• Journal of the Korean Society for Precision Engineering
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• v.25 no.4
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• pp.134-139
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• 2008

A spirally arrayed nano-pattern is designed as a model pattern for the next generation optical storage media. The pattern consists off types of embossed rectangular dot, which are 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The height of the dot is designed to be 50nm. The pitch of the spiral track of the pattern is 100nm. A ER(Electron resist) master for this pattern is fabricated by e-beam lithography process. The ER is first spin-coated to be 50nm thick on a Si wafer and then the model pattern is written on the coated ER layer by e-beam. After developing this pattern written wafer in the solution, a ER pattern master is fabricated. The most conventional e-beam machine can write patterns in orthogonal way, so we made our own pattern generator which can write the pattern in circular or spiral way. This program generates the patterns to be compatible with the e-beam machine from Raith(Raith 150). To fabricate 50nm pattern master precisely, a series of experiments were done including the design compensation for the pattern size, optimization of the dose, acceleration voltage, aperture size and developing. Through these experiments, we conclude that the higher accelerating voltages and smaller aperture size are better for mastering the nano pattern which is in order of 50nm. With the optimized e-beam lithography process, a spiral arrayed 50nm pattern master adopting PMMA resist was fabricated to have dimensional accuracy over 95% compared to the designed. Using this pattern master, a metal pattern stamp will be fabricated by Ni electro plating for injection molding of the patterned plastic substrate.

• Conservation Science in Museum
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• v.23
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• pp.91-108
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• 2020

This study conducted non-destructive analyses of the material features of seven gilt-bronze crowns of Baekje Kingdom that were excavated in the Cheonan, Gongju, Seosan, Iksan, Naju, and Hapcheon areas. A typical Baekje gilt-bronze crown has a conical inner crown and an outer crown embellished with vertical ornaments on the front and the back, a tube topped with a hemispherical ornament, and other ornamentation. Diverse designs (e.g., dragon, bonghwang, flowers, and plants) were applied using a range of techniques, including repoussé, chasing, openwork, and engraving. Formal features differ among the crowns according to their period of production and site of excavation. The substrate metal of the crowns is either pure copper or mixed copper with a small amount of lead. The crowns were amalgam-plated on the surface with pure gold or gold with a small amount of silver. The crown from Okjeon Tomb No. 23 in Hapcheon in the ancient Gaya region has a high silver content, which appears to be a regional feature. In addition, this crown from Okjeon Tomb No. 23, which can be categorized as Baekje-style gilt-bronze crown, seems to be plated at most three times, while the gilt-bronze crowns found within Baekje Kingdom territory were plated once or twice.

• Nuclear Engineering and Technology
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• v.40 no.6
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• pp.459-466
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• 2008

The KSTAR Magnet Power Supply (MPS) was dedicated to the SC coil commissioning and $1^{st}$ plasma experiment as a part of the system commissioning. Although many efforts to develop large-current power supplies that are useful for high power electronic devices have been made in various application fields, such as for large metal-plating devices, there were clear discrepancies between conventional power supply technologies and that for the SC coils due to the special SC coil load conditions. Therefore, most of the power supply technologies for the SC coils were a challenge in the domestic research area due to their limited application. However, the MPS commissioning result showed that all of the hardware and controlling software operated well, and this result finally led to the success of SC coil commissioning and the KSTAR $1^{st}$ plasma experiment. This paper will describe key features of KSTAR MPS for the $1^{st}$ plasma experiment, and will also report the commissioning results of the magnet power supplies.

• Membrane Journal
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• v.8 no.3
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• pp.148-156
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• 1998

Diffusion dialysis is a membrane process driven by concentration difference using ion-exchange membranes and has been employed for many years for the acid recovery from acidic waste generated in steel, metal-refining and dectro-plating industries. Theoretically acid flux increases in propomon to the acid concentration difference. At acid concentrations higher than 3 N HCl, however, the acid flux had not increased linearly with the concentration difference. In this paper the effects of acid concentrations on diffusion dialysis for hydrochloric acid recovery and the acid transport mechanism in an anion exchange membrane were studied by membrane sorption tests and diffusion clialysis cell tests. The experimental results showed that the molecular diffusion was a major transport mechanism in a low acid concentration range and the proton leakage through an anion exchange membrane played an important role at higher acid concentrations. Also osmotic water transport and membrane dehydration retarded the transport of protons and caused the permeate flux to decrease.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.62-62
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• 2013

