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Three-Dimensional Standard Curves in Induced Polarization Method (IP법(法)의 3차원(次元) 표준곡선(標準曲線))

  • Kim, Hee Joon
    • Economic and Environmental Geology
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    • v.16 no.4
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    • pp.269-276
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    • 1983
  • This paper describes three-dimensional (3-D) standard curves for single prismatic buried bodies in induced polarization (IP) method. Dipole-dipole IP responses for the bodies are calculated by the numerical modeling technique using an integral equation solution. The pattern of IP responses for conductive targets depends on the ratio of the width of body to the depth extent. The IP response of a body of six units in strike length approximates that of a two-dimensional body. In addition, if the strike length is long enough, a layered-earth interpretation is applicable for a body much longer than four units in width. Moving an IP line away from the center of a body alon gstrike produces an effect similar to that of increasing the depth. Moving the location of body along line has little effect to the pattern of IP responses.

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The Micro Coil Production through Research on the Additive Conditions of Electrochemical Metal 3D Printer (전기화학적 금속 3D 프린터의 적층 조건 연구를 통한 마이크로 코일 제작)

  • Kim, Young-Kuk;Kang, Donghwa;Kim, Sung-Bin;Yoo, Bongyoung
    • Journal of the Korean institute of surface engineering
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    • v.53 no.4
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    • pp.138-143
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    • 2020
  • In this study, we produced a coil of micro-pattern that can be used for electromagnetic wave absorber, heating material, wireless charging, sensor, antenna, etc. by using electrochemical additive manufacturing method. Currently, it contains research contents for manufacturing a micro pattern coil having practicality through control of process control variables such as applied voltage, distance between electrode, and nozzle injection. Circulation of the electrolyte through the nozzle injection control can significantly contribute to improving the surface characteristics of the coil because of minimizing voltage fluctuations that may occur during the additive manufacturing process. In addition, by applying the pulse method in the application of voltage, the lamination characteristics of the plated body were improved, which showed that the formation of a fine line width plays an important role in the production of a micro pattern coil. By applying the pulse signal to the voltage application, the additive manufacturing characteristics of the produced product were improved, and it was shown that the formation of a fine line width plays an important role in the production of a micro pattern coil.

Challenges in the Production of Thin Coatings at High Line Speed

  • Michel, Dubois;Luc, Warichet;Jose, Callegari
    • Corrosion Science and Technology
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    • v.9 no.1
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    • pp.1-7
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    • 2010
  • Cost reduction of products is and will always be a key objective of industrials. However, it is well identified that the wiping process reaches its limits at high line speed in general and especially thin coatings. If wiping models predict that it is possible to reach 32-37 g/$m^2$ of pure Zinc at 180 m/min provided the nozzle to strip distance can be reduced to 6mm, the possibility to reach that process window industrially with sufficient robustness is debated. 3 key problems are reviewed and analyzed: Zinc splashing and liquid drop emissions of various forms, the production of skimming and the noise generated by the nozzles. The available data and models are firstly used to predict phenomena. Secondly, videos and pictures from the lines showing what really happens on the edges especially in case of a strip width change are analyzed. Whereas the predicted level of skimming to remove from the pot is expected very high, it turns out that the target may be very close to the full splashing phenomena and that the most critical industrial situation is related to strip specification changes. It is then expected that the industrial feasibility of the 32-37 g/$m^2$ at 180 m/min will depend strongly on the amount of incoming strip with the same width that can be processed continuously.

Statistical Studies Based on SiO and $H_2O$ Maser Survey toward Evolved Stars

  • Kim, Jaeheon;Cho, Se-Hyung;Kim, Sang-Joon
    • The Bulletin of The Korean Astronomical Society
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    • v.37 no.2
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    • pp.237.1-237.1
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    • 2012
  • We report extensive statistical analyses based on the simultaneous observational results of SiO and $H_2O$ masers toward 166 known both SiO and $H_2O$ maser sources (Kim et al. 2010), 83 known SiO maser sources (Cho & Kim 2012 submitted), and 152 known $H_2O$ maser sources (Kim et al. 2012 in preparation). We investigate mutual relations between SiO and $H_2O$ maser properties (peak and total flux density ratios, full line width ratios, and velocity structures etc.) according to stellar pulsation phases and type of evolved stars. These statistical results are compared with monitoring observational results of some individual stars. In addition, a relation between the full line width of SiO/$H_2O$ masers and stellar mass loss rates is examined. For 401 observed stars, we also investigate characteristics of SiO and $H_2O$ maser properties related with evolutionary stages in the IRAS two-color diagram.

