• Journal of Microbiology and Biotechnology
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• v.20 no.1
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• pp.169-178
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• 2010

The microbial community structure in Thailand soils contaminated with low and high levels of arsenic was determined by denaturing gradient gel electrophoresis. Band pattern analysis indicated that the bacterial community was not significantly different in the two soils. Phylogenetic analysis obtained by excising and sequencing six bands indicated that the soils were dominated by Arthrobacter koreensis and $\beta$-Proteobacteria. Two hundred and sixty-two bacterial isolates were obtained from arsenic-contaminated soils. The majority of the As-resistant isolates were Gramnegative bacteria. MIC studies indicated that all of the tested bacteria had greater resistance to arsenate than arsenite. Some strains were capable of growing in medium containing up to 1,500 mg/l arsenite and arsenate. Correlations analysis of resistance patterns of arsenite resistance indicated that the isolated bacteria could be categorized into 13 groups, with a maximum similarity value of 100%. All strains were also evaluated for resistance to eight antibiotics. The antibiotic resistance patterns divided the strains into 100 unique groups, indicating that the strains were very diverse. Isolates from each antibiotic resistance group were characterized in more detail by using the repetitive extragenic palindromic-PCR (rep-PCR) DNA fingerprinting technique with ERIC primers. The PCR products were analyzed by agarose gel electrophoresis. The genetic relatedness of 100 bacterial fingerprints, determined by using the Pearson product-moment similarity coefficient, showed that the isolates could be divided into four clusters, with similarity values ranging from 5-99%. Although many isolates were genetically diverse, others were clonal in nature. Additionally, the arsenic-resistant isolates were examined for the presence of arsenic resistance (ars) genes by using PCR, and 30% of the isolates were found to carry an arsenate reductase encoded by the arsC gene.

• Journal of Powder Materials
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• v.27 no.2
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• pp.139-145
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• 2020

The powder manufacturing process using the gas atomizer process is easy for mass production, has a fine powder particle size, and has excellent mechanical properties compared to the existing casting process, so it can be applied to various industries such as automobiles, electronic devices, aviation, and 3D printers. In this study, a modified A4032-xSn (x = 0, 1, 3, 5, and 10 wt.%) alloy with low melting point properties is investigated. After maintaining an argon (Ar) gas atmosphere, the main crucible is tilted; containing molten metal at 1,000℃ by melting the master alloy at a high frequency, and Ar gas is sprayed at 10 bar gas pressure after the molten metal inflow to the tundish crucible, which is maintained at 800℃. The manufactured powder is measured using a particle size analyzer, and FESEM is used to observe the shape and surface of the alloy powder. DSC is performed to investigate the change in shape, according to the melting point and temperature change. The microstructure of added tin (Sn) was observed by heat treatment at 575℃ for 10 min. As the content of Sn increased, the volume fraction increased to 1.1, 3.1, 6.4, and 10.9%.

• Journal of Conservation Science
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• v.34 no.4
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• pp.259-271
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• 2018

Outdoor copper alloy is exposed to the atmospheric environment, accelerating corrosion progress compared with indoor copper alloy. In order to prevent corrosion, the outdoor copper alloy is coated with wax to block external corrosion factors. However, corrosion of the inside of the coating film is highly likely to continue without the internal corrosion prevention treatment. B.T.A, which is used as a copper alloy water-soluble corrosion inhibitor, has a high possibility of being harmful to the human body and is mainly used to treat excavated artifacts. This study had selected the water-soluble corrosion inhibitor, which was easier to use than the existing wax and B.T.A being used in corrosion inhibition treatment for outdoor copper alloy. A comparative study was conducted on B.T.A, which is a water-soluble corrosion inhibitor used on excavated artifacts, and $VCI^{(R)}$, $Rus^{(R)}$, and L-cys, an amino acid corrosion inhibitor, used for tin bronze test pieces. The experimental method was conducted for a certain period of time with the salt, acid, and air pollution affecting the corrosion of outdoor copper alloy. Based on experiment results, it was concluded that the best water - soluble copper alloy corrosion inhibitor in the atmospheric environment is $VCI^{(R)}$. and it could be considered to be applied in replacement of B.T.A due to its low harmfulness. In addition, $VCI^{(R)}$ is judged to serve as a corrosion inhibitor for outdoor copper alloy because it showed the best result even in the outdoor exposure test which is a real atmospheric environment.