Magnesium alloys exhibit many attractive properties such as low density, high strength/weight ratio, high thermal conductivity, very good electromagnetic features and good recyclability. However, most commercial magnesium alloys require protective coatings because of their poor corrosion resistance. Attempts have been made to improve the corrosion resistance of the Mg alloys by surface treatments, such as chemical conversion coatings, anodizing, plating and metal coatings. Among them, chemical conversion coatings are regarded as one of the most effective and cheapest ways to prevent corrosion of Mg alloys. In this study, the effects of various $Zn^{2+}$ concentrations and pH levels on the formation of zinc phosphate conversion coatings (ZPCCs) on AZ31 magnesium alloy were investigated, and corrosion resistances of the coated samples were evaluated by immersion test and potentiodynamic polarization experiment. The corrosion resistance of the coated AZ31 samples was found to increase with increasing $Zn^{2+}$ concentration and the lowest corrosion rate was obtained for the samples coated at pH of 3.07, independent of $Zn^{2+}$ concentration. The best coatings on AZ31 were obtained at [$Zn^{2+}$] = 0.068 M and pH 3.07. At the conditions of [$Zn^{2+}$] = 0.068 M and pH 3.07, the formation and growth processes of ZPCCs on AZ31 Mg alloy are divided into four stages: formation of a dense layer, precipitation of fine crystals on the dense layer, growths of the inner and outer layers, and reorganization of outer crystalline layer.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.55-60
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• 2007

The codeposition behavior of submicron sized diamond with nickel from nickel electrolytes has been investigated. Electroplating of diamond dispersed nickel composites was carried out on a rotating disk electrode (RDE). The effects of current type and current density on the electrodeposited Ni-diamond composite coating were investigated. The effects of surfactants on the composite coating were also investigated. The hardness of coating was measured with varying electroplating conditions using Micro Vickers. As diamond was incorporated into the coating, the hardness of coating as well as the wear resistance was improved. The hardness of the coating was increased as much as 100% and the wear resistance was improved as much as 27%. The hardness of composite coating layer increased slightly at the diamond content of above 20 gpl.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Journal of Radiation Industry
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• v.8 no.3
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• pp.141-146
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• 2014

Nickel (Ni) electroplating was implemented by using a metal Ni powder in order to establish a $^{63}Ni$ plating condition on the PN junction semiconductor needed for production of beta-voltaic battery. PN junction semiconductors with a Ni seed layer of 500 and $1000{\AA}$ were coated with Ni at current density from 10 to $50mA\;cm^{-2}$. The surface roughness and average grain size of Ni deposits were investigated by XRD and SEM techniques. The roughness of Ni deposit was increased as the current density was increased, and decreased as the thickness of Ni seed layer was increased. The results showed that the optimum surface shape was obtained at a current density of $10mA\;cm^{-2}$ in seed layer with thickness of $500{\AA}$, $20mA\;cm^{-2}$ of $1000{\AA}$. Also, pure Ni deposit was well coated on a PN junction semiconductor without any oxide forms. Using the line width of (111) in XRD peak, the average grain size of the Ni thick firm was measured. The results showed that the average grain size was increased as the thickness of seed layer was increased.

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.667-673
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• 2010

Copper filling into TSV (through-silicon-via) and reduction of the filling time for the three dimensional chip stacking were investigated in this study. A Si wafer with straight vias - $30\;{\mu}m$ in diameter and $60\;{\mu}m$ in depth with $200\;{\mu}m$ pitch - where the vias were drilled by DRIE (Deep Reactive Ion Etching) process, was prepared as a substrate. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to reduce the time required complete the Cu filling into the TSV, the PPR (periodic pulse reverse) wave current was applied to the cathode of a Si chip during electroplating, and the PR (pulse-reverse) wave current was also applied for a comparison. The experimental results showed 100% filling rate into the TSV in one hour was achieved by the PPR electroplating process. At the interface between the Cu filling and Ti/ Au functional layers, no defect, such as a void, was found. Meanwhile, the electroplating by the PR current showed maximum 43% filling ratio into the TSV in an hour. The applied PPR wave form was confirmed to be effective to fill the TSV in a short time.

• Applied Chemistry for Engineering
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• v.22 no.1
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• pp.98-103
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• 2011

We prepared a counter electrode by electroplating Ni as underlayer and Pt as plating layer on the FTO glass to increase the efficiency of dye-sensitized solar cell (DSSC). We found an excellent adhesion between Ni underlayer and FTO glass when Ni underlayer was electroplated at $10mA/cm^2$ for 2 min on FTO glass. We observed Ni and Pt metal diffraction peaks by XRD analysis when Ni underlayer was electroplated at $10mA/cm^2$ for 2 min, and Pt layer was electroplated at $5mA/cm^2$ for 1 min on the Ni underlayer. Photovoltaic performance and impedance analysis of DSSCs fabricated with this counter electrode shows the highest efficiency of 5.6% and the lowest resistance of 75 ohm.