• 제목/요약/키워드: mechanical seal

검색결과 269건 처리시간 0.023초

CNT/ABS/SAN계의 분산성에 미치는 MWNT Wrapping 전처리 효과 (Effect of Wrapping Treatment on the Dispersion of MWNT in CNT/ABS/SAN Composites)

  • 김성태;박해윤;노태경;강동국;전일련;서관호
    • 공업화학
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    • 제23권4호
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    • pp.372-376
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    • 2012
  • 탄소나노튜브는 좋은 전기 기계적 및 열적 특성을 가진 복합 재료 분야에서 가장 이상적인 나노 충전재이다. 따라서 탄소나노튜브의 복합 재료는 전도성 재료, 고강도를 가지면서 가벼운 무게를 가지는 재료에 이용된다. 탄소나노튜브 복합재료의 주요 문제점은 탄소나노튜브의 나쁜 분산에 있다. 본 연구에서는 다중벽 탄소나노튜브(MWNT)를 물리적 방법으로 전처리하였다. 전처리 후, 고분자/MWNT nanocomposites는 용해 공정에 의해 분산되었다. 물리적 방법은 고분자 wrapping 방법에 의해 준비되었다. ABS/MWNT 복합 재료의 기계적 및 전기적 특성을 SAN과 함께 wrapping된 MWNT와 미처리된 MWNT와 혼합된 ABS의 속성을 비교하여 연구하였다. MWNT가 wrapping된 복합체의 인장강도는 증가하였으나 충격강도는 감소한 수치를 보였다. 전기적 물성의 향상에는 미처리시료와 비교해 볼 때 큰 효과가 없었다.

New Generation of Lead Free Solder Spheres 'Landal - Seal'

  • Walter H.;Trodler K. G.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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    • pp.211-219
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    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

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폴리아미드가 함유된 PVC졸 실란트의 물성 (II) (Properties of Polyamide Modified PVC-sol Sealants (II))

  • 이승진;김현교;박환만;조원제;하창식
    • Elastomers and Composites
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    • 제34권1호
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    • pp.53-64
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    • 1999
  • 폴리아미드 수지가 첨가된 PVC졸 실란트의 기계적, 전기적, 열적특성에 대해 연구하였다. PVC졸은 디옥틸프탈레이트로 PVC를 가소화시켜 제조된 것이다. 본 연구에서는 PVC졸 실란트에 요구되는 접착성 개선제에 관한 연구의 일환으로 polyamide를 첨가하였을 때 PVC졸 실란트의 제반물성에 미치는 영향을 연구하였다. 폴리아미드 변성 PVC졸의 인장강도는 높은 Amino 값을 갖는 폴리아미드 B의 경우가 낮은 Amino 값을 갖는 폴리아미드 A의 경우 보다 더 높게 나타났다. 인장강도는 경화온도나 경화시간이 증가할수록 증가되었다. 또한 인장강도는 폴리아미드의 종류와 경화 시간에 관계없이 충진제인 $CaCO_3$ 함량이 증가될수록 감소되었다. 유전상수는 폴리아미드의 종류에 관계없이 폴리아미드의 함량에 따라 거의 일정하게 나타난 반면, tan ${\delta}$는 폴리아미드의 함량에 따라 약간 증가되었다. 그리고 열적안정성은 Amino 값이 높은 폴리아미드 수지의 경우가 Amino 값이 낮은 폴리아미드 수지의 경우보다 우수한 것으로 나타났다.

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Relationship between hardness and plastically deformed structural steel elements

  • Nashid, Hassan;Clifton, Charles;Ferguson, George;Hodgson, Micheal;Seal, Chris;Choi, Jay-Hyouk
    • Earthquakes and Structures
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    • 제8권3호
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    • pp.619-637
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    • 2015
  • A field based non-destructive hardness method is being developed to determine plastic strain in steel elements subjected to seismic loading. The focus of this study is on the active links of eccentrically braced frames (EBFs). The 2010/2011 Christchurch earthquake series, especially the very intense February 22 shaking, which was the first earthquake worldwide to push complete EBF systems into their inelastic state, generating a moderate to high level of plastic strain in EBF active links for a range of buildings from 3 to 23 storeys in height. Plastic deformation was confined to the active links. This raised two important questions: what was the extent of plastic deformation and what effect does that have on post-earthquake steel properties? A non-destructive hardness test method is being used to determine a relationship between hardness and plastic strain in active link beams. Active links from the earthquake affected, 23-storey Pacific Tower building in Christchurch are being analysed in the field and laboratory. Test results to date show clear evidence that this method is able to give a good relationship between plastic strain and demand. This paper presents significant findings from this project to investigate the relationship between hardness and plastic strain that warrant publication prior to the completion of the project. Principal of these is the discovery that hot rolled steel beams carry manufacturing induced plastic strains, in regions of the webs, of up to 5%.

