• Journal of the Korean Wood Science and Technology
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• v.37 no.4
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• pp.357-363
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• 2009

This study was carried out to investigate whether adhesive used in manufacturing glulam can be used to bond wood and GFRP, when considering working process and economical efficiency. The six different glulams were manufactured, changing the adhesives and the mixing ratios of the adhesives, and investigated by the block shear test and the delamination of the water soaking or boiling water soaking. The three glulams were manufactured, using the resocinol resin based adhesive, the PVAc resin based adhesive and the epoxy resin adhesive, and the other three glulams, using the adhesives mixing resocinol resin and PVAc resin. The block shear strength is higher than $7.1N/mm^2$ in all types, which is standard of KS F3021. However, in the wood failure the block shear strength was the highest as 65.9% in the PVAc. The delamination of glulams glued with PVAc adhesive, which was 1.08% in water soaking and 4.16% in boiling water soaking, was lower than 5.00% which is the standard of KS F 3021, and the adhesive strength is good. In glulams glued with only resocinol resin adhesive, the wood layers were good as 1.26% in the water soaking delamination and 0.00% in the boiling water soaking delamination. The GFRP layers were not good as 21.85% in the water soaking delamination but were good as 1.45% in the boiling water soaking delamination.

• Journal of the Korean Applied Science and Technology
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• v.33 no.4
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• pp.802-812
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• 2016

Silicone foam is very useful as flame resistant material for many industrial areas such as high performance gasketing, thermal shielding, vibration mounts, and press pads. A silicone foam was prepared through simultaneous crosslinking and foaming by hydrogen condensation reaction of a vinyl-containing polysiloxane (V-silicone) and a hydroxyl-containing polysiloxane (OH-silicone) with hydride containing polysiloxane (H-silicone) in the presence of platinum catalyst and imorganic filler at room temperature. This is more convenient process for silicone foam manufacturing than the conventional separated crosslinking and foaming systems. Funtionalized silicones we used in this experiment were consisted with a V-silicone containing 1,0 meq/g of vinyl groups and a viscosity of 20 Pa-s, an OH-silicone with 0.4 meq/g of hydroxyl groups and a viscosity from 50 Pa-s, and an H-silicone containing 7.5 meq/g of hydride groups and a viscosity of 0.06 Pa.s. The effects of compositions of functionalized silicones and additives, such as catalyst and filler on the structure and mechanical properties of silicone foam were studied. 0.5 wt% of Pt catalyst was enough to accelerate the foaming rate of silicone resins. The addition of OH-silicone with lower viscosity accelerates the initial foaming rate and decreases the foam density, but the addition of V-silicone with lower viscosity reduces the tensile strength as well as the elongation. The final foam density, tensile strength, and elogation of silicone foam prepared under the SF-3 condition increase maximum to $0.58g/cm^3$, $3,51kg_f/cm^2$, and 176 %, repectively. We found out the filler alumina also played an important role to improve the mechanical properties of silicone foams in our foaming system.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.42 no.1
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• pp.1-11
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• 2005

Several Solid Freeform Fabrication Systems(SFFS) are commercialized in a few companies for rapid prototyping. However, they have many technical problems including the limitation of applicable materials. A new method of agile prototyping is required for the recent manufacturing environments of multi-item and small quantity production. The objectives of this paper include the development of a novel method of SFFS, the CAFL/sup VM/(Computer Aided Fabrication of Lamination for Various Material), and the manufacture of the various material samples for the certification of the proposed system and the creation of new application areas. For these objectives, the technologies for a highly accurate robot path control, the optimization of support structure, CAD modeling, adaptive slicing was implemented. However, there is an important problem with the conventional 2D lamination method. That is the inaccuracy of 3D model surface, which is caused by the stair-type surface generated in virtue of vertical 2D cutting. In this paper, We design the new control algorithm that guarantees the constant speed, precise positioning and tangential cutting on the 5DOF SFFS. We develop the tangential cutting algorithm to be controlled with constant speed and successfully implemented in the 5DOF CAFL/sup VM/ system developed in this paper. Finally, this paper confirms its high-performance through the experimental results from the application into CAFL/sup VM/ system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.

• Journal of the Korean Magnetics Society
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• v.21 no.2
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• pp.77-82
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• 2011

The use of soft magnetic materials have been increasing in the various industrial fields according to the increasing demand for high performance, automatic, miniaturing equipments in the recent our life. In this study, we investigated the effect of factors on the core loss and magnetic properties of electrical steel and soft magnetic composites. Furthermore, we reviewed the major efforts to reduce the core loss and improve the soft magnetic properties in the two main soft magnetic materials. Domain purification which results from reduced density of defects in cleaner electrical steels is combined with large grains to reduce hysteresis loss. The reduced thickness and the high electrical conductivity reduce the eddy current component of loss. Furthermore, the coating applied to the surface of electrical steel and texture control lead to improve high permeability and low core loss. There is an increasing interest in soft magnetic composite materials because of the demand for miniaturization of cores for power electronic applications. The SMC materials have a broad range of potential applications due to the possibility of true 3-D electromagnetic design and higher frequency operation. Grain size, sintering temperature, and the degree of porosity need to be carefully controlled in order to optimize structure-sensitive properties such as maximum permeability and low coercive force. The insulating coating on the powder particles in SMCs eliminates particle-to-particle eddy current paths hence minimizing eddy current losses, but it reduces the permeability and to a small extent the saturation magnetization. The combination of new chemical composition with optimum powder manufacturing processes will be able to result in improving the magnetic properties in soft magnetic composite materials, too.

