• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.485-485
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• 2009

Double side polishing process has been used for various industrial applications, such as polishing of semiconductor substrates and flat panel display glasses. In wafer manufacturing, double side polishing process is applied to improve wafer flatness and to minimize particle generation from wafers in device manufacturing processes, which is recognized as one of the most important processes. Whereas the kinematical modeling and analysis results of single side polishing, extensively used for chemical-mechanical polishing (CMP) in device manufacturing, are well investigated, the studies in conjunction with double side polishing are barely carried out, due to the complication of polishing system and the uncertainty of wafer motion in the carrier. This paper suggests the derivation of kinematical model with consideration of carrier and wafer motion in double side polishing, and then presents the effect of kinematical parameters on material removal amount and its non-uniformity. The kinematical analysis results help to understand the double side polishing process and to control the polishing results.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.245-252
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• 2002

Ultrasonic machining technology has been developed over recent years for the manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile. Ultrasonic machining process is an efficient and economical means of precision machining of ceramic materials. The process is non-thermal, non-chemical and non-electric md hardly creates changes to the mechanical properties of the brittle materials machined. This paper describes the characteristics of the micro-hole of $Al_2O_3$ by ultrasonic machining with tungsten carbide tool. The effects of various parameters of ultrasonic machining, including abrasives, machining force and pressure, on the material removal rate, hole quality, and tool wear presented and discussed. The ultrasonic Machining of micro-holes in ceramics has been under taken and the machining mechanism in the ultrasonic machining of ceramics based on the fracture-mechanics concept has been analyzed.

• 한국정밀공학회지
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• 제28권8호
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• pp.929-935
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• 2011

As a deterministic finishing process for the optical parts having complex surface, machining performance of the magnetorheological(MR) fluid jet polishing of optical glass are studied and compared with a general water jet polishing. First, design of the jet polishing system which has the special electromagnet-nozzle unit for stabilizing the slurry jet based on MR fluid and the change of jet shape as magnetic field is applied are explained. Second, for the BK7 glass, machining spot and its cross section profile are analyzed and the unique effect of MR fluid jet polishing is shown. Third, both material removal depth and surface roughness are explored in order to investigate the polishing performance of MR fluid jet. With the same ceria abrasives and amount in the polishing slurries, MR fluid jet shows superior machining performance compared to water jet and the difference of material removal mechanism and its resulting performance are described.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.681-684
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• 2005

The old technique of sandblasting which has been used for paint or scale removing, deburring, and glass decorating has recently been developed into a powder blasting technique for brittle materials, capable of producing micro structures larger than 100um. A large number of Investigations on the abrasive jet machining with output parameters as material removal rate, penetrate and surface finish have been carried out and reported by various authors. In this paper, we investigated the effect of surface characteristics and surface shape of the abrasive jet machined glass surface under different blasting parameter. and finally we established a model for abrasive flow machining process, and compared with experimental results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.14-17
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• 2000

The rise throughput and the stability in fabrication of device can be obtained by applying of CMP process to STI structure in 0.18um semiconductor device. To employ in STI CMP, the reverse moat process has been added thus the process became complex and the defects were seriously increased. Removal rates of each thin films in STi CMP was not equal hence the devices must to be effected, that is, the damage was occured in the device dimension in the case of excessive CMP process and the nitride film was remained on the device dimension in the case of insufficient CMP process than these defects affect the device characteristics. We studied the current sensing method in STI-CMP with the reverse moat pattern.

• 한국환경보건학회지
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• 제19권4호
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• pp.38-43
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• 1993

The characteristics of food wastewater treatment in an anaerobic packed bed reactor (APBR) with polyurethane as a packing material and sludge bed reactor (ASBR) was studied. The reactor of 9cm-ID, 150cm-height was fed in a continuous mode from bottom of reactor. For the purpose of constant temperature of reactor, water jacket was installed. The used packing materials was polyurethane sponge foam. Methane which was produced by decomposed organics collected at the top of the reactor for using as a fuel. The substrates used were synthetic, mixed and food wastewater. For the acclimatization of microorganisms, mixed wastewater was used. The major analyses were gas production, COD, pH and volatile acids. Based upon the completed works, the results are as follows: When food wastewater was fed the quantity of produced gas was less than that of synthetic wastewater, but food process saw higher methane content than synthetic process. As well as COD removal efficiency of food process reached at about 85%. In aspect of effluent volatile acid, food process showed low concentration of below 500 mg/l, therefore anaerobic reaction stabled. Conclusively food wastewater used can be digested by anaerobic treatment, especially anaerobic packed bed reactor showed 82% of COD removal, 75% of methane content, 10 l of gas production, and anaerobic sludge bed reactor did 79% of COD removal, 75% of methane content, 81 of gas production at 4 kgCOD/m$^3$day, 36$\circ$C.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.55-60
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• 2017

