• 한국전기전자재료학회논문지
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• 제13권8호
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• pp.711-717
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• 2000

Effect of alloying element additions to Ag on thermal conductivity electrical conductivity and mechanical properties of sheath materials for BSCCO tapes has been characterized. The thermal conductivity at low temperature range(10~300K) of Ag alloys were evaluated by both direct and indirect measurement techniques and compared with each other. It was observed that thermal conductivity decreased with increasing the content of alloying elements such as Au, Pd and Mg. Thermal conductivity of pure Ag at 30 K was measured to be 994.0 W/m.K on the other hand the corresponding values of A $g_{0.9995}$/M $g_{0.0005}$, A $g_{0.974}$/A $u_{0.025}$/M $g_{0.001}$, A $g_{0.973}$/Au.0.025//M $g_{0.002}$, and A $g_{0.92}$/P $d_{0.06}$/M $g_{0.02}$ were 342.6, 62.1, 59.2, 28.9 W/m.K respectively indicating 3 to 30 times lower than that of pure Ag. In addition alloying element additions to Ag improved mechanical strength while reduced elongation probably due to the strengthening mechanisms by the presence of additive atoms.s.

• 한국전기전자재료학회논문지
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• 제16권7호
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• pp.627-633
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• 2003

The effects of alloying-element additions to Ag sheath on thermal conductivity and mechanical properties of Bi-2223 superconductor tapes have been evaluated. In order to evaluate the effects of sheath alloys and their configuration on the properties of tape, various combinations of Ag and Ag alloys were selected as the inner and outer sheath. Thermal conductivity of the tapes was evaluated by using thermal integral method at 10 ∼120 K. It was observed that the addition of Mg, Sb, and Au to Ag sheath significantly decreased the thermal conductivity at low temperature probably due to the alloying effect. Specifically, the thermal conductivity of AgMg, AgSb, and AgAu at 40 K were 411.4, 142.3, and 109.7 W/(m·K), respectly, which is about 2∼9 times lower than that of Ag (1004.6 W/(m·K)). In addition, the thermal conductivity of alloy-sheathed tape was significantly dependent on their thermal conductivities of constituent sheath materials. The mechanical properties of alloy-sheathed tapes were also evaluated. Yield strength and tensile strength were improved but workability decreased for alloy-sheathed tapes.

• 한국재료학회지
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• 제33권10호
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• pp.422-429
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• 2023

High-strength low-alloy steel is one of the widely used materials in onshore and offshore plant engineering. We investigated the alloying effect of solute atoms in α-Fe based alloy using ab initio calculations. Empirical equations were used to establish the effect of alloying on the Vicker's hardness, screw energy coefficient, and edge dislocation energy coefficient of the steel. Screw and edge energy coefficients were improved by the addition of V and Cr solute atoms. In addition, the addition of trace quantities of V, Cr, and Mn enhanced abrasion resistance. Solute atoms and contents with excellent mechanical properties were selected and their thermal conductivity and thermal expansion behavior were investigated. The addition of Cr atom is expected to form alloys with low thermal conductivity and thermal expansion coefficient. This study provides a better understanding of the state-of-the-art research in low-alloy steel and can be used to guide researchers to explore and develop α-Fe based alloys with improved properties, that can be fabricated in smart and cost-effective manners.

• Progress in Superconductivity
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• 제1권1호
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• pp.61-67
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• 1999

We evaluated the effect of alloying element additions to Ag sheath on mechanical, electrical and thermal properties of Bi-2223. Additions of Au, Pd and Mg to Ag sheath increased hardness and strength, while reduced elongation and electrical and thermal conductivity. In addition, microstructural investigation showed that the grain size of Ag significantly decreased with increasing content of alloying elements. The improvements in strength and hardness are believed to be due to the presence of alloying elements that lead to strengthen materials by combined effects of solid-solution, dispersion hardening and grain size hardening. Thermal conductivity of Ag and Ag alloys was evaluated in the temperature range from 77 K to 300 K, and com-pared to calculated value obtained by Wiedermann-Franz law. It was observed that the thermal conductivity decreased with increasing the content of alloying elements. Specifically, the thermal conductivity of $Ag_{0.92}Pd_{0.06}Mg_{0.02}$ alloy was measured to be $48.2W/(m{\cdot}K)$ at 77 K, which is about 6 times lower than that of $Ag(302.6W/(m{\cdot}K))$.

• 한국재료학회지
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• 제21권10호
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• pp.542-545
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• 2011

Half-Heusler alloys are a potential thermoelectric material for use in high-temperature applications. In an attempt to produce half-Heusler thermoelectric materials with fine microstructures, TiCoSb was synthesized by the mechanical alloying of stoichiometric elemental powder compositions and then consolidated by vacuum hot pressing. The phase transformations during the mechanical alloying and hot consolidation process were investigated using XRD and SEM. A single-phase, half- Heusler allow was successfully produced by the mechanical alloying process, but a minor portion of the second phase of the CoSb formation was observed after the vacuum hot pressing. The thermoelectric properties as a function of the temperature were evaluated for the hot-pressed specimens. The Seebeck coefficients in the test range showed negative values, representing n-type conductivity, and the absolute value was found to be relatively low due to the existence of the second phase. It is shown that the electrical conductivity is relatively high and that the thermal conductivities are compatibly low in MA TiCoSb. The maximum ZT value was found to be relatively low in the test temperature range, possibly due to the lower Seebeck coefficient. The Hall mobility value appeared to be quite low, leading to the lower value of Seebeck coefficient. Thus, it is likely that the single phase produced by mechanical alloying process will show much higher ZT values after an excess Ti addition. It is also believed that further property enhancement can be obtained if appropriate dopants are selectively introduced into this MA TiCoSb System.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.665-666
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• 2006

