• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.12
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• pp.59-68
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• 1999

The timing characteristics of an ASIC are analyzed based on the propagation delays of each gate and interconnect wire. The gate delay can be modeled using the two-dimensional delay table whose index variables are the input transition time and the output load capacitance. The AWE technique can be adopted as an algorithm to compute the interconnect delay. Since these delays are affected by the interaction to the two-dimensional delay table and the AWE technique. A method to model this effect has been proposed through the effective capacitance and the gate driver model under the assumption of single driving gate. This paper presents a new technique to handle the multiple CMOS gates driving interconnect wire by extending previous approach. This technique has been implemented in C language and applied to several interconnect circuits driven by multiple CMOS gates. In most cases, we found a few tens of speed-up and only a few percents of errors in computing both of gate and interconnect delays, compared to SPICE.

• ETRI Journal
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• v.33 no.3
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• pp.462-465
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• 2011

A millimeter-wave (mm-wave) high-linear low-noise amplifier (LNA) is presented using a 0.18 ${\mu}m$ standard CMOS process. To improve the linearity of mm-wave LNAs, we adopted the multiple-gate transistor (MGTR) topology used in the low frequency range. By using an MGTR having a different gate-source bias at the last stage of LNAs, third-order input intercept point (IIP3) and 1-dB gain compression point ($P_{1dB}$) increase by 4.85 dBm and 4 dBm, respectively, without noise figure (NF) degradation. At 33 GHz, the proposed LNAs represent 9.5 dB gain, 7.13 dB NF, and 6.25 dBm IIP3.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.4 s.346
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• pp.23-30
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• 2006

This paper describes the short-channel effect(SCE), corner effect of nano-scale MuGFETs(Multiple-Gate FETs) by three-dimensional simulation. We can extract the equivalent gate number of MuGFETs(Double-gate=2, Tri-gate=3, Pi-gate=3.14, Omega-gate=3.4, GAA=4) by threshold voltage model. Using the extracted gate number(n) we can calculate the natural length for each gate devices. We established a scaling theory for MuGFETs, which gives a optimization to avoid short channel effects for the device structure(silicon thickness, gate oxide thickness). It is observed that the comer effects decrease with the reduction of doping concentration and gate oxide thickness when the radius of curvature is larger than 17 % of the channel width.

• Journal of Advanced Navigation Technology
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• v.21 no.6
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• pp.659-665
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• 2017

In this paper, a low complexity fast Fourier transform(FFT) processor is proposed for multiple input multiple output(MIMO) systems. The IEEE 802.11ac standard has been adopted along with the demand for a system capable of high channel capacity and Gbps transmission in order to utilize various multimedia services using a wireless LAN. The proposed scalable FFT processor can support the variable length of 64, 128, 256, and 512 for 8x8 antenna configuration as specified in IEEE 802.11ac standard with MIMO-OFDM scheme. By reducing the required number of non-trivial multipliers with mixed-radix(MR) and multipath delay commutator(MDC) architecture, the complexity of the proposed FFT processor was dramatically decreased. Implementation results show that the proposed FFT processor can reduced the logic gate count by 50%, compared with the radix-2 SDF FFT processor. Also, compared with the 8-channel MR-2/2/2/4/2/4/2 MDC processor and 8-channel MR-2/2/2/8/8 MDC processor, it is shown that the gate count is reduced by 18% and 17% respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.335-338
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• 1998

Ferroelectric Sr$_2$(Nb,Ta)$_2$O$_{7}$ (SNTO) thin films were prepared by chemical solution deposition processes. SNTO thin films were spin-coated on Pt/Ti/SiO$_2$/(100)Si substrates. After multiple coating, dried thin films were heat-treated for decomposition of residual organics and crystallization. B site-rich impurity phase, i.e. [Sr(Nb,Ta)$_2$O$_{6}$], was found after annealing, where its appearance was dependent on process temperature indicating the possible reaction with substrate. Dielectric and other relevant electrical properties were measured and the results showed a little possibility in ferroelectric gate random access memory devices.s.s.