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Investigation of Thermal Behavior Characteristic in Chemical Mechanical Polishing Performance (CMP 결과에 영향을 미치는 열적거동 특성에 관한 연구)

  • Jeong, Young-Seok;Kim, Hyoung-Jae;Choi, Jae-Young;Kim, Goo-Youn;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.1283-1287
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    • 2004
  • The design rules are being more strict with requirement of operation speed and development of IC industry. For this reason, required minimum line-width has been narrowed under sub-micron region. As the length of minimum line-width is narrowed, local and global planarization are being prominent. CMP(Chemical-Mechanical Polishing), one of the planarizarion technology, is a process which polishes with the ascent of chemical reaction and relative velocity between pad and wafer without surface defects. CMP is performed with a complex interaction among many factors, how CMP has an interaction with such factors is not evident. Accordingly, the studies on this are still carrying out. Therefore, an examination of the CMP phenomena and an accurate understanding of compositive factors are urgently needed. In this paper, we will consider of the relations between the effects of temperature which influences many factors having an effect on polishing results and the characteristics of CMP in order to understand and estimate the influence of temperature. Then, through the interaction of shown temperature and polishing result, we could expect to boost fundamental understanding on complex CMP phenomena.

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Effect of Phonons on Valley Depolarization in Monolayer WSe2

  • Chellappan, Vijila;Pang, Ai Lin Christina;Sarkar, Soumya;Ooi, Zi En;Goh, Kuan Eng Johnson
    • Electronic Materials Letters
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    • v.14 no.6
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    • pp.766-773
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    • 2018
  • In this paper, temperature dependence of the excitonic bands in a mechanically exfoliated tungsten diselenide ($WSe_2$) monolayer is studied using photoluminescence and circular dichroic photoluminescence (PL) in the temperature range between 8 and 300 K. The peak energies associated with the neutral exciton (A), charged exciton (trion) and localized excitons are extracted from the PL spectra revealing a trion binding energy of around 30 meV. The circular dichroic PL measured at 8 K shows about 45% valley polarisation that sharply reduces with increasing temperature to 5% at 300 K with photoexcitation energy of 1.96 eV. A detailed analysis of the emission line-width suggests that the rapid decrease of valley polarisation with the increase of temperature is caused by the strong exciton-phonon interactions which efficiently scatter the excitons into different excitonic states that are easily accessible due to the supply of excess photoexcitation energy. The emission line-width broadening with the increase of temperature indicate residual exciton dephasing lifetime < 100 fs, that correlates with the observed rapid valley depolarisation.

Design and Implementation of BPF Using a Symmetric Coupled Line (대칭형 결합선로를 이용한 BPF의 설계 및 구현)

  • Kang, Sang-Gee;Choi, Heung-Taek;Lee, Jae-Myung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.7
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    • pp.1255-1260
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    • 2009
  • Microstrip interdigital filter is designed with the width and length of a resonator, the gap distance between resonators and the location of a tap. When designing filters, it is a benefit to design with few design parameters comparing to many design parameters. In this paper we design and implement two microstrip interdigital filters operating in the UWB(Ultra Wide-Band) frequency band, one using a fixed width of a resonator and the other using a different width of resonators. The test results of the implemented filters show that the low-band high filter with a fixed width has the insertion loss of 1.49dB, -10dB band width of 720MHz, -35.7dBattenuation at 4.8GHzand below -13dB of S11. The filter with a different width of resonators has the insertion loss of 1.6dB, -10dBbandwidth of 1.63GHz and below-8dBof S11.

