• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.165-165
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.11a
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• pp.176-176
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• 2001

• Proceedings of the Korean Vacuum Society Conference
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• 2008.08a
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• pp.113-113
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• 2008

• Proceedings of the Korean Vacuum Society Conference
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• 2008.08a
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• pp.114-114
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• 2008

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.89-90
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• 2003

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.181.2-181.2
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• 2015

Sputtering is one of the most popular physical deposition methods due to their versatility and reproducibility. Synthesis of Cr thin films by DC magnetron sputtering using glancing angle deposition (GLAD) has been reported. Chromium thin films have been prepared at two different working pressure($2.0{\times}10-2$, 30, $3.3{\times}10-3torr$) on Si-wafer substrate using magnetron sputtering with glancing angle deposition (GLAD) technique. The thickness of Cr thin films on the substrate was adjusted about 1 mm. The electrical property was measured by four-point probe method. For the measurement of density in the films, an X-ray reflectivity (XRR) was carried out. The sheet resistance and column angle increased with the increase of glancing angle. However, nanohardness and density of Cr thin films decreased as the glancing angle increased. The measured density for the Cr thin films decreased from 6.1 to 3.8 g/cc as the glancing angle increased from $0^{\circ}$ to $90^{\circ}$ degree. The low density of Cr thin films is resulted from the isolated columnar structure of samples. The evolution of the isolated columnar structure was enhanced at the conditions of low sputter pressure and high glancing angle. This GLAD technique can be potentially applied to the synthesis of thin films requiring porous and uniform coating such as thin film catalysts or gas sensors.

• Electrical & Electronic Materials
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• v.8 no.1
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• pp.77-82
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• 1995

PTCR(Positive Temperature Coefficient of Resistivity) thermistor in thin film BaTiO$_{3}$ system was prepared by using radio frequency(13.56 MHz) and DC magnetron sputter equipment. Polycrystalline, surface structure, and R-T(Resistivity-Temperature) characteristics of the specimens were measured by X-ray diffraction(D-Max3, Rigaku, Japan), SEM(Scanning Electron Microscopy: M.JSM84 01, Japan), and insulation resistance measuring system (Keithley 719), respectively. Thin films characteristics of the thermistor showed different properties depending on the substrate even with the same sputtering condition. The thin film formed on the A1$_{2}$O$_{3}$ substrate showed a good crystalline and a low resistivity at below curie point. However, the thin films prepared on slide glass and Si wafer were amorphous. The thicknesses of the three samples prepared under the same process conditions were 700[.angs.], 637.75[.angs.], and 715[.angs.], respectively.

• Journal of the Korean Society for Heat Treatment
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• v.12 no.3
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• pp.199-205
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• 1999

The quaternary Ti-Al-V-N films have been grown on glass substrates by reactive dc and rf magnetron sputter deposition from a Ti-6Al-4V target in mixed Ar-$N_2$ discharges. The Ti-Al-V-N films were investigated by means of X-ray diffraction(XRD), electron probe microanalysis(EPMA) and scratch tester. Both XRD and EPMA results indicated that the Ti-Al-V-N films were of single B1 NaCl phase having columnar structure with the (111) preferred orientation. Scratch tester results showed that the adhesion strength of Ti-Al-V-N films which treated with substrate heating and vacuum annealing was superior to that of as-deposited film. The good adhesion strength was also achieved in the double-layer structure of Ti-Al-V-N/Ti-Al-V/Glass.

• Transactions on Electrical and Electronic Materials
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• v.1 no.2
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• pp.28-31
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• 2000

BaTiO$_3$cerameic thin films doped with Mn were manufactured by rf/dc magnetron sputter technique. We have investigated crystal structure, surface morphology and PRCR(positive-temperature coefficient of resistance) characteristics of the specimen depending on second heat-treatment temperature. Second heat treatment of the specimen were performed in the temperature range of 400 to 1350$\^{C}$ X-ray diffraction patterns of BaTiO$_3$ thin films show that the specimen heat treated below 600$\^{C}$ is an amorphous phase and the one heat treated above 1100$\^{C}$ forms a poly-crystallization . In this specimen heat-treated at 1300$\^{C}$, a lattice constant ratio(c/a) was 1.188. Scanning electron microscope(SEM) image of BaTiO$_3$ thin films of the specimen heat treated in between 900 and 1100$\^{C}$ shows a grain growth. At 1100$\^{C}$, the specimen stops grain-growing and becomes a poly-crystallization . A resistivity-temperature characteristics of the specimen depends on the doping concentrations of Mn. A resistivity ratio between the value at room temperature and the one above Curie temperature was 10$^4$ for pure BaTiO$_3$ thin films and 10$\^$5/ fo BaTiO$_3$ : additive 0.127mol% MnO

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.612-614
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• 1993

Sputtering requires a way to bombard the target with sufficient momentum. Positive ions are the most convenient source since their energy and momentum can be controlled by applying a potential to the target. Although many types of discharges have been used for sputtering, magnetrons are now the most widely used because of the high ion current densities. Namely, plasma near the target electrode is confined by magnetic field using permanent magnet, so that the collision probability is increased. It is important to develop RF magnetron sputtering system which has many excellent merits compared with conventional methods. Our study aims to develop 1 kW RF source(13.56 MHz, TR type) and to accumulate the design and construction technology of RF magnetron sputter-deposition system. We developed 1 kW RF sputtering system to deposit thin film. These films are deposited by this RF source matched by auto-matching system using primarily argon gas. Target of Au, Ni, Al, and $SiO_2$ was well deposited on the argon pressure of 5-10 mTorr.