A Study of Joint Reliability According to Various Cu Contents between Electrolytic Ni and Electroless Ni Pad Finish (전해Ni, 무전해 Ni pad에서의 Cu 함량에 따른 접합 신뢰성에 관한 연구)
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- Journal of the Microelectronics and Packaging Society
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- v.22 no.3
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- pp.51-56
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- 2015