a preliminary study for the recycling of palladium and palladium oxide. In this study, thermodynamic equations for the formation of palladium oxide (PdO) are established. Palladium chloride is dissolved into hydrochloric acid to generate a palladium chloride solution. Nanosized palladium oxide powder with an average particle size below 30 nm were generated from this raw material solution by means of a spray pyrolysis process. The palladium oxide particles were composed of a single solid crystal. The results of XRD analysis showed that only a PdO phase of the generated powder was formed. And, the specific surface area of the generated palladium powder was approximately $32m^2/g$.

• Resources Recycling
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• v.27 no.2
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• pp.24-31
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• 2018

In this study, waste ITO target is dissolved into hydrochloric acid to generate a complex indium-tin chloride solution. Nano sized ITO powder with an average particle size below 30 nm are generated from these raw material solutions by spray pyrolysis process. Also, in this study, thermodynamic equations for the formation of indium-tin oxide (ITO) are established. As the reaction temperature increased from $800^{\circ}C$ to $900^{\circ}C$, the proportion and size of the spherical droplet shape in which nano sized particles aggregated gradually decreased, and the surface structure gradually became densified. When the reaction temperature was $800^{\circ}C$, the average particle size of the generated powder was about 20 nm, and no significant sintering was observed. At a reaction temperature of $900^{\circ}C$, the split of the droplet was more severe than at $800^{\circ}C$, and the rate of maintenance of the initial atomized droplet shape decreased sharply. The average particle size of the powder formed was about 25 nm. The ITO particles were composed of single solid crystals, regardless of reaction temperature. XRD analysis showed that only the ITO phase was formed. Remarkably, the specific surface area decreased by about 30% as the reaction temperature increased from $800^{\circ}C$ to $900^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1278-1282
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• 2004

수열처리법으로 nano-sized $CeO_2$ 입자를 $Al_3O_3$ 입자의 표면에 균일하게 코팅하여 $AL_2O_3/O_2$ composite 연마 입자를 제조하었다. 제조된 $Al_2O_3\CeO_2$ composite 입자의 뭍성을 TEM, XRD, zeta potential analyzer 및 particle size analyzer로 측징하였다. $Al_2O_3/CeO_2$ composite 입자와 구성된 슬러리와 비교 시료로서 $Al_2O_3$와 $CeO_2$ 입자를 혼합한 슬러리를 사용하여 thermal oxide film에 대한 연마특성을 평가하였다. 연마슬러리에 포함된 $A1_2O_3/CeO_2$ composite 입자와 $Al_2O_3$와 $CeO_2$ 혼합입자에서 나노 크기의 세리아 입자가 sub-micron 크기의 알루미나 입자의 표면에 균일하게 코팅되므로서 $Al_2O_3$ 단일 성분의 슬러리에 비해 removal rate(RR)는 106 nm/min, WIWNU는 $8\sim9%$, roughness는 $2.6{\AA}$의 향상된 연마 특성을 나타내었다. 알루미나 입자의 불규칙한 형상 때문에 $Al_2O3/CeO_2$ composite 슬러리와 $Al_2O_3$ 와 $CeO_2$ 혼합슬러리의 연마 특성이 비슷한 수준을 나타내었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.59-59
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• 2009

현재 CMP분야는 광역 평탄화 반도체 소자의 집적화 및 소형화가 진행됨에 따라서 CMP 공정의 중요성은 날로 성장하고 있다. 하지만 이러한 CMP공정은 불가피하게도 scratch, pit, CMP residue와 같은 defect들을 발생시키고 있으며, 점점 선폭이 작아짐에 따라, 이러한 defect들이 반도체 수율에 미치는 영향은 심각해지고 있다. Defect들 중에 특히 scratch는 반도체에 치명적인 circuit failure를 일으키게 된다. 또한 반도체 내구성과 신뢰성을 감소시키게 되고, 누전전류를 증가시키는 등 바람직하지 못한 현상들이 생기게 된다. 본 연구에서는 scratch 와 같은 deflect들을 효율적으로 검출, 분석하고, scratch를 감소시키는데 그 목적이 있다. 본 실험을 위해 8" TEOS wafer와 commercial oxide slurry 및 friction polisher (Poli-500, G&P tech., Korea)를 사용하여 CMP 공정을 진행하였으며, CMP 공정조건은 각각 80rpm/80rpm/1psi(Platen speed/Head speed/Pressure)에서 1분 동안 연마를 한 후 scratch 발생 경향을 살펴보았다. CMP 후 wafer위에 오염되어 있는 slurry residue들을 제거하기 위해 SC-1, HF 세정을 이용하여 최적화된 post-CMP 공정기술을 제안하였다. Scratch 검출 및 분석을 위해 wafer surface analyzer (Surfscan 6200, Tencor, USA)와 optical microscope (LV100D, Nicon, Japan)를 사용하였다. CMP 공정 변수들에 따른 scratch 발생정도를 비교하였으며, scratch 발생 요인들에 따른 scratch 형태 및 발생정도를 살펴보았다. 최적화된 post-CMP 세정 조건은 메가소닉과 함께 SC-1 세정을 실시하여 slurry residue들을 제거한 후, HF 세정을 실시하여 잔여 오염물들을 제거하고 검출이 용이하도록 scratch를 확장시킬 수 있도록 제안하였으며, 100%의 particle removal efficiency (PRE)를 얻을 수 있었다. 실제 CMP 공정후 post-CMP 세정 단계별 scratch 개수를 측정한 결과, SC-1 세정 후 약 220개의 scratch가 검출되었으며, 검출되지 않았던 scratch가 HF 세정 후 확장되어 드러남에 따라 약 500개의 scratch 가 검출되었다.