• 제목/요약/키워드: micro system technology

검색결과 1,369건 처리시간 0.024초

마이크로 칼럼의 전자 방출원 위치 오차의 영향 (Effect of the Off-axis distance of the Electron Emitting Source in Micro-column)

  • 이응기
    • 반도체디스플레이기술학회지
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    • 제9권1호
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    • pp.17-21
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    • 2010
  • Currently miniaturized electron-optical columns find their way into electron beam lithography systems. For better lithography process, it is required to make smaller spot size and longer working distance. But, the micro-columns of the multi-beam lithography system suffer from chromatic and spherical aberration, even when the electron beam is exactly on the symmetric axis of the micro-column. The off-axis error of the electron emitting source is expected to become worse with increasing off-axis distance of the focusing spot. Especially the electron beams far from the system optical axis have a non-negligible asymmetric intensity distribution in the micro-column. In this paper, the effect of the off-axis e-beam source is analyzed. To analyze this effect is to introduce a micro-column model of which the e-beam emitting source is aligned with the center of the electron beam by shifting them perpendicular to the system optical axis. The presented solution can be used to analysis the performance of the multi-electron-beam system. The performance parameters, such as the working distances and the focusing position are obtained by the computational simulations as a function of the off-axis distance of the emitting source.

진공 척을 이용한 마이크로 LED 대량 전사 공정 개발 (Micro-LED Mass Transfer using a Vacuum Chuck)

  • 김인주;김용화;조영학;김성동
    • 마이크로전자및패키징학회지
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    • 제29권2호
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    • pp.121-127
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    • 2022
  • 마이크로 LED는 크기가 100 ㎛ 이하인 LED 소자로 기존 LED에 비해 해상도, 밝기 등 여러 면에서 우수한 성능을 보일 뿐 아니라 유연 디스플레이, VR/AR 등 다양한 분야에 적용이 가능하다. 마이크로 LED 디스플레이를 제작하기 위해선 LED 웨이퍼로부터 최종기판으로 마이크로 LED를 옮기는 전사 공정이 필수적이며, 본 연구에서는 진공 척을 이용하여 마이크로 LED를 고속 대량 전사하는 방식을 제안하고 이를 검증하였다. MEMS 기술을 이용한 PDMS 마이크로 몰딩 공정을 통해 진공 척을 제작하였으며, PDMS 몰딩 공정을 제어하기 위해 댐 구조를 이용한 스핀 코팅 공정을 성공적으로 적용하였다. 솔더볼을 이용한 진공 척 구동 실험을 통해 진공 척을 이용한 마이크로 LED의 대량 전사 가능성을 확인하였다.

Design of an FPGA-based IP Using SPARTAN-3E Embedded system

  • Moon, Sang-Ook
    • Journal of information and communication convergence engineering
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    • 제9권4호
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    • pp.428-430
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    • 2011
  • Recent semiconductor design technology has been substantially developed that we can design a micro-system on a chip as well as implementing an application specific IC in an FPGA. SPARTAN-3E developed by Xilinx is equipped with an FPGA that holds as much as 500 thousand transistors connected with MicroBlaze softcore microprocessor bus system. In this paper, we discuss a method of implementing an embedded system using the SPARTAN-3E. We also explain the peripherals and the bus protocols and the expandability of this kind of embedded systems.

마이크로 압축성형 공정을 이용한 굴절/회절용 마이크로 광부품 성형 (Fabrication of Refractive/Diffractive Micro-Optical Elements Using Micro-Compression Molding)

  • 문수동;안수호;강신일
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2001년도 추계학술대회 논문집
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    • pp.200-203
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    • 2001
  • Micromolding methods such as micro-injection molding and micro-compression molding are most suitable for mass production of plastic micro-optics with low cost. In this study, plastic micro-optical components, such as refractive microlenses and diffractive optical elements(DOEs) with various grating patterns, were fabricated using micro-compression molding process. The mold inserts were made by ultrapricision mechanical machining and silicon etching. A micro compression molding system was designed and developed. Polymer powders were used as molded materials. Various defects found during molding were analyzed and the process was optimized experimentally by controlling the governing process parameters such as histories of mold temperature and compression pressure. Mim lenses of hemispherical shape with $250{\mu}m$ diameter were fabricated. The blazed and 4 stepped DOEs with $24{\mu}m$ pitch and $5{\mu}m$ depth were also fabricated. Optical and geometrical properties of plastic molded parts were tested by interferometric technique.

