• 한국정밀공학회지
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• 제13권11호
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• pp.38-45
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• 1996

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. Specially, the method utilizes the longitudinal vibration of ultrasonic transducer composed of piezoelectric vibrator and horn. This work investigates the design conditions affecting the dynamic characteristics through the theretical and experimental analysis. It conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. The integrated modeling is conducted via a combbination of dynamic identification of piezoelectric vibrator and theroretical analysis of horn. Then comparison is made for theroretical and experimental results of the dynamic characteristics of the ultrasonic transducer comprised of piezoelectric vibrator and horn. Form the results of the comparison we develop the design technique of ultrasonic transducer using dynamic characteristics analysis and propose the possibility of ultrasonic bonding considering the optimal conditions for the longitudinal vibration of ultrasonic transducer and other conditions.

• 아동학회지
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• 제31권1호
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• pp.1-17
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• 2010

This study explored the differences in gender, developmental period and parents in terms of parenting, the cross-sectional and longitudinal relationships in parenting by gender, and the cross-sectional and longitudinal relationships between participant roles in bullying situations and parenting by gender. The subjects were 498 4-5th grade children and the instruments utilized in this study were the Parental Bonding Instrument (Bowers, Smith, & Binney, 1994) and the Participant Roles Scale (Sutton & Smith, 1999). The subjects were contacted again one year after the first contact. Results showed that the relationships between parents were longitudinally quite stable. Girls whose fathers had higher levels of accurate monitoring were more likely to be defenders cross-sectionally. Girls whose parents had more accurate monitoring were less likely to be victims longitudinally. The results underscore the importance of examining both gender and participant roles in bullying situations.

• Nuclear Engineering and Technology
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• 제54권4호
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• pp.1221-1229
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• 2022

In this work, the guided wave de-bonding area-detecting technique was studied for application to containment liner plates in nuclear power plant areas. To apply this technique, an appropriate Lamb wave mode, symmetric and longitudinal dominance, was verified by the frequency shifting technique. The S0 2.7 MHz mm Lamb wave mode was chosen to realize quantitative experimental results and their visualization. Results of the bulk wave, longitudinal wave mode, and comparison experiments indicate that the wave mode was able to distinguish between the de-bonded and bonded areas. Similar to the bulk wave cases, the bonded region could be distinguished from the de-bonded region using the Lamb wave approach. The Lamb wave technique results showed significant correlation to the de-bonding area. As the de-bonding area increased, the Lamb wave energy attenuation effect decreased, which was a prominent factor in the realization of quantitative tomographic visualization. The feasibility of tomographic visualization was studied via the application of Lamb waves. The reconstruction algorithm for the probabilistic inspection of damage (RAPID) technique was applied to the containment liner plate to verify and visualize the de-bonding condition. The results obtained using the tomography image indicated that the Lamb wave-based RAPID algorithm was capable of delineating debonding areas.

• Journal of Welding and Joining
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• 제22권3호
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• pp.62-68
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• 2004

The strip Au bumps are bonded using longitudinal ultrasonic far the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the finite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are deformed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.1309-1310
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• 2010

• Journal of the Korean Wood Science and Technology
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• 제46권1호
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• pp.85-92
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• 2018

소경각재를 이용한 소경각재 적층목을 기둥-보 목조건축 구조재로 이용하기 위해선 장대재 제작이 가능하여야 한다. 본 연구에서는 낙엽송 소경각재의 종접합 성능평가를 실시하였다. 시험편들은 종접합 방법에 따라 6가지 형상으로 제작하였으며 인장 및 휨 강도시험으로 종접합성능을 검토하였다. 종접합 접합부의 인장시험에서 Lap 시험편의 인장강도는 Double Lap 시험편보다 양호하였으며, Scarf 시험편의 인장강도는 Hooked scarf 시험편보다 양호하였다. Rod 시험편의 인장강도는 3.6 MPa로 가장 양호하였다. 종접합 접합부의 휨 시험결과 봉형 GFRP를 삽입 접착한 시험편들은 평균 29 MPa의 휨 파괴계수가 측정되었으며, 타 접합부 시험편들은 11 MPa 이하의 휨 파괴계수 값이 관찰되었다. 봉형 GFRP (Glass Fiber Reinforced Plastic)를 삽입 접착한 시험편들은 인성파괴가 관찰되었고 나머지 시험편들은 취성파괴가 발생하였다. Rod + Lap 시험편의 평균 휨 파괴계수가 30.5 MPa로 종접합한 시험편 중 가장 양호한 성능을 발휘하였다. Rod + Lap 시험편의 휨 강도는 종접합하지 않은 대조군 시험편 휨 파괴계수의 66%에 해당되었다. 낙엽송 소경각재 종접합 방법으로 봉형 GFRP 삽입 접착이 가장 유효한 강도를 나타내는 것을 확인하였다.

• Journal of Welding and Joining
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• 제22권1호
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• pp.65-70
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• 2004

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 추계학술대회논문집
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• pp.578-582
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• 2007

In this paper, vibration modes and frequencies of a ring-type stacked piezoelectric actuator for a wire bonding transducer system are analyzed using FEM simulations. We implement experiments using a commercial product model of the actuator PZT module which consists of 6 layer ring-type PZT and 7 electrodes, combined bolts, nut and tinut. There are two main results: One is that FEM analysis should consider the effect the harmonic voltage input in order to meet the experimental results. The other is that the current wire bonder using exciting frequency of 136 kHz should be modified in order to improve the actuator and bonding performance because the actuator module has the main longitudinal mode of 145 kHz.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 춘계학술발표대회 개요집
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 추계학술대회논문집
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• pp.583-588
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• 2007

This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.