• Journal of Service Research and Studies
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• v.7 no.2
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• pp.1-16
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• 2017

The service that has been recognized as both a non-productive activity and auxiliary activity of manufacturing have become the driving force of the customers' demand with the 'service' itself. The service base is expanding and evolving rapidly. It is important to look at changes in service concepts to understand service systems. Because the service system itself has a cyclic nature based on the concept of service, it can help in the study and the "how" of service by looking at changing the system according to the evolution of the service concept. The ability to organize and utilize relationships is considered to be an important factor for managers in the service economy era. However, the attention of corporate is focused on their internal capabilities and they are familiar with external resources (knowledge and competence of customers). In this case study for each type of service, we analyzed the activities of interacting service providers-consumers in service relationship, and constructed a new service system model emphasizing intangible value and long-term outcome. This study is worth re-examining the role of customers in today's service economy era and actively utilizing a new service model for business performance.

• Journal of the Korean Electrochemical Society
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• v.7 no.1
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• pp.38-43
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• 2004

Porous carbon aerogel-silica gel composite materials were used as the electrodes of capacitive deionization(CDI) process, which were prepared by a paste rolling method. The electrochemical parameters such at current values, coulombs af a function of cycle, and CDI efficiencies were investigated for 10th and 100th cycles in 1,000ppm NaCl solution. Carbon aerogel-silica gel composite electrodes showed good wet-ability and higher mechanical strengths even under the NaCl solutions as well. In our experimented runs, all of the composite electrodes also are showed good cycle-ability without destroy of active material during cycles and decreased manufacturing times by $50\%$. Conclusively, the adding of silica gel powder to carbon aerogel leads to the effective performance of CDI process due to effective utilization of active materials by increasing the wet-ability and mechanical hardness.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.1
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• pp.73-80
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• 2004

In this paper, the implementation and embedding method of the existing air-filled waveguide-filters at millimeter-wave on general PCB substrate is introduced by systematically inserting the vias inside waveguide and mathematically manipulating the simple equations obtained ken the classical circular-post waveguide filter design. All the metal structures placed vertically such as side wall fur perfect ground plane and circular-post for signal control in the air-filled WR-22 waveguide are replaced with several types of via for constructing the bandpass-filter. Side wall and poles inside waveguide are realized by placing a series array of via and tuning the via diameter. The lengths of x, y, z axis are reduced in proportion to root square of employed substrate dielectric constant and especially the length of z axis can be more reduced due to the characteristics of the wave propagation. Because the mass production on PCB is possible without fabricating a large-scaled metal waveguide of WR-22 as input/output ports at millimeter-wave regime, the manufacturing cost is reduced considerably. Finally, when using multilayer process like LTCC for small-sized module, it is one of advantages to use only one layer f3r the filter fabrication. To evaluate the validity of this novel technique, order-3 Chebyshev BPF(Bandpass-Filter) centered at 40 GHz-band with a 2.5 ％ FBW (Fractional Bandwidth) were used. The employed substrate has relative dielectric constant of 2.2 and thickness of 10 mil of Rogers RT/Duroid 5880. Accroding to design and measurement results, a good performance of insertion loss of 2 ㏈ and return loss of -30 ㏈ is achieved at full input/output ports.

• Journal of Korean Society of Coastal and Ocean Engineers
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• v.11 no.1
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• pp.56-67
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• 1999

It is desired to use a domestically manufactured ocean data buoy for the long-term operational ocean monitoring. The ocean data buoy manufacturing technology was introduced through the research cooperation with the Qingkong University of Taiwan. The introduced ocean data buoy system was further expanded and improved for more efficient application for the marine environmental monitoring in Korea. The size of the ocean data buoy is 2.5 m in diameter, which is smaller compared to the NOAA's 3.0 m discus buoy to allow easy land transportation and ocean deployment as well. From the dynamic response test of the buoy carried out numerically, it was shown that the measurement of waves with period greater than 4 seconds is acceptable. The measurement and control system of the data buoy were improved to increase the number of measuring parameters, to reduce power consumption and to enhance better data analysis and management. Each component of the improved data buoy system was described in detail in this paper. Water quality sensors of water temperature, salinity, DO, pH and turbidity were added to the system in addition to the marine meteorological sensors of wind speed and direction, air temperature, humidity, air pressure and wave. Inmarsat satellite communication system is used for the real-time data telemetry from the buoy deployed offshore. A field performance test of the improved and domestically manufactured buoy was carried out for a month at the open sea off Pohang together with DatawelI's Wave-rider buoy to compare the wave data. The results of the test were satisfactory.