• The Transactions of the Korean Institute of Power Electronics
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• v.26 no.6
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• pp.429-436
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• 2021

The design of a gate driver power supply for a three-phase inverter using a silicon carbide (SiC) MOSFET. The requirements for the power supply circuit of the gate driver for the SiC MOSFET are investigated, and a flyback converter using multiple transformers is used to make the four isolated power supplies. The proposed method has the advantage of easily constructing the power supply circuit in a limited space as compared with a multi-output flyback converter using a single core. The power supply circuit for the three-phase SiC MOSFET inverter for driving an AC motor is designed and implemented. The operation and validity of the implemented circuit are verified through simulations and experiments.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.379-379
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• 2013

본 논문에서는 Normal ink jetting 공법으로 OTFT를 제작할 때 coffee stain effect에 의해서 반도체 소자의 특성이 저하되는 것을 극복하기 위해서 동일한 위치에 동일한 부피로 Droplet을 형성하는 Multiple ink jetting 공법을 통해 TIPS pentacene 결정의 Morphology와 전기적 특성이 어떻게 변화하는지 알아 보았다. Multiple ink jetting의 drop 횟수가 증가할수록 coffee stain effect에 의해서 형성된 가운데 영역의 Dendrite grain이 점점 작아지다가 7 Drops 이후로는 Big grain 만 남게 되었다. Active layer의 표면 Roughness는 drop 횟수가 증가할수록 낮아지다가 일정 count 이후로는 다시 높아지는 것을 확인할 수 있었다. 전계 이동도(mobility)는 drop 횟수가 증가할수록 커지다가 일정 count 이후로는 saturation되는 것을 확인할 수 있었다. Multiple ink jetting에 의해서 만들어진 OTFT 소자의 전계 이동도(mobility)는 1 drop과 10 drops에서 각각 0.0059, 0.036 cm2/Vs 로 6배 정도 차이가 있었다. 이것은 첫 drop에 의해 만들어진 가운데 Dendrite grain 영역이 Multiple ink jetting을 반복하면서 점점 작아지게 되어 사라지고 두꺼운 Grain 영역만 남게 된 것으로 판단된다. Vth 와 On/Off ratio는 1 drop과 10 drops에서 각각 -3 V, -2 V 그리고 $3.3{\times}10^3$, $1.0{\times}10^4$를 보였다. OTFT의 substrate로 Flexible한 polyethersulfone (PES) 기판을 사용하였고, 절연체로 Spin coating된 Poly-4-vinylphenol (PVP)가 사용되었으며, Gate 및 Source/Drain 전극은 Au를 50 nm 두께로 증착하였다. Channel의 width와 length는 각각 100 um, 40 um 였고, Gate 전극 위에 Active layer를 형성한 Bottom gate 구조로 제작되었다. Ink jet으로 제작된 TIPS pentacene의 결정성은 x-ray diffraction (XRD)와 광학 현미경으로 분석하였고 Thickness profile은 알파스텝 측정기를 이용하였으며, OTFT의 전기적 특성은 Keithley-4,200을 사용하여 측정하였다.

• The Journal of Korean Association of Computer Education
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• v.11 no.2
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• pp.65-78
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• 2008

Many digital logic circuit simulators have been developed for the education on the experiments of digital logic circuits for college or high school students. But the existing simulators have some constraints on the number of inputs of gate, on the display of gate and wire states, and on the number of logic diagrams to be simulated. 1n this paper, we propose a simulator XSIM(eXpandable digital logic circuit SIMulator) which mitigates the constraints and allows multiple diagrams for large scale logics. It is expected that the multiple diagrams on large logics are helpful for team-teaching in school.

• KIPS Transactions on Computer and Communication Systems
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• v.2 no.3
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• pp.103-110
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• 2013

Logical Effort [1, 2] is a simple hand-calculated method that measures quick delay estimation. It has the advantage of reducing the design cycle time. However, it has shortcomings in designing a path for minimum area or power under a fixed-delay constraint. The method of overcoming the shortcomings is shown in [3], but it is constrained for a single logical path. This paper presents an advanced gate sizing method in multiple logical paths based on the equal delay model. According to the results of the simulation, the power dissipation for both the existing logical effort method and proposed method is almost equal. However, compared with the existing logical effort method, it is about 52 (%) more efficient in space.

• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.17-20
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• 2006

This paper presents of a new type of memory cell that could potentially replace both DRAM and flash memory. The proposed device cell operates by sensing the state of about 1,000 electrons trapped between unique insulating barriers in the channel region of the upper transistor. These electrons are controlled by a side gate on the transistor, and their state in turn controls the gate of the larger transistor, providing signal gain within the memory cell. It becomes faster and more reliable memory with lower operation voltage. Moreover, the use of a multiple tunnel junction (MTJ) fur the vertical transistor can significantly improve the data retention and operation speed.