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진동 하중을 이용한 마이크로 부품 및 표면 패턴 성형 기술 (Micro Forming of Metallic Micro-parts and Surface Patterns by Employing Vibrational Load)

  • 나영상;이종훈;이원식
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 춘계학술대회 논문집
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    • pp.64-67
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    • 2009
  • Vibrational micro-forming of pyramidal shape patterns was conducted for an Al superplastic alloy, Al 5083 and a Zr-based bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$. A vibrational micro-forming system was specially designed for generating vibrational load by combining a PZT actuator with a signal generator. Single crystal Si micro dies with wet-etched pyramidal patterns were used as master dies for vibrational micro-forming. The micro-formed pattern height was increasing with increasing the frequency of the vibrational load. In particular, the vibrationally-microformed pattern height was similar or even higher than the statically-microformed pattern height when the load frequency exceeded about 125 kHz. It was also observed that the crystal grains affect the surface quality of the microformed pattern and the distribution of the pattern height in the die cavity array.

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Energy Management of a Grid-connected High Power Energy Recovery Battery Testing System

  • Zhang, Ke;Long, Bo;Yoo, Cheol-Jung;Noh, Hye-Min;Chang, Young-Won
    • Journal of Electrical Engineering and Technology
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    • 제11권4호
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    • pp.839-847
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    • 2016
  • Energy recovery battery testing systems (ERBTS) have been widely used in battery manufactures. All the ERBTS are connected in parallel which forms a special and complicated micro-grid system, which has the shortcomings of low energy recovery efficiency, complex grid-connected control algorithms issues for islanded detection, and complicated power circuit topology issues. To solve those shortcomings, a DC micro-grid system is proposed, the released testing energy has the priority to be reutilized between various testing system within the local grid, Compared to conventional scheme, the proposed system has the merits of a simplified power circuit topology, no needs for synchronous control, and much higher testing efficiency. The testing energy can be cycle-used inside the local micro-grid. The additional energy can be recovered to AC-grid. Numerous experimental comparison results between conventional and proposed scheme are provided to demonstrate the validity and effectiveness of the proposed technique.

멀티센서를 이용한 마이크로 절삭 공정 모니터링 (The Cutting Process Monitoring of Micro Machine using Multi Sensor)

  • 신봉철;하석재;강민형;허영무;윤길상;조명우
    • 소성∙가공
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    • 제18권2호
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    • pp.144-149
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    • 2009
  • Recently, the monitoring technology of machining process is very important to improve productivity and quality in manufacturing filed. Such monitoring technology has been performed to measurement using vibration signal, acoustic emission signal and tool dynamometer. However, micro machining is limited small-scale parts machining because micro tool is very small and weakness to generate signal in micro machining process. Therefore, this study has efficient sensing technology for real monitoring system in micro machine that is proposed to supplement a disadvantage of single-sensor by multi sensor. From experimental result, it was evaluated tool wear and cutting situation according to repetitive slot cutting condition and changing cutting condition, and it was performed monitoring spindle rpm and condition according to compare acceleration signal with current signal.

Micro Bonding Using Hot Melt Adhesives

  • Bohm, Stefan;Hemken, Gregor;Stammen, Elisabeth;Dilger, Klaus
    • 접착 및 계면
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    • 제7권4호
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    • pp.28-31
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    • 2006
  • Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.

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The Fabrication of Micro-Heaters with Low-Power Consumption Using SOI and Trench Structures

  • 정귀상;홍석우
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 춘계합동학술대회 논문집
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    • pp.197-201
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    • 2002
  • This paper presents optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro electro mechanical system) applications using SOI and trench structures. The micro-heaters are based on a thermal measurement principle and contains thermal isolation regions of 10 ${\mu}m$-thick Si membranes consisting of oxide-filled trenches in the SOI membrane rim. The micro-heaters were fabricated with Pt-RTD on the same substrate via MgO buff layer between Pt thin-film and $SiO_2$ layer. The thermal characteristics of micro-heater with trench-free SOI membrane structure was $280^{\circ}C$ at input power 0.9 W; in the presence of 10 trenches, it was $580^{\circ}C$ due to reduction of the external thermal loss. Therefore, a micro-heater with trenches in SOI membrane rim structure provides a powerful and versatile alternative technology for enhancing the performance of micro-thermal sensors and actuators.

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Al5083 초소성 합금과 Zr-BMG의 Cavity 위치에 따른 마이크로 성형연구 (A Study on the Micro Forming of Al-based Superplastic Alloy and Zr-BMG for the Cavity Position)

  • 손선천;박규열
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2008년도 춘계학술대회 논문집
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    • pp.258-262
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    • 2008
  • Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). In this study, the micro forming property was studied, using Al5083 superplastic alloy with micro grain, suitable for the micro forming process and Zr-BMG amorphous with pseudo-superplastic phenomena in the supercooled liquid state. Micro forming experiments under stastic load status showed that distortion by slip and spin of the grain system and slip inside the grain was observed in the Al5083 superplastic alloy. In case of Zr-BMG, because there is no grain, the distribution of the forming property was similar to the load distribution between punch and metal.

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