• Journal of the Korean Applied Science and Technology
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• v.35 no.3
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• pp.612-621
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• 2018

In this study, $TiO_2$ nanotube plate and metal electrodes(Copper, Nickel, Stainless Steel, Aluminum, Tin, Titanium) were compared on cathodic reduction of nitrate ($NO_3{^-}-N$) during electrolysis. The electrochemical characteristics were compared based on electrochemical impedance spectroscopy (EIS). The surface morphology was obtained using scanning electron microscopy (SEM) method. Brunauer-Emmett-Teller (BET) method was implemented for the specific surface area analysis of the cathodes. To study kinetics, 90 minute batch electrolysis of nitrate solution was performed for each cathodes. In conclusion, under the condition of relatively low ($0.04 A\;cm^{-2}$) current density, $TiO_2$ nanotube plate showed no surface corrosion during the electrolysis, and the reaction rate was measured the highest in the kinetic analysis.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.21 no.1
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• pp.75-81
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• 2007

This paper dealt with the design and implementation of an expert system to monitor and diagnose the lightning arresters in GIS substations. The expert system consists of a data acquisition module(DAM) based on microprocessor and diagnostic algorithms. The DAM measures and analyzes several parameters necessary for the arrester diagnosis such as system voltages, leakage current components, and temperatures. Also, it includes an intelligent surge counter which can record the date and tin, the polarity, and the amplitude of surge currents. All the data acquired is transmitted to a remote computer by a low rate wireless network specified in IEEE 802.15.4 to avoid electromagnetic intereference under high voltage and large current environments. The decision-making for the arrester diagnosis completes with a Java Expert System Shell(JESS) which is composed of a knowledge base, an inference engine and a graphic user interface(GUI).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.563-568
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• 2012

Indium tin oxide (ITO) films were prepared using radio frequency (RF) magnetron sputtering method, magnets were equipped near the target in the sputter to bring the plasma near the target. The effect of magnetic field that brings the plasma near the substrate was compared with that of substrate heating. The effect of substrate heating on the grain size of the ITO thin film was larger than that of the magnetic field. However, the grain size of the ITO thin film was larger when the magnetic field was applied near the substrate during the sputtering process than when the substrate was not heated and the magnetic field was not applied. If stronger magnetic field is applied near the substrate during sputtering, it can be expected that the ITO thin film with good electrical conductivity and high transparency is obtained at low substrate temperature. When magnetic field of 90 Gauss was applied near the substrate during sputtering, the mobility of the ITO thin film increased from 15.2 $cm^2/V.s$ to 23.3 $cm^2/V.s$, whereas the sheet resistivity decreased from 7.68 ${\Omega}{\cdot}cm$ to 5.11 ${\Omega}{\cdot}cm$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.283-284
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• 2008

Electrical and optical characteristics of indium tin oxide (ITO) and indium zinc oxide (IZO) films without and with $(SiO_2)_3(ZnO)_7$ at.% (SZO) film deposited on poly(ethylene naphthalate) (PEN) and poly(ethylene terephthalate (PET) substrates as a gas barrier layer for flexible display were studied. The ITO and IZO films with SZO gas barrier layer showed the improved properties which were both the high transmittance of average 80% in the visible light range and the decreased sheet resistance as compared to those of ITO and IZO films without SZO layer. Particularly, the PEN substrate with only SZO gas barrier layer had a low water vapor transmission rate (WVTR) of $\sim10^{-3}g/m^2$/day. Thus, we suggest that the SZO film with protection ability against the water vapor permeation can be applied to gas barrier layer for flexible display.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.300-300
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• 2008

In this study, the advanced DuoPIGatron-type ion beam (IB) system was applied to inorganic thin film for aligning liquid crystal (LC). LC alignment on $Ta_2O_5$ via IB irradiation was embodied. As a result of IB irradiation, the homogeneously aligned liquid crystal display (LCD) on $Ta_2O_5$ was observed with low pretilt angles. The $Ta_2O_5$ were deposited on indium-tin-oxide coated Coming 1737 glass substrates by rf magnetron sputtering at $200^{\circ}C$. The deposition process resulted in forming very uniform thin film on glass substrates without any defects. To confirm the application of the inorganic alignment on modem display optical devices, we fabricated twisted nematic LCD and measured optical property and response time. As a result of the experiment, the electro optical characteristics of the LCD fabricated by using IB irradiation on $Ta_2O_5$ alignment layer were similar with the other LCD fabricated by using rubbing process.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• The Journal of the Korea Contents Association
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• v.15 no.10
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• pp.10-17
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• 2015

Transparent LED display is providing city residents with different attractions via information services and landscape and increasing demand is detected in various areas. It is true that majority of the current demand in transparent electrode material was found and used in ITO but limitations in capacity and economic efficiency led to the need for continuous research and technology development via new materials. As a new material, metal mesh has 85% of the materials to substitute ITO and is widely used due to low-cost and high-conductive rate. Maintenance of transparent LED display utilizing metal mesh compared to existing ITO transparent display is much easier as it not only saves resources but is also economical. Thus the objective of this paper lies in proposing the utilization of metal mesh in transparent LED display prototype to enable economical use of transparent LED display technology and to expand the market and to also propose transparent LED display development method via metal mesh and manufacture a prototype based on the method. And a characteristic comparison test between ITO and metal mesh provides the possibility of using metal mesh as a transparent electrode material in transparent LED display development.