• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• Structural Monitoring and Maintenance
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• v.6 no.3
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• pp.173-190
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• 2019

Steel-confined reinforced concrete (SCRC) columns feature highly complex and invisible mechanisms that make damage evaluation and pattern recognition difficult. In the present article, the prevailing acoustic emission (AE) technique was applied to monitor and evaluate the damage process of steel-confined RC columns in a quasi-static test. AE energy-based indicators, such as index of damage and relax ratio, were proposed to trace the damage progress and quantitatively evaluate the damage state. The fuzzy C-means algorithm successfully discriminated the AE data of different patterns, validity analysis guaranteed cluster accuracy, and principal component analysis simplified the datasets. A detailed statistical investigation on typical AE features was conducted to relate the clustered AE signals to micro mechanisms and the observed damage patterns, and differences between steel-confined and unconfined RC columns were compared and illustrated.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.217-224
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• 2011

of materials and simplification of process. Micro-blasting is one of the promising method for recycling of waste wafer due to their simple and low cost process. Therefore, in this paper, we make recycling wafer through the micro-blaster. A surface etched by micro-blaster forms particles, cracks and pyramid structure. A pyramid structure formed by micro-blaster has a advantage of reflectivity decrease. However, lifetime of minority carrier is decreased by particles and cracks. In order to solve this problems, we carried out the DRE(Damage Romove Etching). There are two ways to DRE process ; wet etching, dry etching. After the DRE process, we measured reflectivity and lifetime of minority carrier. Through these results, we confirmed that a wafer recycled can be used in solar cell.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.251-255
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• 2003

This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate super-elastic alloy based micro gripper. It is tested to present improvement of mechanical performance. For integration of force sensor on the micro gripper, the sensor design based on the piezoelectric polymer PVDF film and fabrication process are presented. The calibration and performance test of force sensor integrated micro gripper are experimentally carried out. The force sensor integrated micro gripper is applied to perform fine alignment tasks of micro opto-electrical components. It successfully supplies force feedback to the operator through the haptic device and plays a main role in preventing damage of assembly parts by adjusting the teaching command.

• Proceedings of the Korea Concrete Institute Conference
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• 2006.11a
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• pp.253-256
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• 2006

The HPFRCCs show the multiple crack and damage tolerance capacity due to the interfacial bonding of the fibers to the cement matrix. For practical application, it is needed to investigate the fractural behavior and of HPFRCCs and understand the micro-mechanism of cement matrix with reinforcing fiber. The objectives of this paper are to examine the compressive behavior, fracture and damage process of HPFRCC by acoustic emission technique. Total four series were tested, and the main variables were the hybrid type, polyethylene (PE) and steel cord (SC), and fiber volume fraction. The damage progress by compressive behavior of the HPFRCCs is characteristic for the hybrid fiber type and volume fraction. And from acoustic emission (AE) parameter value, it is found that the second and third compressive load cycles resulted in successive decrease of the ring-down count rate as compared with the first compressive load cycle.

• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.291-296
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• 2010

Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: $10{\mu}m$ sized $Al_2O_3$ powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/$HNO_3$/$CH_3COOH$) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.

• Transactions on Electrical and Electronic Materials
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• v.6 no.3
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• pp.87-90
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• 2005

$SiO_2$ via-hole etching with a high aspect ratio is a key process in fabricating ULSI devices; however, accumulated charge during plasma etching can cause etching stop, micro-loading effects, and charge build-up damage. To alleviate this concern, charge-up damage sensor was fabricated for the ultimate goal of real-time monitoring of accumulated charge. As an effort to reach the ultimate goal, fabricated sensor was used for electrical potential measurements of via holes between two poly-Si electrodes and roughly characterized under various plasma conditions using statistical design of experiment (DOE). The successful identification of potential difference under various plasma conditions not only supports the evidence of potential charge-up damage, but also leads the direction of future study.

• Journal of the Korea Institute of Military Science and Technology
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• v.17 no.1
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• pp.82-89
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• 2014

The damage in germanium (Ge) optical window irradiated by a near-infrared continuous wave (CW) laser was studied. Laser-induced heating and melting process were surveyed, and the specific laser power and the irradiance time to melt were estimated by numerical simulation. The experiments were also carried out to investigate the macro and micro structure change on Ge window. Results showed that the surface deformation was formed by melting and resolidification process, the damaged surface had a polycrystalline phase, and the transmittance as an optical performance factor in mid-infrared region was decreased. We confirmed that an abnormal polycrystalline phase and surface deformation effect such as hillock formation and roughness increase reduced the transmittance of Ge window and were the damage mechanism of CW laser induced damage on Ge window.

• Journal of the Society of Naval Architects of Korea
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• v.29 no.4
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• pp.179-192
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• 1992

An elasto-plastic-damage constitutive model for ductile materials was derived under the framework of thermodynamic approach of contimuum damage mechanics(CDM) in which internal irreversible thermodynamic change of micro-structure of materials such as plastic deformation and damage evolution were considered as thermodynamic state variables. New constitutive model can predict not only the elasto-plastic behaviors but also the sequential degradation process of ductile materials more rationally.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.184-196
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• 2004

An Eulerian finite element analysis for the steady state rolling process is addressed. This analysis combines the crystal plasticity theory fur texture development as well as the continuum damage mechanics for growth of micro voids. Although an Eulerian analysis for steady state rolling has many advantages, it needs an initial assumption about the shape of control volume. However, the assumed control volume does not match the final shapes. To effectively predict the correct shape in an assumed control volume, a free surface correction algorithm and a streamline technique are introduced. Applications to plate rolling, clad rolling, and shape rolling will be given and the results will be discussed in detail.