• Korean Journal of Heritage: History & Science
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• v.47 no.4
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• pp.224-243
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• 2014

This study examined the materials and casting technology(cast, alloy, etc.) used in the manufacturing of bronze artifacts based on old literature such as Yongjae Chonghwa, Cheongong Geamul, and The Korea Review. In the casting experiment for restoration of Sangpyong Tongbo, a bronze and brass mother coin mold was made using the sand mold casting method described in The Korea Review. The cast was comprised of the original mold plate frame, wooden frame, and molding sand. Depending on the material of the outer frame, which contains the molding sand, the original mold plate frame can be either a wooden frame or steel frame. For the molding sand, light yellow-colored sand of the Jeonbuk Iri region was used. Next, the composition of the mother alloy used in the restoration of Sangpyong Tongbo was studied. In consideration of the evaporation of tin and lead during actual restoration, the composition of Cu 60%, Zn 30%, and Pb 10% for brass as stated in The Korea Review was modified to Cu 60%, Zn 35%, and Pb 15%. For bronze, based on the composition of Cu 80%, Sn 6%, and Pb 14% used for Haedong Tongbo, the composition was set as Cu 80%, Sn 11%, and Pb 19%. The mother coin mold was restored by first creating a wooden father coin, making a cast from the wooden frame and basic steel frame, alloying, casting, and making a mother coin. Component analysis was conducted on the mother alloy of the restored Sangpyong Tongbo, and its primary and secondary casts. The bronze mother alloy saw a 5% increase in copper and 4% reduction in lead. The brass parent alloy had a 5% increase in copper, but a 4% and 12% decrease in lead and tin respectively. Analysis of the primary and secondary mother coin molds using an energy dispersive spectrometer showed that the bronze mother coin mold had a reduced amount of lead, while the brass mother coin mold had less tin. This can be explained by the evaporation of lead and tin in the melting of the primary mother coin mold. In addition, the ${\alpha}$-phase and lead particles were found in the mother alloy of bronze and brass, as well as the microstructure of the primary and secondary coin molds. Impurities such as Al and Si were observed only in the brass mother coin mold.

• Journal of Conservation Science
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• v.26 no.2
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• pp.157-169
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• 2010

This study focused on the material characteristics and archaeometric relationship between the molten glass and bronze materials within the crucibles and gilt-bronze Bodhisattva statue excavated from the Ssangbukri site in Buyeo, Korea. Yellowish green to red brown vitreous material in the crucibles was identified as lead glass which contained scarce amount of BaO, and low $Al_2O_3$ and CaO. Metallic molten material was identified as bronze of copper-tin-lead alloy with low amount of impurities that indicated well-refined materials. Also, cassiterite was used for raw metal ore of tin. The Bodhisattva statue consisted of major copper with trace impurities in the core metal, and gold amalgam in the gilded layer. Though lead isotopic analysis showed contradictory results in each lead glass, bronze and Bodhisattva statue that required further examination, it could be stated that the statue was made in the Ssangbukri site based on the high-level technical skills of bronze production.

• Mass Spectrometry Letters
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• v.4 no.4
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• pp.87-90
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• 2013

Isotope amount ratios of lead in a bronze sample have been successfully determined using multicollector inductively coupled plasma mass spectrometry (MC-ICP-MS). Matrix separation conditions were tested and optimized using ion exchange chromatography with anion-exchange resin, AG1-X8, and sequential elution of the 0.5 M HBr and 7 M $HNO_3$ to separate lead from very high contents of copper and tin in bronze matrix. Mercury was also removed efficiently in the optimized separation condition. The instrumental isotope fractionation of lead in the MC-ICP-MS measurement was corrected by the external standard sample bracketing method using an external standard, NIST SRM 981 lead common isotope ratio standard followed by correction of procedure blank to obtain reliable isotope ratios of lead. The isotope ratios, $^{206}Pb/^{204}Pb$, $^{207}Pb/^{204}Pb$, $^{208}Pb/^{204}Pb$, and $^{208}Pb/^{206}Pb$, of lead were determined as $18.0802{\pm}0.0114$, $15.5799{\pm}0.0099$, $38.0853{\pm}0.0241$, and $2.1065{\pm}0.0004$, respectively, and the determined isotope ratios showed good agreement with the reference values of an international comparison for the same sample within the stated uncertainties

• Journal of applied mathematics & informatics
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• v.12 no.1_2
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• pp.419-427
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• 2003

We have developed and analyzed numerically a simple ordinary differential equation for a mush. Numerical solutions illustrate that the solid fraction at the bottom of the mush increases and the depth of the mush decreases when convection increases. The results are consistent to those observed in experiments with aqueous solutions of ammonium chloride（Loper ＆ Roberts［11］, Chen & Chen［2］, Tait ＆ Jaupart［11］）and in experiments with lead-tin alloys（Hellawell etc.［6］）.

• Journal of the Korean institute of surface engineering
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• v.24 no.2
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• pp.88-95
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• 1991

The tin-lead alloy was electrodeposited in the low range of peak current density in order to investigate the change of composition and microstructure of them. The Pb content of alloy deposits, which was decreased with increasing average current density, was relatively lower than that of D.C. plated alloy deposit. The preferred orientation of alloy deposit was changed with increasing peak current density and the surface morphology of alloy deposits was closely related to the preferred orientation of them.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.147-163
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• 2003

European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

• Asian Pacific Journal of Cancer Prevention
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• v.16 no.8
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• pp.3085-3090
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• 2015

The telomeric end structures of the DNA are known to contain tandem repeats of TTAGGG sequence bound with specialised protein complex called the "shelterin complex". It comprises six proteins, namely TRF1, TRF2, TIN2, POT1, TPP1 and RAP1. All of these assemble together to form a complex with double strand and single strand DNA repeats at the telomere. Such an association contributes to telomere stability and its protection from undesirable DNA damage control-specific responses. However, any alteration in the structure and function of any of these proteins may lead to undesirable DNA damage responses and thus cellular senescence and death. In our review, we throw light on how mutations in the proteins belonging to the shelterin complex may lead to various malfunctions and ultimately have a role in tumorigenesis and cancer progression.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• Conservation Science in Museum
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• v.21
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• pp.17-28
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• 2019

The term jinjuseon(眞珠扇), meaning literally a pearl fan, refers to a fan decorated with precious stones for use in royal wedding ceremonies. This study examined a jinjuseon housed in the National Palace Museum of Korea (NPMK) which currently lacks jeweled ornaments. In order to determine whether pearls or other gemstone settings originally ornamented the fan,the surface and composition of the gray materials remaining on the washers were investigated and the fan was compared with other artifacts decorated using similar techniques. The analysis revealed that the gray materials visible around the round rims of the washers contain tin-lead alloys. The traces of folded nails suggest that soldering was not applied. The remains of the infill observed in other artifacts with bezel settings indicate that this jinjuseon in the NPMK collection was produced using abezel setting technique wherein pearls or other gemstones were affixed by filling cylindrical bezels with tin-lead alloys.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1142-1149
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• 2003

The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.