The supercritical $CO_2$ (sc-$CO_2$) mixture and the sc-$CO_2$-based Photoresist(PR) stripping(SCPS) process were applied to the removal of the post etch/ash PR residue on aluminum patterned wafers and the results were observed by scanning of electron microscope(SEM). In the case of MDII wafers, the carbonized PR was able to be effectively removed without pre-stripping by oxygen plasma ashing by using sc-$CO_2$ mixture containing the optimum formulated additives at the proper pressure and temperature, and the same result was also able to be obtained in the case of HDII wafer. It was found that the efficiency of SCPS of ion implanted wafer improved as the temperature of SCPS was high, so a very large amount of MEA in the sc-$CO_2$ mixture could be reduced if the temperature could be increased at condition that a process permits, and the ion implanted photoresist(IIP) on the wafer was able to be removed completely without pre-treatment of plasma ashing by using the only 1 step SCPS process. By using SCPS process, PR polymers formed on sidewalls of metal conductive layers such as aluminum films, titanium and titanium nitride films by dry etching and ashing processes were removed effectively with the minimization of the corrosion of the metal conductive layers.

• Carbon letters
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• 제3권3호
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• pp.146-151
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• 2002

Activated carbon fibers were prepared from the petroleum isotropic pitch and organometallic compounds. The metalsvwere dispersed uniformly in the ACFs. The specific surface area and pore size distributions of metal containing ACFsvwere measured. The mesopores of ACFs were developed by Co, Ni, and Mn metals addition and the catalytic reactivityvof ACFs'SOx removal was increased by adding Ni and Pd metals. It was found that the mesopores did not work forvthe improvement of catalytic reactivity of ACFs' SOx removal with the blank experiment using the metal removedvACFs.

• 상하수도학회지
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• 제9권2호
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• pp.97-107
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• 1995

Today a conventional water treatment system has many problems. The ozone/GAC process, sometimes termed Biological Activated Carbon(BAC), appeared to be effective for the removal of soluble organic matters in the drinking water. The water quality of Nak-dong river in Pusan, generally shows BDOC 30-40% and NBDOC 60-70%. The pilot plant installed at the Duk-san water works that was been largest treatability(1,650,000ton/day) in Pusan. A experimental water in the pilot plant made use of the water after sand-filteration. Following results are drawn from this study. Initial adsorption velocity($DOC/DOC_o/T$) in the pure adsorption of GAG had a 0.0225, it's velocity changed to 0.006 after ozone added and the optimum ozone dose ranged of $1.4-2.0mgO_3/L$. A experimental water in the pilot plant composed with humic material(78%). Humic material composed with humic acid(20%) and fulvic acid(56%), and it's rate changed to 18 and 50% respectively after ozone added. DOC constantly decreased in the EBCTs and removal efficieny in the 15min of EBCT was 45-50%. It showed the largest removal rate of BDOC in the EBCT 5 and among the season, characteristics of removal varied. The HPC distributed over $10^6-10^7CFU/cm^3$ in the bed depth and among the season, distribution of HPC were differential.

• 멤브레인
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• 제25권6호
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• pp.503-514
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• 2015

본 연구는 잔류함으로써 문제를 일으킬 수 있는 응집제를 사용하지 않고 물리적인 처리만을 사용하는 막여과 정수처리의 전처리로 F/A 공정을 구성하고자 하였고 이를 구성하는 여재의 성능을 연구하였다. 특히, 탁질 물질과 유기물 제거가 가능한 것으로 알려진 Filtralite의 도입 가능성을 검토하였다. Filtralite의 탁도 제거효율은 원수대비 83~84%로 여과사와 비슷한 결과 값을 나타내었으며 여재표면에 잘 발달된 공극 때문에 유기물 제거능은 여과사보다 50% 더 높게 나타났다. 따라서 F/A 공정을 구성함에 있어 여과사보다 Filtralite가 더 효율적이라 검토되었다. 활성탄과 연계한 F/A 공정을 구성하여 막여과 처리 시스템의 전처리효율을 실험한 결과, TOC 농도는 TMP의 증가에 큰 영향을 주는 것으로 판단되어 막오염 저감에 유기물 제어가 중요함을 확인하였으며 유기물 제거 효율이 뛰어난 여재 사용이 필요할 것으로 판단되었다.