단일 식각 홀을 갖는 SiO2 희생층의 불화수소 증기 식각 (Hydrogen Fluoride Vapor Etching of SiO2 Sacrificial Layer with Single Etch Hole)

  • 김차영;노은식;신금재;문원규
    • 센서학회지
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    • 제32권5호
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    • pp.328-333
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    • 2023
  • This study experimentally verified the etch rate of the SiO2 sacrificial layer etching process with a single etch hole using vapor-phase hydrogen fluoride (VHF) etching. To fabricate small-sized polysilicon etch holes, both circular and triangular pattern masks were employed. Etch holes were fabricated in the polysilicon thin film on the SiO2 sacrificial layer, and VHF etching was performed to release the polysilicon thin film. The lateral etch rate was measured for varying etch hole sizes and sacrificial layer thicknesses. Based on the measured results, we obtained an approximate equation for the etch rate as a function of the etch hole size and sacrificial layer thickness. The etch rates obtained in this study can be utilized to minimize structural damage caused by incomplete or excessive etching in sacrificial layer processes. In addition, the results of this study provide insights for optimizing sacrificial layer etching and properly designing the size and spacing of the etch holes. In the future, further research will be conducted to explore the formation of structures using chemical vapor deposition (CVD) processes to simultaneously seal etch hole and prevent adhesion owing to polysilicon film vibration.

내부 원추형 연결형태 임플란트에서 지대주 나사머리의 좌면각도가 연결부 기계적 안정성에 미치는 영향 (Influence of bearing surface angle of abutment screw on mechanical stability of joint in the conical seal design implant system)

  • 김주현;허중보;윤미정;강은숙;허재찬;정창모
    • 구강회복응용과학지
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    • 제30권3호
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    • pp.206-214
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    • 2014
  • 목적: 내부 원추형 연결형태 임플란트에서 지대주 나사의 좌면각도가 연결부의 기계적 안정성에 미치는 영향을 알아보기 위함이다. 연구 재료 및 방법: 원추형 연결구조 티타늄 임플란트와 시멘트 유지형 지대주, 텅스텐 카바이드 코팅된 티타늄 합금 지대주 나사를 사용하였다. 좌면각도가 $45^{\circ}$$90^{\circ}$를 갖는 지대주와 지대주 나사를 제작하여 30 Ncm 조임회전력으로 지대주를 체결한 후 하중을 가하고 체결 및 하중 부여에 따른 침하량을 측정하였다(n = 5). 유압식 피로시험기에 임플란트를 고정하고 스테인리스 스틸 금속관을 지대주에 합착하였다. 이 후 반복 하중을 가한 후 풀림토크 변화량을 측정하고, 압축굽힘강도와 피로강도를 측정하였다(n = 5). 결과: 지대주 침하량은 지대주나사 체결 시 가장 크게 나타났으며(P < 0.05), 나사체결과 하중부여에 따른 총 침하량은 $45^{\circ}$군보다 $90^{\circ}$군에서 더 크게 측정되었다(P < 0.05). 반복하중 부여 후 풀림 토크, 그리고 최대 압축굽힘강도와 피로강도는 통계적으로 유의한 차이를 보이지 않았다(P > 0.05). 결론: 본 실험조건하에서 지대주 나사머리의 원추형 설계가 지대주의 총 침하량을 약간 감소시키는 효과를 나타냈으나, 연결부의 전체적인 기계적 안정성에 미치는 영향은 크지 않을 것으로 판단된다.

