• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.54-61
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• 1998

A new Triple well structure is proposed for improved latch-up immunity at deep submicron CMOS device. Optimum latch-up immunity process condition is established and analyzed with varying ion implantation energy and amount of dose and also compared conventional twin well structure. Doping profile and structure are investigated using ATHENA which is process simulator, and then latch-up current is calculated using ATLAS which is device simulator. Two types of different process are affected by latch-up characteristics and shape of doping profiles. Finally, we obtained the best latch-up immunity with 2.5[mA/${\mu}{m}$] trigger current using 2.5 MeV implantation energy and 1$\times$10$^{14}$ [cm$^{-2}$ ] dose at p-well

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.1
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• pp.54-57
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• 2005

A soft error rate neutrons is a growing problem fur terrestrial integrated circuits with technology scaling. In the acceleration test with high-density neutron beam, a latch-up prohibits accurate estimations of the soft error rate (SER). This paper presents results of analysis for the latch-up characteristics in the circumstance corresponding to the acceleration SER test for SRAM. Simulation results, using a two-dimensional device simulator, show that the deep p-well structure has better latch-up immunity compared to normal twin and triple well structures. In addition, it is more effective to minimize the distance to ground power compared with controlling a path to the $V_{DD}$ power.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1111-1113
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• 1995

To improve latch up characteristics of IGBT, this paper proposed new structure with reverse channel. IGBT proposed by this paper were designed on SOI substrate, $p^+$-substrate, and $n^+$-substrate, respectively. As a result of the simulation, we had achieved high latch up voltage and high conduction current density at IGBT with proposed structure. Latch up voltage of Conventional IGBT was 2.5V but IGBT with proposed structure was latched up at $5{\sim}94V$, respectively. And was showed high conduction current desity($10^4{\sim}10^7A/cm^2$)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.865-868
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• 2001

We designed and fabricated a planner-type thermoelastic microactuator with a latch-up operation for optical switching. Latch-up actuation is prerequisite to implement an optical switch with low power consumption and high reliability. The proposed microactuator consists of four cantilever-shaped thermal actuators, four displacement linkages, two shallow arch-shaped leaf springs, a mobile shuttle mass with a micromirror, and four elastic boundaries. The structural layer of the planar microactuator is phosphorous-doped 12$\mu\textrm{m}$-thick polysilicon, and the sacrificial layer is LTO(Low Temperature Oxide) of 3$\mu\textrm{m}$thickness. The displacement of actuator is as large as 3$\mu\textrm{m}$when the length of actuation bar is 100$\mu\textrm{m}$in length at 5V input voltage. The proposed microactuators have advantages of easy assembly with other optical component by way of fiber alignment in the substrate plane, and its fabrication process features simplicity while retaining batch-fabrication economy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1034-1040
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• 2004

The latch-up current and switching characteristics of MOS-Controlled Thyristor(MCT) are studied with variation of the channel length and impurity concentration. The proposed MCT power device has the lateral structure and P-epitaxial layer in substrate. Two dimensional MEDICI simulator is used to study the latch-up current and forward voltage-drop from the characteristics of I-V and the switching characteristics with variation of impurity concentration. The channel length and impurity concentration of the proposed MCT power device show the strong affect on the anode current and turn-off time. The increase of impurity concentration in P and N channels is found to give the increase of latch-up current and forward voltage-drop.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.4
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• pp.287-294
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• 2004

Dynamic Load/unload (L/UL) mechanism is an alternative to the contact start stop (CSS) technology which eliminates striction and wear failure modes associated with CSS. Inertia latch mechanism becomes important for mobile disk drives because of non operating shock performance. Various types of latch designs have been introduced in hard disk drives to limit a rotary actuator from sudden uncontrolled motion. In this paper, a single spring inertia latch is introduced for a small form optical disk drive, which uses a rotary actuator for moving an optical pick-up. A new small inertia latch with sin91e spring is designed to ensure both feasible and small size. The shock performance of the new inertia latch is experimentally verified.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.45 no.2
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• pp.249-255
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• 1996

A self-aligned latch-up suppressed IGBT has been proposed and the process method and the device characteristics of the IGBT have been verified by numerical simulation. As the source is laterally diffused through the sidewall of the trench in the middle of the body, the size of the source is small and the doping concentration of the source is lower than that of the p++ body and the emitter efficiency of the parasitic npn transistor is low so that latch-up may be suppressed. No additional mask steps for p++ region, source, and source contact are required so that small sized body can be obtained Latch-u current density higher than 10000 A/cm$^{2}$ have been achieved by adjusting the process conditions.

• Transactions on Electrical and Electronic Materials
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• v.2 no.1
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• pp.32-38
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• 2001

A new small sized Lateral Trench electrode Insulated Gate Bipolar Transistor(LTEIGBT) was proposed to improve the characteristics of conventional Lateral IGBT (LIGBT) and Lateral Trench gate IGBT (LTIGBT). The entire electrode of LTEIGBT was replace with trench-type electrode. The LTEIGBT was designed so that the width of device was no more than 19 ㎛. The Latch-up current densities of LIGBT, LTIGBT and the proposed LTEIGBT were 120A/㎠, 540A/㎠, and 1230A/㎠, respectively. The enhanced latch-up capability of the LTEIGBT was obtained through holes in the current directly reaching the cathode via the p+ cathode layer underneath n+ cathode layer. The forward blocking voltage of the LTEIGBT is 130V. Conventional LIGBT and LTIGBT of the same size were no more than 60V and 100V, respectively. Because the the proposed device was constructed of trench-type electrodes, the electric field moved toward trench-oxide layer, and punch through breakdown of LTEIGBT is occurred, lately.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.342-345
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• 2002

A new lateral trench electrode IGBT with p+ diverter was Proposed to suppress latch-up of LTIGBT. The p+ diverter was placed between the anode and cathode electrode. The latch-up of LTEIGBT with a p+ diverter was effectively suppressed to sustain an anode voltage of 8.7V and a current density of 1453A/$\textrm{cm}^2$ while in the conventional LTIGBT, latch-up occurred at an anode current density of 540A/$\textrm{cm}^2$. And the forward blocking voltage of the proposed LTEIGBT with a p+ diverter was about 140V. That of the conventional LTIGBT of the same size was no more than 105V. When the gate voltage is applied 12V, the forward conduction currents of the Proposed LTEIGBT with a p+ diverter and the conventional LIGBT are 90mA and 70mA, respectively, at the same breakdown voltage of 150V.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.546-550
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• 2001

A new Lateral Trench Insulated Gate Bipolar Transistor(LTIGBT) with p$^{+}$ diverter was proposed to improve the characteristics of the conventional LTIGBT. The forward blocking voltage of the proposed LTIGBT with p$^{+}$ diverter was about 140V. That of the conventional LTIGBT of the same size was 105V. Because the p$^{+}$ diverter region of the proposed device was enclosed trench oxide layer, he electric field moved toward trench-oxide layer, and punch through breakdown of LTIGBT with p$^{+}$ diverter was occurred, lately. Therefore, the p$^{+}$ diverter of the proposed LTIGBT didn't relate to breakdown voltage in a different way the conventional LTIGBT. The Latch-up current densities of the conventional LTIGBT and proposed LTIGBT were 540A/$\textrm{cm}^2$, and 1453A/$\textrm{cm}^2$, respectively. The enhanced latch-up capability of the proposed LTIGBT was obtained through holes in the current directly reaching the cathode via the p$^{+}$ divert region and p$^{+}$ cathode layer beneath n$^{+}$ cathode layer./ cathode layer.