• Title/Summary/Keyword: laser micromachining

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Excimer laser micromachining of silicon in liquid phase (액상에서의 엑시머 레이저 실리콘 미세가공)

  • Jang, Deok-Suk;Kim, Dong-Sik
    • Laser Solutions
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    • v.11 no.1
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    • pp.12-18
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    • 2008
  • Laser micromachining is a promising technique to fabricate the micro-scale devices. However, there remains important challenges to reducethe redeposition of ablated materials around the laser irradiated zone and to get a smooth surface, especially for metal and semiconductor materials. To achieve the high-quality micromachined devices, various methods have been developed. Liquid-assisted micromachining can be a good solution to overcome the previously mentioned problems. During the laser ablation process, the liquid around the solid sample dramatically changes the ablation characteristics, such as ablation rate, surface profile, formation of debris, and so on. In this investigation, we conducted the laser micromachining of Si in various liquid environmental conditions, such as liquid types, liquid thickness. In addition, using nanoscale time-resolved shadowgraphy technique, we observed the ablation process in liquid environments to understand the mechanism of liquid-assisted laser micromachining.

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Fabrication of a UV laser micromachining platform with process-monitoring optical modules (공정 모니터링 광학모듈이 장착된 UV 레이저 미세가공 플랫폼 제작)

  • Sohn, H.;Lee, J.H.;Jeong, Y.W.;Kim, S.I.;Hahn, J.W.
    • Laser Solutions
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    • v.11 no.2
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    • pp.33-38
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    • 2008
  • Laser micromachining has increasingly been adopted in various advanced industries where the high-precision machining of large-area, high-density and multi-layered components is in a strong demand. To effectively meet the requirements, the laser micromachining process must be carefully monitored. In order to facilitate the development of a new laser micromachining process and/or a new system, we have fabricated a UV laser micromachining platform that is equipped with optical modules for monitoring the process online. They include a laser power stabilizing module, a module for laser-induced breakdown spectroscopy, and an auto-focusing module.

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Micromachining of powder injection molded parts using ns UV laser (나노초 UV 레이저를 이용한 분말사출 부품의 미세기공)

  • Ahn, Dae-Hwan;Park, Seong-Jin;Kwon, Young-Sam;Kim, Dong-Sik
    • Laser Solutions
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    • v.13 no.1
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    • pp.1-5
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    • 2010
  • ln this work, the feasibility of using a UV laser for micromachining of powder injection molded parts is examined experimentally. The results, although preliminary, indicate that microfabrication of various parts by laser micromachining of the injection molded parts and then sintering is promising. Particularly, micromachining of a mixture composed of stainless steel particles and polyrner binders was studied using a KrF excimer laser.

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A Study on UV Laser Ablation for Micromachining of PCB Type Substrate (다층 PCB 기판의 미세 가공을 위한 UV레이저 어블레이션에 관한 연구)

  • 장원석;김재구;윤경구;신보성;최두선
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.887-890
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    • 1997
  • Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

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A Study on Water Droplet Lens Effect of UV Laser Micromachining Process (UV 레이저 미세 가공공정에서의 물 액적 렌즈 효과에 관한 연구)

  • Shin, Bo-Sung;Lee, Jung-Han
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.5
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    • pp.773-777
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    • 2012
  • Recently UV laser micromachining processes is widely introduced to meet the needs of advanced components of IT, BT and ET industries. Due to the characteristics of non-contact and high-speed laser processing, UV laser micromachining is applied to manufacture very thin substrate such as polymer, metals and composite. These minimum line width obtained by UV laser micromachining is generally determined from laser wavelength, optical lens and its numerical aperture. In this paper we will show the lens effect of water droplet on the surface of workpiece to reduce the line width when UV laser light is irradiated and focused through the water droplet. Because of the refraction effect generated by the semi-spherical or spherical shape of water droplet, we can find smaller line width. And water droplet could not only protect thermal deformation, but also carry away burr around micro dent. Firstly fundamental theory of minimum line width was derived from relationship between the geometry of water droplet and laser light trace, and then experimental and simulation results will be finally compared to verify the effectiveness of water droplet lens effect of UV laser micromachining process.