Undoped $CoSb_3$ powders were synthesized by mechanical alloying (MA) of elemental powders using a nominal stoichiometric composition. Nano-structured, single-phase skutterudite $CoSb_3$ was successfully produced by vacuum hot pressing (VHP) using MA powders without subsequent annealing. Phase transformations during synthesis were investigated using XRD, and microstructure was observed using SEM and TEM. Thermoelectric properties in terms of Seebeck coefficient, electrical conductivity, thermal conductivity and figure of merit(ZT) were systematically measured and compared with the results of analogous studies. Lattice thermal conductivity was reduced owing to increasing phone scattering in nano-structured MA $CoSb_3$, leading to enhancement in the thermoelectric figure of merit. MA associated with VHP technique offers an alternative potential processing route for the process of skutterudite.

• 한국결정성장학회지
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• 제26권4호
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• pp.155-158
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• 2016

전자소자내의 방열특성은 제품의 신뢰성을 결정하는 우주 중요한 인자중의 하나이다. 본 연구에서는 Al과 graphite 분말을 기계적 합금법(mechanical alloying)을 이용하여 Al/graphite 복합체 분말을 합성하고, 합성된 분말을 열처리한 시편에 대한 물리적 특성을 분석하였다. 열처리가 완료된 Al/graphite 샘플에서 열처리 온도 및 시간이 증가할수록 $Al_4C_3$ 이차상의 비율이 증가함을 확인하였다. 또한 Al/graphite 샘플의 열전도도는 순수 Al 분말 샘플에 비해 현저히 낮았으나, 열처리 온도와 시간에 비례하여 증가하는 것을 확인하였다.

• 한국분말재료학회지
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• 제11권1호
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• pp.43-49
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• 2004

The electrical and thermal conductivity of W-Cu composites were investigated as a function of the W-particle size and W-W contiguity. Powder mixtures were prepared by ball milling or mechanical alloying process, and then sintered at various temperatures. The electrical conductivity of sintered composite was increased with decreasing W grain size. Dependence of electrical conductivity on the W grain size was explained by the W-W contiguity concept. The thermal conductivity was increased with increasing the temperature up to $600^{\circ}C$ but decreased at the temperature above $600^{\circ}C$ Also, thermal conductivity value was influenced by the W particle size. Change of thermal conductivity in W-Cu composites was discussed based on the observed microstructural characteristics and theoretical considerations.

• Electronic Materials Letters
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• 제14권6호
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• pp.725-732
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• 2018

The thermoelectric and transport properties of Ti-doped FeVSb half-Heusler alloys were studied in this study. $FeV_{1-x}Ti_xSb$ (0.1 < x < 0.5) half-Heusler alloys were synthesized by mechanical alloying process and subsequent vacuum hot pressing. After vacuum hot pressing, a near singe phase with a small fraction of second phase was obtained in this experiment. Investigation of microstructure revealed that both grain and particle sizes were decreased on doping which would influence on thermal conductivity. No foreign elements pick up from the vial was seen during milling process. Thermoelectric properties were investigated as a function of temperature and doping level. The absolute value of Seebeck coefficient showed transition from negative to positive with increasing doping concentrations ($x{\geq}0.3$). Electrical conductivity, Seebeck coefficient and power factor increased with the increasing amount of Ti contents. The lattice thermal conductivity decreased considerably, possibly due to the mass disorder and grain boundary scattering. All of these turned out to increase in power factor significantly. As a result, the thermoelectric figure of merit increased comprehensively with Ti doping for this experiment, resulting in maximum thermoelectric figure of merit for $FeV_{0.7}Ti_{0.3}Sb$ at 658 K.

• Journal of Ceramic Processing Research
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• 제20권6호
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• pp.582-588
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• 2019

FeVSb1-xTex (0.02 ≤ x ≤ 0.10) half-Heusler alloys were fabricated by mechanical alloying process and subsequent vacuum hot pressing. Near single half-Heusler phases are formed in vacuum hot pressed samples but a second phase of FeSb2 couldn't be avoided. After doping, the lattice thermal conductivity in the system was shown to decrease with increasing Te concentration and with increasing temperature. The lowest thermal conductivity was achieved for FeVSb0.94Te0.06 sample at about 657 K. This considerable reduction of thermal conductivities is attributed to the increased phonon scattering enhanced by defect structure, which is formed by doping of Te at Sb site. The phonon scattering might also increase at grain boundaries due to the formation of fine grain structure. The Seebeck coefficient increased considerably as well, consequently optimizing the thermoelectric figure of merit to a peak value of ~0.24 for FeVSb0.94Te0.06. Thermoelectric properties of various Te concentrations were investigated in the temperature range of around 300~973 K.