포장용 Sodium Caseinate(CasNa)/Transglutaminase(TG) 코팅지 제조 및 특성 분석 (Preparation and Characterization of Sodium Caseinate (CasNa)/Transglutaminase (TG)-coated Papers for Packaging)

  • 황지현;김도완
    • 한국포장학회지
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    • 제28권2호
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    • pp.81-87
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    • 2022
  • 본 연구에서는 CasNa와 TG를 혼합하여 5종의 CasNa/TG코팅액을 제조하였고, 제조한 코팅액을 종이 표면에 코팅하여 CasNa/TG 코팅지들을 제조하였다. 제조한 코팅지는 TG 함량에 따라 형태학적 특성, 인장강도 및 신장율, 열접착강도, 수증기 투과 특성에 대하여 분석하였다. CasNa/TG 코팅지의 경우 pristine CasNa 코팅지보다 신장율, 수증기 투과 특성이 개선됨을 확인하였다. FTIR 분석 결과, TG 함량이 증가함에 따라 피크의 세기가 변화하는 것을 확인하였다. 또한 SEM 분석 결과, TG 함량이 증가함에 따라 깨짐 없는 균일한 코팅층이 형성된 것을 확인하였다. 이는 TG의 도입으로 인한 CasNa 내 화학적 구조의 변화가 CasNa 기반 코팅액과 코팅지에 영향을 미치는 것으로 판단되며, 이로 인해 신장율, 수증기 투과 특성이 개선되는 것으로 판단된다. CasNa 기반 코팅지의 경우 지속 가능한 포장 소재로서 응용될 가능성이 클 것으로 예상된다. 하지만, 셀룰로오스 나노파이버, 폴리에틸렌 이민 등과 같은 첨가제를 활용하여 CasNa의 화학적·물리적 변화에 관한 추가적인 연구와 포장 소재로 사용하기 위해 요구되는 물성인 산소 및 수분 차단 특성, 내열성 등에 대하여 추가적인 연구가 필요한것으로 판단된다.

Bis[3-(triethoxysilylpropyl)]tetrasulfide에 의한 실리카 입자의 표면개질 반응과 SBR 나노 복합체 응용 (Modification of Silica Nanoparticles with Bis[3-(triethoxysilylpropyl)]tetrasulfide and Their Application for SBR Nanocomposite)

  • 류현수;이영석;이종철;하기룡
    • 폴리머
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    • 제37권3호
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    • pp.308-315
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    • 2013
  • 본 연구에서는 실리카 나노 입자의 표면개질을 위해 실란 커플링제인 bis[3-(triethoxysilylpropyl)]tetrasulfide(TESPT)를 사용하여 표면개질 반응을 수행하였다. 반응온도, 반응시간 및 TESPT 투입량의 변화가 실리카 표면개질 반응에 미치는 영향을 Fourier transform infrared spectroscopy(FTIR), thermogravimetric analysis(TGA), elemental analysis(EA) 및 고체 $^{13}C$$^{29}Si$ cross-polarization magic angle spinning(CP/MAS) nuclear magnetic resonance spectroscopy(NMR)를 사용하여 분석하였다. 실리카 대비 투입되는 TESPT의 투입량을 증가시킬수록 $3746cm^{-1}$의 실리카의 고립 실란올(isolated) 피크의 세기는 줄어들었고, $2938cm^{-1}$의 TESPT의 $-CH_2$기에 의한 피크의 세기는 증가하였다. 또한 TESPT로 표면 개질된 실리카가 SBR 복합체의 기계적 물성에 미치는 영향과 SBR 기질 내에서 실란 커플링제로 표면 처리된 실리카의 분산정도를 universal testing machine(UTM)과 field emission scanning electron microscope(FE-SEM)를 이용하여 각각 측정하였다. 실험 결과 개질되지 않은 본래(pristine) 실리카를 20 phr(parts per hundred of rubber) 넣은 SBR 나노복합체에 비해 개질된 실리카 20 phr를 넣은 SBR 복합체의 인장강도는 5.65에서 9.38 MPa, 100% modulus는 1.62에서 2.73 MPa로 각각 증가하였으나, 파괴점 신장률은 349.6에서 298.9%로 조금 감소되었으며, SBR 기질 내의 실리카 분산성은 TESPT로 처리된 실리카가 본래 실리카에 비해 우수하였다.