Micromachining of PZT using Nd:YAG laser (Nd:YAG 레이저를 이용한 PZT의 미세가공)

  • Hong J.U.;Lee J.H.;Suh J.;Shin D.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.223-224
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    • 2006
  • In this study, we have investigated the micromachining of PZT to fabricate interdigitated electrodes of electro active material actuator using Nd:YAG laser We have observed groove shapes of PZT with changing beam power, scanning speed, gas, and so on to find optimum conditions of the laser processing for PZT grooves. As a result, this method has been applied to the laser micromachining for grooves in PZT surface, and we could have optimum parameters of Nd:YAG laser Finally it was shown that the laser micromachining of PZT can substitute fer bonding, etching and deposition processes in fabricating electro active material actuator embedded with interdigitated electrodes.

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Micro Channel Fabrication Technology Using UV Laser Micromachining (UV 레이저 마이크로머시닝을 이용한 마이크로 채널 제작기술)

  • 양성빈;장원석;김재구;신보성;전병희
    • Transactions of Materials Processing
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    • v.13 no.3
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    • pp.216-224
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    • 2004
  • In this study, we have developed a new UV$({\lambda}=355nm)$ laser micromachining technology by direct ablation method without masks. This technology allows that 3D micro parts can be fabricated rapidly and efficiently with a low price. And it has a benefit of reducing fabricating process simply. Due to micro parts' fabrication, such technologies need the control of XYZ stages with high precision, the design of optical devices to maintain micron spot sizes of laser beam and the control technology of laser focus. The developed laser manufacturing process for laser micromachining is that, after extracting coordinates of shape data from CAD model data, a beam path considering manufacturing features of laser beam is created by using genetic algorithm. This generated manufacturing process is sent to stage controller. In order to improve the surface quality of micro parts, we have carried out experiments on iteration manufacturing and beam step-over by using a minimum focus size. Moreover, we have fabricated a micro-channel through the developed laser micromachining technology and verified it through the results.

Technology Development of Micro Channel Fabrication using UV Laser Micromachining (UV 레이저 마이크로머시닝을 이용한 마이크로 채널 제작기술개발)

  • Yang S. B.;Chang W. S.;Kim J. G.;Shin B. S.;Jeon B. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.05a
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    • pp.237-240
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    • 2004
  • In this study, we have developed a new $UV(\lambda=355nm)$ laser micromachining technology by direct ablation method without masks. This technology allows that 3D micro parts can be fabricated rapidly and efficiently with a low price. And it has a benefit of reducing fabricating process simply. Due to micro parts' fabrication, such technologies need the control of XYZ stages with high precision, the design of optical devices to maintain micron spot sizes of laser beam and the control technology of laser focus. Also, we have fabricated a micro-channel through the developed laser micromachining technology and verified it through the results.

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Laser Micromachining of Submicron Aperture for Electronbeam Microcolumn Application using Piezo Q-Switched Nd:YAG Laser

  • S.J. Ahn;Kim, D.W.;Park, S.S.
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.78-78
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    • 1999
  • Experimental studies of laser micromachining on Mo metal using piezo Q-switched Nd:YAG laser have been performed. Miniaturized microcolumn electron gun arrays as a potential electron beam lithography or portable mini-scanning electron microscope application have recently extensively examined. For these purpose, the electro-static electron lens and deflector system called microcolumn has to be assembled. The conventional microcolumn fabrication technique would gave a limitation on the minimization of aberration. The current technique of a 1 $\mu$m misalignment would lead to ~1.3 nm coma. In order to reduce aberration, assembling the microcolumn component followed by laser drilling should be very beneficial. In this report, we will address the preliminary report of laser micromachining on Mo substrate using piezo Q-switched Nd:YAG laser. The geometrical figures, such as the diameter and the depth of the frilled aperture are dependent upon the total energy of the laser pulse train, laser pulsewidth, and the diameter of laser beam in addition to the materials-dependent parameters.

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