• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.1
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• pp.19-26
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• 2015

This paper proposes a design method for improving the frequency-domain performance reliability of dynamic systems with uncertain and degrading components. Discrete frequencies are used in this method as surrogates for the frequency band of interest, and the conformance of the frequency responses to the specification at these frequencies is utilized to model the frequency-domain performance reliability. A meta-model for the frequency responses, an extreme-value event, and the set-theory are integrated to improve the computational efficiency of the reliability estimation. In addition, a sample-based approach is presented to evaluate and optimize the estimated performance reliability. A case study of a vibration absorber system showed that the proposed design method has engineering applications.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.250-255
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• 2008

This study utilized a high speed lap-shear test to evaluate the mechanical behavior of Sn-37Pb/Cu and Sn-37Pb/Electroless Nickel immersion Gold under bump metallization solder joints under high speed loading and hence the drop reliability. The samples were aged for 120 h at different temperatures ($120^{\circ}C,\;150^{\circ}C,\;170^{\circ}C$) and afterward tested at different displacement rates (0.01 mm/s to 500 mm/s) to examine the effects of aging on the drop life reliability. The combination of the stress-strain graphs captured from the shear tests and identifying a fracture mode dominant in the samples for different strain rates leads us to conclude that the drop reliability of solder joints degrades as the aging temperature increases, possibly due to the role of the IMC layer. This study successfully demonstrates that the analysis based on a high speed lap-shear test could be critically used to evaluate the drop reliability of solder joints.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.21 no.12
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• pp.656-662
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• 2009

In this paper, the heat resistance reliability of an axial smoke exhaust fan was investigated. An axial smoke exhaust fan should be capable of operating at $250^{\circ}C$ for 2 hours. The heat resistance reliability was evaluated by the heat resistance reliability test. A B10 life with a 90% confidence level was estimated to be about 48 minute. The failure occurred in the motor due to high temperature. The main failure mechanisms of the motor were melting of bond and insulating paper and burning of insulating materials in the coil. The heat resistance reliability was improved by changing the way to unite the core and the coil and by replacing the insulating paper and the insulating materials of the coil. A B10 life with a 90% confidence level of a modified axial smoke exhaust fan was estimated to be over 120 minute.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.63-69
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• 2012

Adhesion and mechanical reliability of silicon/epoxy/polyimide interfaces are critical issues for flexible electronics. Bonds between these interfaces are mainly hydrogen bonds, so their adhesion is weaker than cohesive fracture toughness and vulnerable to moisture. In order to enhance adhesion and suppress moisture-assisted debonding, UV/Ozone treatment and innovative sol-gel derived hybrid layers were applied to silicon/epoxy/polyimide interfaces. The fracture energy and subcritical crack growth rate were measured by using a double cantilever beam (DCB) fracture mechanics test. Results showed that UV/Ozone treatment increased the adhesion, but was not effective for improving reliability against humidity. However, by applying sol-gel derived hybrid layers, adhesion increase as well as suppresion of moisture-assisted cracking were achieved.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.1-6
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• 2013

Recently, various types of flexible devices such as flexible displays, batteries, e-skins and solar cell panels have been reported. Most of the researches focus on the development of high performance flexible device. However, to realize these flexible devices, the long-term reliability should be guaranteed during the repeated deformations of flexible devices because the direct mechanical stress would be applied on the electronic devices unlike the rigid Si-based devices. Among various materials consisting electronics devices, metal electrode is one of the weakest parts against mechanical deformation because the mechanical and electrical properties of metal films degrade gradually due to fatigue damage during repeated deformations. This article reviews the researches of fatigue behavior of thin metal film, and introduces the methods to enhance the reliability of metal electrode for flexible device.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.324-327
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• 2001

This paper shows an example of the Design Review and Common-Cause Failure (CCF) Modeling of mechanical Parts. Reliability should be continuously monitored during the entire period of design. Design Review is the procedure to improve the reliability for the product. We proposed the reliability assessment and design review method. CCF Model is the general dependent model considering the failure mode effects several component simultaneously. This study considers the computation of the network with dependent components. It is important that CCF model is applied for mechanical pars.

• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.221-226
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• 2004

The thermal stresses induced by difference in Coefficient of Thermal Expansion between FR-4 board and 63Sn-37Pb solder joint directly affect the reliability of 63Sn-37Pb solder joint. This research, thus, focuses to investigate the crack initiation and propagation behavior around solder joint by imposing a designed Acceleration Life Test Procedure on solder joint by using a newly manufactured Thermal Impact Experimental Apparatus. The fracture mechanism of the solder joint was found to be highly influenced by thermal stresses. The reliability of solder joint was evaluated by using a failure probability model in terms of varying parameters such as frequency and temperature. The relationship between failure probability and safety factor was also studied.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1179-1184
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• 2014

Reliability allocation is generally used during the early stage of system development to apportion the system reliability target to its individual modules. This paper presents a comprehensive method for performing the reliability allocation of KTX door systems. Nine criteria for reliability allocation include failure criticality, operating time, risk, complexity, failure rate, maintenance, manufacturing technology, working condition, and reliability cost. For satisfying the system reliability target, the allocated $B_{10}$ lives of four modules are provided.