• The Korean Journal of Malacology
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• v.17 no.1
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• pp.13-18
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• 2001

The relationship between shell length and ring radius in each ring group was expressed as a regression line. Therefore, there is a correspondence in each ring formation. Based on the monthly variation of the marginal index (Ml') of the shell, it is assumed that the ring of this species was formed once a year during the period of August to October, and the main period of the annual ring formation was August through September. The relationship between shell length (SL) and total weight (TW) was expressed by the equation TW = 2.2476 $\times$ 10$^{-5}$ SL$^{3.536}$ ($r^2$= 0.90). Shell length (SL) and shell height (SH; mm) were highly correlated with the equation SH = 0.7545 SL - 0.0145 ($r^2$= 0.93). The shell length (SL)-shell width (SW) relation was expressed by the equation SW = 0.5336 SL- 2.4253 ($r^2$= 0.87). Growth curves for shell length and total weight fitted to the von Bertalanffy's equation were expressed as follows: SL$_{t}$ =60.02[1 - e$^{-0.6458(t-0.3895)}$ ], Twt = 43.63[1 - e$^{0.6458(t-0.3895)}$ ]$^{3.536}$ .

• The Korean Journal of Malacology
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• v.21 no.1
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• pp.57-64
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• 2005

Samples of Corbicula japonica Prime of Jujin estuary in Gochang were collected from July 2000 to September 2001. Age of C. japonica was determined from the rings on the shell. The relationship between shell length and ring radius in each ring group was expressed as a regression line. Therefore, there is a correspondence in each ring formation. Based on the monthly variation of the marginal index (MI') of the shell, it is assumed that the ring of this species was formed once a year during the period of February and March. The relationship between shell length (SL; mm) and total weight (TW; g) was expressed by the following equation: TW = 1.0942 ${\times}10^{-4}SL^{3.3217}$ ($r^2$ = 0.9905). Shell length (SL) and shell height (SH; mm) was highly correlated with shell height as the following equation: SH = 0.9174 SL - 0.9935 ($r^2$ = 0.9885). The shell length (SL) - shell width (SW) relation was also expressed by the following equation; SW = 0.5925 SL - 1.1706 ($r^2$ = 0.9726). Growth curves for shell length and total weight fitted to the von Bertalanffy's growth curve were expressed as: $$SL_t = 46.4861[1-e^{-0.3383(t+0.0958)}]$$, $$TW_t = 34.54[1-e^{-0.3383(t+0.0958)}]^3.3217$$.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.10
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• pp.23-30
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• 1999

We experimented on the sub 50nm patterning using E-beam lithography system. SAL601 negative E-beam resist was used for this experiment. In order to utilize the maximum ability of E-beam system, firstly, we reduced the PR thickness to 100nm, and the field size to 200 ${um}m$. Then PEB (Post Expose Bake) time/temperature, which is one of the very important factors when SAL601 is used, were reduced for minimum line width. In addition, digitizing is optimized for better results. Quantum wire and quantum dot which can be used for nanoscale memory device, such as single electron memory device, are fabricated using these developed lithography techniques.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.38 no.5
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• pp.70-78
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• 2001

We have developed a novel driving system of 5' true color FED using voltage controlled PWM method which has current control effect. The proposed method has the advantage of voltage controlled pulse width modulation method and current control method. Also, we propose a new circuit model of FED subpixel for circuit simulation of FED driving circuits, considering some parasitic effects, i.e., cross talk, line coupling effect and leakage current to the adjacent cathode lines. Output stage of the data driving circuit is optimized using the proposed circuit model. In video data processing, FED controller uses the parallel processing of R.G.B input data, so duty ratio is maximized and brightness of FED increases. With this results, no noise and high quality performance is achieved in display of 5' true color FED.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.3 s.357
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• pp.98-104
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• 2007

In this paper, the dual-band open loop antenna using a strip conductor for the RFID reader and Wireless LAN Application, which has a resonant frequency at 910MHz and 2.45 GHz, is proposed. Input impedance of antenna is matched with the feed line of 50 ohm by varying the length and width of sip conductor making up the antenna. The gain and directivity of antenna is enhanced as tuning the length of strip, and as also grooving the teeth shapes on the strip conductor. The size of fabricated antenna is $75mm\times100mm$. The return loss and the gain of fabricated antenna are -11.92 dB, 3.02 dBi at 910 MHz and -21.31 dB, 4.08 dBi at 2.45 GHz, respectively.

