• Structural Engineering and Mechanics
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• v.53 no.4
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• pp.781-790
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• 2015

We apply higher-order beam theory to analyze the deflections and stresses of a cantilevered single leaf flexure in bending. Our equations include shear deformation and the warping effect in bending. The results are compared with Euler-Bernoulli and Timoshenko beam theory, and are verified by finite element analysis (FEA). The results show that the higher-order beam theory is in a good agreement with the FEA results, with errors of less than 10%. These results indicate that the analysis of the deflections and stresses of a single leaf flexure should consider the shear and warping effects in bending to ensure high precision mechanism design.

• Structural Engineering and Mechanics
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• v.59 no.3
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• pp.527-537
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• 2016

We describe a stress analysis of a single leaf flexure under torsion in which the warping effect is considered. The theoretical equations for the warping normal stress (${\sigma}_{xx}$) and shear stresses (${\tau}_{xz}$ and ${\tau}_{xy}$) are derived by applying the warping function of a rectangular cross-sectional beam and the twist angle equation that includes the warping torsion. The results are compared with those of the non-warping case and are verified using finite element analysis (FEA). A sensitivity analysis over the length, width, and thickness is performed and verified via FEA. The results show that the errors between the theory of warping stress results and the FEA results are lower than 4%. This indicates that the proposed theoretical stress analysis with warping is accurate in the torsion analysis of a single leaf flexure.

• Structural Engineering and Mechanics
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• v.54 no.1
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• pp.189-198
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• 2015

We present a torsion analysis of single-bent leaf flexure that is partially restrained, subject to a torsional load. The theoretical equations for the torsional angle are derived using Castigliano's theorem. These equations consider the partially restrained warping, and are verified using finite element analysis (FEA). A sensitivity analysis over the length, width, and thickness is performed and verified via FEA. The results show that the errors between the theory result and the FEA result are lower than 6%. This indicates that the proposed theoretical torsional analysis with partially restrained warping is sufficiently accurate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.393-394
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• 2008

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.171-176
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• 2021

Die-to-wafer (D2W) hybrid bonding in the multilayer semiconductor manufacturing process is one of wafer direct bonding, and various studies are being conducted around the world. A noteworthy point in the current die-to-wafer process is that a lot of voids occur on the bonding surface of the die during bonding. In this study, as a suggested method for removing voids generated during the D2W hybrid bonding process, a flexible mechanism for implementing convex for die bonding to be applied to the bond head is proposed. In addition, modeling of flexible mechanisms, analysis/design/control/evaluation of static/dynamics properties are performed. The proposed system was controlled by capacitive sensor (lion precision, CPL 290), piezo actuator (P-888,91), and dSpace. This flexure mechanism implemented a working range of 200 ㎛, resolution(3σ) of 7.276nm, Inposition(3σ) of 3.503nm, settling time(2%) of 500.133ms by applying a reverse bridge type mechanism and leaf spring guide, and at the same time realized a maximum step difference of 6 ㎛ between die edge and center. The results of this study are applied to the D2W hybrid bonding process and are expected to bring about an effect of increasing semiconductor yield through void removal. In addition, it is expected that it can be utilized as a system that meets the convex variable amount required for each device by adjusting the elongation amount of the piezo actuator coupled to the flexible mechanism in a precise unit.

• Korean Journal of Optics and Photonics
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• v.22 no.1
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• pp.46-52
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• 2011

A confocal microscope was developed utilizing a scanning sample stage based on a home-built double-compound flexure guide. A scanning sample stage with nano-scale resolution consisted of a double leaf spring based flexure, a displacement amplifying lever, a Piezo-electric Transducer(PZT) actuator and capacitance sensors. The performance of the two-axis stage was analyzed using a commercial finite element method program prior to the implementation. A single line laser was employed as the light source along with the Photo Multiplier Tube(PMT) that served as the detector. The performance of the developed confocal microscope was evaluated with a mouse ear skin imaging test. The designed scanning stage enabled us to build the confocal microscope without the two optical scanning mirror modules that are essential in the conventional laser scanning confocal microscope. The elimination of the scanning mirror modules makes the optical design of the confocal microscope simpler and more compact than the conventional system.

• Proceedings of the KAIS Fall Conference
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• 2010.11b
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• pp.638-641
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• 2010

본 논문에서는 나노 분해능을 가지면서 수mm의 이송능력을 가지는 AFM용 스캐너의 구현을 위하여 새로운 형태의 더블-벤트 유연 가이드를 연구하였다. Castigliano 이론을 이용하여 유연 가이드의 강성을 구하였으며, 모든 과정은 FEA(Finite Element Analysis)를 통하여 이론의 타당성을 검증하였다. 또한, 더블-벤트 유연 가이드의 성능 검증을 위하여 평면 스캐너의 모델링에 응용하여 보았다. 응용된 평면 스캐너의 구성 요소 성분 변수들은 Double-bent 유연 가이드의 나노 분해능 및 이송 변위의 최대화를 구현함과 동시에 빠른 응답 속도를 보장하기 위해 최적화 설계를 통하여 이루어졌다. 더블-벤트 유연 가이드를 적용한 평면 스캐너 역시 FEA를 통한 검증 단계를 거쳤다.

• Journal of the Semiconductor & Display Technology
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• v.2 no.2
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• pp.31-37
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• 2003

This paper presents a measurement system of mechanical property using dual servo system. There are many kinds of method to measure material properties such as tensile test, indention and bending test. It is highly required to measure the properties of nano-sized material and structure. However, It is need more accurate measurement system, more stable and frequency response than conventional test. In this paper, we designed the dual servo system for a measuring instrument The dual servo system consisting of a coarse stage and a fine motion stage with VCM and PZT is proposed. Mechanical mechanism is designed with the leaf spring type of flexure hinge joint. Lead compensator is applied to this control system, and is designed by PQ method.