유청단백질로 만들어진 식품포장재에 관한 연구

  • 김성주
    • 한국유가공학회:학술대회논문집
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    • 한국유가공기술과학회 2002년도 제54회 춘계심포지움 - 우유와 국민건강
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    • pp.59-60
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    • 2002
  • Edible films such as wax coatings, sugar and chocolate covers, and sausage casings, have been used in food applications for years$^{(1)}$ However, interest in edible films and biodegradable polymers has been renewed due to concerns about the environment, a need to reduce the quantity of disposable packaging, and demand by the consumer for higher quality food products. Edible films can function as secondary packaging materials to enhance food quality and reduce the amount of traditional packaging needed. For example, edible films can serve to enhance food quality by acting as moisture and gas barriers, thus, providing protection to a food product after the primary packaging is opened. Edible films are not meant to replace synthetic packaging materials; instead, they provide the potential as food packagings where traditional synthetic or biodegradable plastics cannot function. For instance, edible films can be used as convenient soluble pouches containing single-servings for products such as instant noodles and soup/seasoning combination. In the food industry, they can be used as ingredient delivery systems for delivering pre-measured ingredients during processing. Edible films also can provide the food processors with a variety of new opportunities for product development and processing. Depends on materials of edible films, they also can be sources of nutritional supplements. Especially, whey proteins have excellent amino acid balance while some edible films resources lack adequate amount of certain amino acids, for example, soy protein is low in methionine and wheat flour is low in lysine$^{(2)}$. Whey proteins have a surplus of the essential amino acid lysine, threonine, methionine and isoleucine. Thus, the idea of using whey protein-based films to individually pack cereal products, which often deficient in these amino acids, become very attractive$^{(3)}$. Whey is a by-product of cheese manufacturing and much of annual production is not utilized$^{(4)}$. Development of edible films from whey protein is one of the ways to recover whey from dairy industry waste. Whey proteins as raw materials of film production can be obtained at inexpensive cost. I hypothesize that it is possible to make whey protein-based edible films with improved moisture barrier properties without significantly altering other properties by producing whey protein/lipid emulsion films and these films will be suitable far food applications. The fellowing are the specific otjectives of this research: 1. Develop whey protein/lipid emulsion edible films and determine their microstructures, barrier (moisture and oxygen) and mechanical (tensile strength and elongation) properties. 2. Study the nature of interactions involved in the formation and stability of the films. 3. Investigate thermal properties, heat sealability, and sealing properties of the films. 4. Demonstrate suitability of their application in foods as packaging materials. Methodologies were developed to produce edible films from whey protein isolate (WPI) and concentrate (WPC), and film-forming procedure was optimized. Lipids, butter fat (BF) and candelilla wax (CW), were added into film-forming solutions to produce whey protein/lipid emulsion edible films. Significant reduction in water vapor and oxygen permeabilities of the films could be achieved upon addition of BF and CW. Mechanical properties were also influenced by the lipid type. Microstructures of the films accounted for the differences in their barrier and mechanical properties. Studies with bond-dissociating agents indicated that disulfide and hydrogen bonds, cooperatively, were the primary forces involved in the formation and stability of whey protein/lipid emulsion films. Contribution of hydrophobic interactions was secondary. Thermal properties of the films were studied using differential scanning calorimetry, and the results were used to optimize heat-sealing conditions for the films. Electron spectroscopy for chemical analysis (ESCA) was used to study the nature of the interfacial interaction of sealed films. All films were heat sealable and showed good seal strengths while the plasticizer type influenced optimum heat-sealing temperatures of the films, 130$^{\circ}$C for sorbitol-plasticized WPI films and 110$^{\circ}$C for glycerol-plasticized WPI films. ESCA spectra showed that the main interactions responsible for the heat-sealed joint of whey protein-based edible films were hydrogen bonds and covalent bonds involving C-0-H and N-C components. Finally, solubility in water, moisture contents, moisture sorption isotherms and sensory attributes (using a trained sensory panel) of the films were determined. Solubility was influenced primarily by the plasticizer in the films, and the higher the plasticizer content, the greater was the solubility of the films in water. Moisture contents of the films showed a strong relationship with moisture sorption isotherm properties of the films. Lower moisture content of the films resulted in lower equilibrium moisture contents at all aw levels. Sensory evaluation of the films revealed that no distinctive odor existed in WPI films. All films tested showed slight sweetness and adhesiveness. Films with lipids were scored as being opaque while films without lipids were scored to be clear. Whey protein/lipid emulsion edible films may be suitable for packaging of powder mix and should be suitable for packaging of non-hygroscopic foods$^{(5,6,7,8,)}$.

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