A Study of Design and Analysis on the High-Speed Serial Interface Connector (고속 직렬 인터페이스 커넥터의 설계 및 분석에 대한 연구)

  • Lee, Hosang;Shin, Jaeyoung;Choi, Daeil;Nah, Wansoo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.12
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    • pp.1084-1096
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    • 2016
  • This paper presents method of design and analysis of a high-speed serial interface connector with a data rate of 12.5 Gbps. A high-speed serial interface connector is composed of various material and complex structures. It is very difficult to match the impedance of each discontinuous portion of connector. Therefore, this paper proposes the structure of a connector line that be simplified a connector. In the structure of proposed connector line, this research presents a method for extracting R, L, C and G parameters, analyzing the differential mode impedance, and minimizing the impedance discontinuity using time domain transmissometry and time domain reflectometry. This paper applies the proposed methods in the connector line to the high-speed serial interface connector. The proposed high-speed serial interface connector, which consists of forty-four pins, is analyzed signal transmission characteristics by changing the width and spacing of the four pins. According to the analysis result, as the width of the ground pin increases, the impedance decreases slightly. And as the distance between the ground pin and the signal pin increases, the impedance increases. In addition, as the width of the signal pin increases, the impedance decreases. And as the distance between the signal pin and the signal pin increases, the impedance decreases. The impedance characteristic of initial connector presents ranges from 96 to $139{\Omega}$. Impedance characteristic after applying the structure of proposed connector is shown as a value between 92.6 to $107.5{\Omega}$. This value satisfies the design objective $100{\Omega}{\pm}10%$.

Development of Upper Bodice Pattern for the Late Elementary Obese- Schoolgirls - Using iVirds 3.0 PB and iVirds 3.0 DS program - (아동후기 비만여아의 상반신 원형 설계 - iVirds 3.0 PB 및 iVirds 3.0 DS 프로그램 적용 -)

  • Lim, Jiyoung
    • Fashion & Textile Research Journal
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    • v.16 no.6
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    • pp.921-926
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    • 2014
  • The aim of this study is to develop upper bodice pattern for obese girls aged 10~12 by using 3D virtual garment simulation system. The criteria for subjects in this study were girls who had over 1.46 of the R$\ddot{o}$hrer Index. A total of 229 schoolgirls who met these criteria were enrolled. The results of this study are as follows: First, by using 3D virtual garment simulation, new upper bodice pattern considered obese-schoolgirls was development. The basic numerical formula were as follows ; bust girth B/2+4.5, armhole depth B/4-1, waist girth W/4+0.5+dart amount, front chest width B/6+2, back width B/6+2, neck width B/12-0.5 and neck depth B/12+0.5. Second, armhole darts were added to compensate the loose amount of front armhole and dart manipulation was used to ensure a better appearance on armhole in the design. The dart side line was modified concavely to help cover the protruding stomach. Curved lines on the armhole were significantly relieved using dart manipulation and the darts side line was modified concavely to reduce the tightness around the front waist darts. Third, according to the results of the new upper bodice pattern's appearance evaluation, it estimated more highly than existing pattern in silhouette and ease amount, confirming that new upper bodice pattern was appropriate for the obese-schoolgirls. This study is expected to serve as one of important basic data for ensuing studies that may utilize 3D virtual garment simulation system with 2D patterns.

Design of US PCS Duplexer for wireless systems (무선 시스템용 US PCS FBAR Duplexer 설계)

  • Lee, Eun-Kyu;Choi, Hyung-Rim
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.210-211
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    • 2009
  • In this study, we propose characteristics improvement methods according to via hole plating method for FBAR Duplexer with US PCS($T_x$:1850MHz~1910MHz, $R_x$:1930MHz~1990MHz) bandwidth which is used for wireless systems. Also, we designed and fabricated 3.8*3.8*1.8mm size microminiature FBAR Duplexer based on this proposal. First of all, in this study, we fabricated pentagon shape resonators by different size to make filter combination, and their quality factor(Q) are 687 with 6.6% of $k_{eff}^2$. Using this resonators, designed 3*2Type $T_x$ filter and 3*4Type $R_x$ filter. The transmission line, which works as phase shifter, is designed with $210{\mu}m$ in width and 18mm in length Stripline type. Inductor, which is used for matching component, is designed with width of $75{\mu}m$, a technically achievable minimum width. And adopted plating method of filling via hole with conductive epoxy for improved grounding and thermal conductivity. Using these configuration with all of the matching component values, we found Duplexer characteristics of -1.57dB ~ -1.73dB in insertion loss, -56dB in attenuation at 1850MHz~1910MHz of $T_x$ band. Also, found -2.71 dB ~ -3.23dB in insertion loss, -58dB in attenuation at 1930MHz~1990MHz of $R_x$ band.

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