• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1650-1653
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• 2007

We demonstrate fluorescent green organic lightemitting diodes employing a rhenium oxide ($ReO_3$)-doped N,N-diphenyl-N,N'-bis(1,1'-biphenyl)-4,4'-diamine (NPB) hole transporting layer (HTL). The devices exhibit significantly reduced driving voltages as well as prolonged lifetime. Details of $ReO_3$ doping effects are described in terms of charge transfer complex and stabilization of HTL morphology.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.37-40
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• 2001

This paper presents the modeling methodology of Zinc diffusion process applied for high-speed avalanche photodiode fabrication using neural networks. Three process factors (sealing pressure, amount of Zn$_3$P$_2$ source per volume, and doping concentration of diffused layer) are examined by means of D-optimal design experiment. Then, diffusion rate and doping concentration of Zinc in diffused layer are characterized by a static response model generated by training fred-forward error back-propagation neural networks. It is observed that the process models developed here exhibit good agreement with experimental results.

• 한국결정성장학회지
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• 제7권2호
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• pp.271-275
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• 1997

HWE방법으로 GaAs 기관위에 Cl이 첨가된 ZnSe 박막을 성장하였다. 성장된 박막의 표면 상태는 경면이 있었으며 좋은 결정성과 낮은 비저항 n 형 전도성을 나타내었다. 성장된 박막의 운반자 농도는 $10^{16}Cm{-3}$ 정도였으며 비저항값은 10$\\Omega$\cdotcm였다. 실온에서 청색 발광을 하는 photoluminescence를 나타내었다. 나타내었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1057-1059
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• 2008

Study of the ion-induced-, photo- and exo-electron emission from a Sc doped MgO protective layer has been performed. It is established that doping with Sc increases photo- and especially exo-electron emission from MgO films while the ion-induced electron emission coefficient $\gamma$ stays unchanged.

• 한국전기전자재료학회논문지
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• 제15권11호
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• pp.969-975
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• 2002

Thin film transistors(TFT) were made based on the polycrystalline Si (poly-Si) crystallized by sequential lateral solidification(SLS) method. The electrical characteristics of the devices were analyzed. n-type TFTs did not show a superior characteristics compared to p-type TFTs. We analyzed the causes of the failure by focused ion beam(FIB) analysis and automatic spreading resistance(ASR) measurement, to study the structural integrity and the doping distribution, respectively. FIB showed no structural problems but it revealed a non-intermixed layer in the contact holes between the polysilicon and the aluminum electrode. ASR analyses on poly-Si layer with various doping concentrations and activation temperatures showed that the inadequately doped areas were partially responsible for the inferior behavior of the whole device.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.347-347
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• 2010

In other to progress better crystallization transition and long phase-transformation data of phase-change memory (PRAM), we investigated about the effect of Sb doping and Ag ions percolating into Ge-Se-Te phase-change material. Doped Sb concentrations was determined each of 10 wt%, 20 wt% and 30 wt%. As the Sb-doping concentration was increased, the resistivity decreased and the crystallization temperature increased. Ionization of Ag was progressed by DPSS laser (532 nm) for 1 hour. The resistivity was more decreased and the crystallization temperature was more increased in case of adding Ag layer under Sb-(Ge-Se-Te) thin film. At the every condition of thin films included Ag layer more stable states were indicated compare with just Sb-doped Ge-Se-Te thin films.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.181-182
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• 2011

Phase-change materials can be cycled by exposure to laser beam, and as a function of the pulse intensity and duration, the laser beam triggers the switching from crystalline to amorphous phase and back. In other to progress better crystallization transition and amorphization long phase-transformation data of phase-change memory (PRAM), we investigated about the effect of Sb doping and Ag ions percolating into Ge-Se-Te phase-change material. Doped Sb concentrations was determined each of 10, 20 and 30 wt%. As the Sb-doping concentration was increased, the resistivity decreased and the crystallization temperature increased. Ionization of Ag was progressed by DPSS laser (532 nm) for 1 hour. The resistivity was more decreased and the crystallization temperature was more increased in case of adding Ag layer under Sb-(Ge-Se-Te) thin film. At the every condition of thin films included Ag layer more stable states were indicated compare with just Sb-doped Ge-Se-Te thin films.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1988년도 전기.전자공학 학술대회 논문집
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• pp.324-327
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• 1988

The photovoltaic performances of a-si : H$n^{+}-p-p^{+}$ solar cells have been investigated. The optimum substrate temperature for the deposition of a-Si : H $n^{+}-p-p^{+}$ cell decreases with increasing doping concentration of the p-layer, and is less than 200$^{\circ}C$ when the gas phase doping concentration is higher than 10 ppm. The results can be explained as the dependences of substrate temperature for the relaxation of silicon atoms and for the bonded hydrogen concentration in the p-layer.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.216-219
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• 2007

Effects of aging treatment of doped-MgO electron emission layer on luminance efficiency of ac-PDP were investigated in this study. Morphological and luminance efficiency with aging treatment were examined, especially with emphasis on the effects of doping elements. The results indicate that the luminance efficiency of test panels depends on the type of doping elements used for MgO and that may be due to the redeposition of MgO during glow discharge.

• 한국표면공학회지
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• 제28권3호
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• pp.174-181
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• 1995

Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin film processes and epitaxial layer growth and silicon wet etching techniques. We investigated silicon etch rate in 1-3-10 etchant as functions of doping concentration, surface mechanical stress and crystal defects. The experimental results indicate that silicon etch rate in 1-3-10 etchant is strong functions of doping concentration and crystal defect density rather than surface mechanical stress. We suggested the new fabrication processes of multilayered silicon cantilever beams.