• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.569-572
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• 2000

This paper presents the optimized fabrication and thermal characteristics of micro-heaters for thermal MEMS applications using a SDB SOI substrate. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10$\mu\textrm{m}$ thick silicon membrane with oxide-filled trenches in the SOI membrane rim. The micro-heater was fabricated with Pt-RTD(Resistance Thermometer Device)on the same substrate by using MgO as medium layer. The thermal characteristics of the micro-heater with the SOI membrane is 280$^{\circ}C$ at input Power 0.9 W; for the SOI membrane with 10 trenches, it is 580$^{\circ}C$ due to reduction of the external thermal loss. Therefore, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro thermal sensors and actuators.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권6호
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

• 한국전자파학회논문지
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• 제30권1호
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• pp.23-27
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• 2019

본 논문에서는 비 침습적, 비 파괴적으로 샘플의 단층구조와 단층의 미세진동을 실시간으로 동시에 영상화하는 마이크로 바이브로 토모그라피(micro vibro tomography: MVT) 시스템 개발 및 미세진동 측정 방법을 제안한다. 제안한 방법은 광 간섭 단층촬영기술(optical coherence tomography: OCT)을 기반으로 하여, 샘플의 위상변이를 이용해 마이크로 단위의 움직임을 측정하는 알고리즘을 적용한 방법이다. 본 실험에서는 고막을 모방한 라텍스 샘플에 2~5 kHz 주파수의 음파를 인가시키고, 음파에 의한 샘플의 미세진동을 제안한 MVT 시스템을 이용하여 측정하였다. 그 결과, 고막 모방 샘플의 단층구조와 미세진동을 동시에 영상화할 수 있었고, 표면부의 미세진동을 MVT 표면 진동 이미지로 프로젝팅하여 고막 모방 샘플의 전체적인 진동 형태를 관찰할 수 있었다.

• 센서학회지
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• 제7권1호
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• pp.73-82
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• 1998

실리콘 표면 미세가공에 있어서, 새로 개발된 HF 기상식각 공정은 미소구조체들을 띄우는데 매우 효과적임을 입증하였다. 무수 불화수소와 메탄올을 이용한 기상식각 시스템에 대한 기능 및 특성을 기술하였고, 실리콘 미세구조체룰 띄우기 위한 회생층 산화막들의 선택적 식각특성이 고찰되었다. 구조체층으로는 인이 주입된 다결정실리콘이나 SOI 기판의 단결정실리콘을 사용하였다. 회생층으로는 TEOS 산화막, 열산화막, 저온산화막을 사용하였다. 기존 습식식각과 비교해 볼 때, 공정에 기인된 고착현강이나 잔류물질이 없는 미세구조체를 성공적으로 제작하였다.

• Transactions on Electrical and Electronic Materials
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• 제7권4호
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• pp.157-162
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• 2006

Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.

• 한국구조물진단유지관리공학회 논문집
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• 제4권1호
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• pp.121-129
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• 2000

In general. service life of the sea-shore concrete structures is largely influenced by the corrosion of reinforcing steel due to the chloride contamination, and the penetration of chloride ions into concrete is governed by concrete condition state as a micro-structure. In this study, characteristics of chloride diffusion in concrete are analyzed in accordance with the mixing properties and durability of concrete, by considering the facts that micro-structure of concrete varies with the mixing properties and can indirectly be analyzed by using the durability test. In order to predict the service life of existing concrete structures, chloride diffusion equation for the concrete structures under various service conditions and the major parameters used in that equation are formulated as the mathematical models. Based on the results of chloride diffusion analysis in accordance with the mixing properties and durability of concrete and mathematical models formulated in this study, a prediction system is developed to predict the corrosion initiation of reinforcing steel in the sea-shore concrete structures.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.615-618
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• 2005

All over the world, many kinds of micro-actuators were already developed for various applications. The actuators are using various principles such as electromagnetic, piezoelectric and thermopneumatic etc. The most of the micro-actuators have been made using 2D based MEMS technology. In these actuators, it is difficult to drive 3-dimensional motion. This characteristic gives the limit of actuator application. However, micro-stereolithography technology has made it possible to fabricate freeform three-dimensional microstructures. In this technology, 2-dimensional micro-shape layer is cumulated on the other layers. This layer-by-layer process is the main principle to fabricate 3-dimensioal micro-structures. In this research, a micro-bellows actuator that is vertically moving was developed using the micro-stereolithography technology. When pressure was applied into the bellows, a non-contact actuating motion is generated. For actuation experiment, syringe pump and laser interferometer were used for applying pressure and measuring the displacement. Several hundreds micro-scale actuation was observed. And, to demonstrate the feasibility of proposed actuation principle, in this research, a micro-gripper was developed using half-bellows structure.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집E
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• pp.169-174
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• 2001

This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

• 대한기계학회논문집A
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• 제30권7호
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• pp.849-856
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• 2006

In this paper, fabric composite draping on hemisphere moulds were studied to find out the deformation behaviour of micro-tow structures of fabrics during draping and thermoforming. Aluminium and PVC foams were used to fabricate the hemisphere moulds for draping tests. In order to observe the local tow deformation pattern during the draping several specimens for microscopic observation were sectioned from the draped hemisphere structures. The effect of forming condition and mould properties on tow deformation was investigated by the microscopic observation of the tow parameters such as crimp angle. Normalization scheme was performed to compare tow parameter variations with different forming conditions. Stress-strain .elations of two different PVC foams (HT70 and HT110) were tested to investigate the effect of foam property on the micro-tow deformation during forming.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.376-377
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• 2006

Chemical Mechanical Planarization (CMP) has emerged as an enabling technology for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). Recently, multi-level structures have been also widely used m the MEMS device such as micro engines, pressure sensors, micromechanical fluid pumps, micro mirrors and micro lenses. Especially, among the thin films available in IC technologies, polysilicon has probably found the widest range of uses in silicon technology based MEMS. This paper presents the characteristic of polysilicon CMP for multi-level MEMS structures. Two-step CMP process verifies that is possible to decrease dishing amount with two type of slurries characteristics. This approach is attractive because two-step CMP process can be decreased dishing amount considerably more then just one CMP process.