Proceedings of the SAREK Conference (대한설비공학회:학술대회논문집)
- 2008.11a
- /
- Pages.170-174
- /
- 2008
Development of Flat Plate Type Small Cooling Device
Flat Plate Type 소형 냉각소자 개발
-
Moon, Seok-Hwan
(Advanced I-MEMS Team, New Devices & Materials Research Department, Convergence and Components & Materials Research Lab., Electronics and Telecommunications Research Institute) ;
-
Hwang, Gunn
(Advanced I-MEMS Team, New Devices & Materials Research Department, Convergence and Components & Materials Research Lab., Electronics and Telecommunications Research Institute) ;
-
You, In-Kyu
(Advanced I-MEMS Team, New Devices & Materials Research Department, Convergence and Components & Materials Research Lab., Electronics and Telecommunications Research Institute) ;
-
Cho, Kyoung-Ik
(Advanced I-MEMS Team, New Devices & Materials Research Department, Convergence and Components & Materials Research Lab., Electronics and Telecommunications Research Institute) ;
-
Yu, Byoung-Gon
(Advanced I-MEMS Team, New Devices & Materials Research Department, Convergence and Components & Materials Research Lab., Electronics and Telecommunications Research Institute)
-
문석환
(한국전자통신연구원 융합부품소재연구부문 신소자소재연구부 차세대 I-MEMS팀) ;
-
황건
(한국전자통신연구원 융합부품소재연구부문 신소자소재연구부 차세대 I-MEMS팀) ;
-
유인규
(한국전자통신연구원 융합부품소재연구부문 신소자소재연구부 차세대 I-MEMS팀) ;
-
조경익
(한국전자통신연구원 융합부품소재연구부문 신소자소재연구부 차세대 I-MEMS팀) ;
-
유병곤
(한국전자통신연구원 융합부품소재연구부문 신소자소재연구부 차세대 I-MEMS팀)
- Published : 2008.11.21
Abstract
Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of