• The Journal of the Korea institute of electronic communication sciences
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• v.12 no.4
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• pp.539-544
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• 2017

In this paper, the broadband patch antenna for human counting systems is designed and fabricated using by the air dielectric substrate. Proposed antenna has a patch structure of the square structure with a 5 mm air layer and the vertical connection between the patch antenna and CPW feeding line is realized the stepped impedance structure. Optimized antenna through a 3D EM simulator is fabricated on a jig by manufacturing an antenna jig using a 3D printer with a size of 16.6 * 16.6 * 5 mm3. Proposed antenna is measured with the maximum gain of 5.71 dBi and the VSWR of below 2:1 at a frequency of 7.2 to 9.8 GHz. Also, a half power beam width characteristic of the antenna is measured $70^{\circ}$.

• The Bulletin of The Korean Astronomical Society
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• v.39 no.2
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• pp.78.2-78.2
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• 2014

MIRIS (Multi-purpose Infrared Imaging System) is the primary payload on the Korean science and technology satellite, STSAT-3, which was launched on 2013 November 21. It is designed to observe the near-infrared sky with a $3.67^{\circ}{\times}3.67^{\circ}$ field of view and a $51.6^{{\prime}{\prime}}{\times}51.6^{{\prime}{\prime}}$ pixel resolution. Using two narrow-band filters at $1.88{\mu}m$ (Pa ${\alpha}$ line) and $1.84+1.92{\mu}m$ (Pa ${\alpha}$ dual continuum), the Paschen ${\alpha}$ Galactic plane survey has been carrying out, and the area for the Galactic longitude from $+280^{\circ}$ to $+100^{\circ}$ (with the width of $-3^{\circ}$ < b < $+3^{\circ}$) has been covered by 2014 August 31. In this contribution, we present the preliminary results of the MIRIS Paschen ${\alpha}$ emission maps and compare them with other wavelength maps such as $H{\alpha}$ and dust maps. Many of the Paschen ${\alpha}$ features have been detected along the plane, and some of them are weak or invisible in the $H{\alpha}$ map and coincide well with dense cloud regions.

• Journal of the Korean Institute of Intelligent Systems
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• v.14 no.4
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• pp.506-511
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• 2004

Biometrics is getting more and more attention in recent years for security and other concerns. So far, only fingerprint recognition has seen limited success for on-line security check, since other biometrics verification and identification systems require more complicated and expensive acquisition interfaces and recognition processes. Hand-Geometry has been used for biometric verification and identification because of its acquisition convenience and good performance for verification and identification performance. Hence, it can be a good candidate for online checks. Therefore, this paper proposes a Hand-Geometry recognition system based on geometrical features of hand. From anatomical point of view, human hand can be characterized by its length, width, thickness, geometrical composition, shapes of the palm, and shape and geometry of the fingers. This paper proposes thirty relevant features for a Hand-Geometry recognition system. However, during experimentation, it was discovered that length measured from the tip of the finger was not a reliable feature. Hence, we propose a new technique based on Genetic Algorithm for extraction of the center of nail bottom, in order to use it for the length feature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.3
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• pp.194-198
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• 2010

Recently as the electronic devices are getting to be more and more smaller, transformers are needed to be micro fabricated using MEMS technology. In this paper transformers have been fabricated and measured by depositing insulation layer to reduce the loss of eddy current and in the middle core a high permeability permalloy was designed based on the turns ratio between primary coil and secondary coil which are 1:1 transformers. (the number of turns of primary coil and secondary coil: 3/3, 5/5, 7/7). The size of the transformers including ground shield are $1mm{\times}1.5mm$, $1mm{\times}1.95mm$, $1mm{\times}2.35mm$ respectively. The line width, pitch and the height of post are 50um. Based on the measured data from the micro fabricated transformers, the 3/3 turns in the primary coil and secondary coil showed the lowest insertion loss with 1.5 dB at 480 MHz and the 7/7 turns in the primary coil and secondary coil showed the highest insertion loss with 2.5 dB at 280 MHz. Also confirmed that the bandwidth goes up as the number of turns goes down. There was some difference between the actual measured data and the HFSS simulation result. It looks as if it is an error of the difference between oxidation of copper or the permeability of SU-8.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.