• Korean Journal of Optics and Photonics
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• v.32 no.6
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• pp.276-285
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• 2021

This paper reports the study of the line-beam optical system of the laser lift-off (LLO) equipment used in the OLED manufacturing process. To obtain both a long process depth and a narrow width of the line beam, even with the poor M² value of the laser source, the research is focused on the optical system, including the beam transformation unit (BTU). We also propose optical configurations for the super-Gaussian distribution and the fiber-based BTU for the flat-top distribution.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.691-692
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• 2010

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.489.2-489.2
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• 2014

The planar type flexible piezoelectric energy harvesters (PEH) based on PbZr0.52Ti0.48O3 (PZT) thin films on the flexible substrates are demonstrated to convert mechanical energy to electrical energy. The planar type energy harvesters have been realized, which have an electrode pair on the PZT thin films. The PZT thin films were deposited on double side polished sapphire substrates using conventional RF-magnetron sputtering. The PZT thin films on the sapphire substrates were transferred by PDMS stamp with laser lift-off (LLO) process. KrF excimer laser (wavelength: 248nm) were used for the LLO process. The PDMS stamp was attached to the top of the PZT thin films and the excimer laser induced onto back side of the sapphire substrate to detach the thin films. The detached thin films on the PDMS stamp transferred to adhesive layer coated on the flexible polyimide substrate. Structural properties of the PZT thin films were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). To measure piezoelectric power generation characteristics, Au/Cr inter digital electrode (IDE) was formed on the PZT thin films using the e-beam evaporation. The ferroelectric and piezoelectric properties were measured by a ferroelectric test system (Precision Premier-II) and piezoelectric force microscopy (PFM), respectively. The output signals of the flexible PEHs were evaluated by electrometer (6517A, Keithley). In the result, the transferred PZT thin films showed the ferroelectric and piezoelectric characteristics without electrical degradation and the fabricated flexible PEHs generated an AC-type output power electrical energy during periodically bending and releasing motion. We expect that the flexible PEHs based on laser transferred PZT thin film is able to be applied on self-powered electronic devices in wireless sensor networks technologies. Also, it has a lot of potential for high performance flexible piezoelectric energy harvester.

• Korean Journal of Optics and Photonics
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• v.24 no.5
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• pp.224-230
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• 2013

Laser Lift-Off (LLO) is a process that removes a GaN or AIN thin layer from a sapphire wafer to manufacture vertical-type LEDs. It consists of a light source, an attenuator, a mask, a projection lens and a beam homogenizer. In this paper, we design an attenuator and a projection lens. We use the 'ZEMAX' optical design software for analysis of depth of focus and for a projection lens design which makes $7{\times}7mm^2$ beam size by projecting a beam on a wafer. Using the 'LightTools' lighting design software, we analyze the size and uniformity of the beam projected by the projection lens on the wafer. The performance analysis found that the size of the square-shaped beam is $6.97{\times}6.96mm^2$, with 91.8 % uniformity and ${\pm}30{\mu}m$ focus depth. In addition, this study performs dielectric coating using the 'Essential Macleod' to increase the transmittance of an attenuator. As a result, for 23 layers of thin films, the transmittance total has 10-96% at angle of incidence $45-60^{\circ}$ in S-polarization.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.55-60
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• 2021

In order to produce wearable displays with high adhesion while maintaining flexible characteristics, the adhesive method using electro plating method was carried out. Laser lift-off (LLO) transcription was also used to remove sapphire substrates from LEDs bonded to fibers. Afterwards, the SEM and EDS data of the sample, which conducted the adhesion method using electro plating, confirmed that copper actually grows through the lattice of the fiber fabric to secure the light source and fiber. The adhesion characteristics of copper were checked using Universal testing machine (UTM). After plating adhesion, the characteristics of the LLO transcription process completed and the LED without the transcription process were compared using probe station. The electroluminescence (EL) according to the enhanced current was measured to check the characteristics of the light source after the process. As the current increases, the temperature rises and the bandgap decreases, so it was confirmed that the spectrum shifted. In addition, the change in the electrical characteristics of the samples according to the radius change is confirmed using probe station. The radius strain also had mechanical strength that copper could withstand bending stress, so the Vf variation was measured below 6%. Based on these results, it is expected that it will be applied to batteries, catalysts, and solar cells that require flexibility as well as wearable displays, contributing to the development of wearable devices.

• Korean Journal of Optics and Photonics
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• v.32 no.6
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• pp.296-305
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• 2021

This paper reports a study on the long axis performance of the line beam optics used in laser lift-off equipment for the OLED manufacturing process. The centration errors of the cylindrical lens are classified and defined in seven categories, and the measurement methods are presented. The cylindrical fly-eye lens is analyzed theoretically and experimentally to find the influence of the surface shape error and decentering error on the long axis performance of the line beam optics system. A future research direction is also presented to improve the long axis performance.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.418-418
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• 2010

