• Design & Manufacturing
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• 제2권5호
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• pp.43-47
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• 2008

Micro Electrochemical Machining(Micro ECM) has traditionally been used in highly specialized fields such as those of the aerospace and defense industries. It is now increasingly being applied in other industries where parts with difficult-to-cut material, complex geometry and tribology such as compute. hard disk drive(HDD) are required. Pulse Electrochemical Micro-machining provides an economical and effective method for machining high strength, high tension, heat-resistant materials into complex shapes such as turbine blades of titanium and aluminum alloys. Usually aluminum alloys are used bearings to hard disk drive in computer. In order to apply aluminum alloys to bearing used in hard disk drive, this paper presents the characteristics of Micro ECM for aluminum alloy.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.103.1-103
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• 2001

This paper presents the development of a micro gripper for grasping miniature sized parts in micro-assembly. Particularly, we have paid attention to the problem of manipulating objects of a well defined size range: the one between 1 mm and 0.1mm. In fact, objects larger than 1 mm can be easily handled by conventional precise grippers, while objects smaller than 1 $\mu\textrm{m}$ can be manipulated with special tools like AFM or STM. In this range, we can distinguish between mechanical and biological objects. We have focused our gripping research on the micro mechanical objects. We started from a f degree of freedom planar configuration. The structure of the micro gripper was a type of the elastic flexure hinge and was fabricated in ...

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국제학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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• pp.964-968
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• 1988

In mechanical systems in which the dynamics of armatures is dominated by electrostatic forces, motions will generally be unstable. This paper deals with the control problems of this kind of micro electrostatic device systems. In these systems, the mass of micro mechanical parts is so small that the inertia term in the equation of motion is negligible. However, nonlinear terms, such as friction and driving force, become dominant. The purpose of this paper is to realize the stable motion without delay and, overshoot etc. A micro-mechanical system used in this paper consists of a plane wafer with striped electrodes converted with an insulation layer and thin cylindrical roller is placed over on it. The performance of motions is confirmed by some simulations.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.844-847
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• 2001

The application of laser direct etching has been discussed, and believed that the process is a very powerful method for micro machining. This study is focused on the micro patterning technology using laser direct etching process with no chemical damage of the material surface. A new introduced concept of energy synergy effect for surface micro machining is the combination of chemically ion reaction and laser thermal process. The etchant can't etch the material in room temperature, and used Ar laser has not power enough to machine. But, the machining is occurred in local area of the material by the combined energy. Using this process, the material is especially prevented from chemical damage for electric property. We have tested this new concept, and achieved a line with $1{mu}m$ width. The Ar laser with 488nm wavelength was used. The material was Si(100) wafer, and etchant is KOH solution. The application and flexibility of this process is in great hopes for MEMS structures and fabrication of the micro electric device parts.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.539-542
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• 1997

We present a micro-positioning stage that has minimized geometrical error and can drive in the 4-axis. This stage divided into two parts: $Z\theta_x$ $\theta_y$, motion stage and$\theta_z$ motion stage. These stages are constructed in flexure hinges, piezoelectric actuators and displacement scnsors. The dynamic model for each stage is obtained and their FE (finite element) models are made. Using the Lagrange's equation, the motion of equation is found. Through the parametric analysis and FE analysis, sensitiv~ty of the design parameters is executed. Finally, fundamental frequencies, maximum stress, and displacement sensitivity for each stage are obtained. We expect that this micro-positioning stage be a useful micro-alignment device for various applications.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.251-255
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• 2003

This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate super-elastic alloy based micro gripper. It is tested to present improvement of mechanical performance. For integration of force sensor on the micro gripper, the sensor design based on the piezoelectric polymer PVDF film and fabrication process are presented. The calibration and performance test of force sensor integrated micro gripper are experimentally carried out. The force sensor integrated micro gripper is applied to perform fine alignment tasks of micro opto-electrical components. It successfully supplies force feedback to the operator through the haptic device and plays a main role in preventing damage of assembly parts by adjusting the teaching command.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.98-101
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• 2011

A 10 nm nano-silica was introduced to a conventional 3 ${\mu}M$ micro-silica composite to develop an eco-friendly new electric insulation material for heavy electric equipment. Thermal and mechanical properties, such as glass transition temperature (Tg), dynamic mechanical analysis, tensile and flexural strength, were studied. The mechanical results were estimated by comparing scale and shape parameters in Weibull statistical analysis. The thermal and mechanical properties of conventional epoxy/micro-silica composite were improved by the addition of nano-silica. This was due to the increment of the compaction via the even dispersion of the nano-silica among the micro-silica particles.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.533-534
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• 2006

Micro pyramid pattern and its array are designed to enhance the brightness and its uniformity of LGP which is one of key parts in LCD. The designed micro pyramid patterns are fabricated on a Si-wafer first through MEMS process and then a Ni-stamper is electro-plated from the Si pattern master. Adopting the fabricated Ni-stamper, LGPs are injection molded at different mold temperatures and the fidelity of the pattern replication is estimated for each molding conditions and pattern locations. The replicated patterns are found to have some defect such as local short shot or micro weld line which are believed to have negative effect on the performance of the LGP.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.214-217
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• 2002

Micro Surface Electrochemical Machining has traditionally been used in highly specialized fields such as those of the aerospace and defense industries. It is now increasingly being applied in other industries where parts with difficult-to-cut material, complex geometry and tribology such as compute. hard disk drive(HDD) are required. Pulse Electrochemical Micro-machining provides an economical and effective method for machining high strength, high tension, heat-resistant materials into complex shapes such as turbine blades of titanium and aluminum alloys. Usually aluminum alloys are used bearings to hard disk drive in computer. In order to apply aluminum alloys to bearing used in hard disk drive, this paper presents the characteristics of Micro Surface Electrochemical machining for aluminum alloy.

• International Journal of Fuzzy Logic and Intelligent Systems
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• 제4권3호
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• pp.316-321
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• 2004

In this paper, we have developed a new mounting head system for flip chip. The proposed head system consists of a macro/micro positioning actuator for stable force control. The macro actuator provides the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and the surface of a PCB(printed circuit board). In order to show the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed system with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions such as various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.