Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Consumable Approaches of Polysilicon MEMS CMP

  • Park, Sung-Min (School of Mechanical Engineering, Pusan National University) ;
  • Jeong, Suk-Hoon (School of Mechanical Engineering, Pusan National University) ;
  • Jeong, Moon-Ki (School of Mechanical Engineering, Pusan National University) ;
  • Park, Boum-Young (School of Mechanical Engineering, Pusan National University) ;
  • Jeong, Hae-Do (School of Mechanical Engineering, Pusan National University) ;
  • Kim, Hyoung-Jae (Department Research & Development, G&P Technology)
  • Published : 2006.08.01
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Abstract

Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.

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References

  1. D. L. Hetherington and J. J. Sniegowski, 'Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing', Presented at the International Symposium on Optical Science, Engineering, and Instrumentation, SPIE's 43rd Annual Meeting, San Diego, CA, p. 58, 1998
  2. Sadiku, M., 'MEMS', Potentials, IEEE, Vol. 21, Iss. 1, p. 4, 2002
  3. K. E. Petersen, 'Silicon as a mechanical material', member IEEE, Vol. 70, No.5, p. 420, 1982
  4. G. Zwicker, 'MEMS fabrication using CMP', Presentation at the 10th CMP users Meeting, Munich, www.isit.fhg.de, p. 21, 2003
  5. SKW Associates, Inc. Characterization Products of Chemical Mechanical Polishing, SKW Associates. Last Updated: February 28, 2000
  6. F. Ayazi and K. Najafi, 'Design and fabrication of a high-performance polysilicon vibrating ring gyroscope', Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop, p. 25, 1998