최근 친환경 저전력 차세대 조명소자로 발광다이오드가 각광을 받고 있다. 하지만 종래의 수평형 발광다이오드는 사파이어 기판의 열악한 열전도도 및 전기전도도 특성으로 인하여 효율적인 열방출의 저하가 생기게 되고, 양전극과 음전극의 수평배치에 기인한 심각한 전류쏠림현상 등이 수평형 발광다이오드의 고전력 소자로서의 응용에 걸림돌로 작용하고 있다. 근래에 수평형 발광다이오드의 대안 중 하나로 수직형 발광다이오드에 대한 연구가 활발히 진행되고 있다. 수직형 발광다이오드에서는, 수평형 발광다이오드에서의 전류쏠림현상을 향상시키기 위해 얀전극과 음전극을 수직으로 배치시킨다. 그리고 열전도도 및 전기전도도 특성이 떨어지는 사파이어를 제거하기 위해 LLO(Laser Lift Off)공정이 사용된다. LLO공정으로 인해 수직형 발광다이오드의 구조는 수평형 발광다이오드와 달리 n-GaN이 위로 배치되는 특성을 가진다. 본 연구에서는, 수직형 발광다이오드의 광추출 효율을 증가시키기 위해 SiO2 나노입자를 이용한 GaN 표면요철 형성기술을 개발, 적용 하였다. SiO2 나노입자를 n-GaN상에 단일층으로 분산시키기 위해 PR(PhotoResist), 나노입자, IPA(Isopropyl Alcohol)이 혼합된 용액을 스핀코팅시켰고 그 결과를 SEM으로 확인할 수 있었다. GaN 식각을 위해 SiO2 나노입자를 마스크로 사용하였고, BCl3가스를 사용한 건식식각을 진행하였다. 그 결과 조밀하고 균일한 크기의 Cylinderical Trapezoid 식각 형상이 n-GaN표면에 형성되었음을 SEM으로 확인할 수 있었다. 우리는 표면요철이 없는 발광다이오드와 SiO2 나노입자를 이용한 표면요철이 형성된 발광다이오드의 특성을 비교하였다. 그 결과 표면요철이 있을 때 광출력이 증가함을 확인할 수 있었다. 거기에 더하여 표면요철의 높이가 300nm~1000nm로 변화함에 따른 소자의 특성변화 또한 관찰할 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.323-324
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• 2011

현재 많은 blue LED소자의 제작 공정과 소자 표면에 texturing하는 과정이 보고되어 있다. 그 중n층이 위로 올라오는 수직형 LED 구조로 인해 표면 texturing 기술은 빛의 발광 효율을 증가 시킬 수 있는 중요한 기술 중 하나가 되었다. 1 이 연구에서, 우리는 InGaN을 바탕으로 한 LED 소자의 표면 roughening을 건식과 습식 공정을 모두 거치는 과정을 통하여 소자의 발광 효율을 높이는 시도를 하였다. 최근 전도성 물질 기판 위에 증착 되어 있는 수직형 LED 소자 2,3,4는 과거의 사파이어 기판 위에 증착 되어 있는 형태의 LED 소자에 비해 우수한 소자 특성을 보인다. 이는 과거 사파이어 기판을 사용함으로써 낮은 열적 특성과 더불어 전기 정도성에 몇 가지 제약을 초래하게 되었기 때문이다. 반면, 전도성 기판은 LED 구조의 back side ohmic contact을 가능하게 하였고, 더 나은 확산 특성을 보여 주었고 작동 전압 또한 감소 하였다. N층이 위에 있는 수직형 LED 소자는 KrF pulsed excimer laser로 인해 실현 되었다. 이 laser 빛이 투명한 사파이어 기판을 통해 얇은 GaN층에 입사되면, 기판과 GaN가 분리된다. 이 레이저 기술은 laser lift-off(LLO)로 성장된 기판으로부터 LED 구조를 분리하는데 성공하게 하였다. 우리는 건식 식각 공정을 이용하여 n 층이 위에 올라와 있는 구조인 수직형 LED 소자에 roughening을 주고 다시 이 표면에 습식 식각 공정을 적용하여 거친 부분의 거칠기를 또 한번 증가시켰다. 그리고 이 거칠어진 표면은 이 공정이 진행 되기 전의 소자에 비해 빛의 발광 효율이 증가 되었다. 이 두 공정을 포함한 식각 공정은 두 가지 장점이 생겼는데, 한가지는 GaN에서 외부로 방출할 수 있는 표면 지역이 증가되었고, 다른 한가지는 가파른 거칠기 특성으로 인해 critical angle을 증가시킨 것이다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.7
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• pp.427-431
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• 2017

In this paper, we discuss ${\beta}-Ga_2O_3$ thin films that have been grown on freestanding GaN (FS-GaN) using furnace oxidation. A GaN template was grown by horizontalhydride vapor phase epitaxy (HVPE), and FS-GaN was fabricated using the laser lift off (LLO) system. To obtain ${\beta}-Ga_2O_3$ thin film, FS-GaN was oxidized at $900{\sim}1,100^{\circ}C$. Surface and cross-section of prepared ${\beta}-Ga_2O_3$ thin films were observed by field emission scanning electron microscopy (FE-SEM). The single crystal FS-GaNs were changed to poly-crystal ${\beta}-Ga_2O_3$. The oxidized ${\beta}-Ga_2O_3$ thin film at $1,100^{\circ}C$ was peel off from FS-GaN. Next, oxidation of FS-GaNwas investigated for 0.5~12 hours with variation of the oxidation time. The thicknesses of ${\beta}-Ga_2O_3$ thin films were measured from 100 nm to 1,200 nm. Moreover, the 2-theta XRD result indicated that (-201), (-402), and (-603) peaks were confirmed. The intensity of peaks was increased with increased oxidation time. The ${\beta}-Ga_2O_3$ thin film was generated to oxidize FS-GaN.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.