Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Fabrication of Fabric-based Wearable Devices with High Adhesion Properties using Electroplating Process

전해 도금을 이용한 높은 접착 특성을 갖는 섬유 기반 웨어러블 디바이스 제작

  • Kim, Hyung Gu (Department of Chemicals Engineering, Chonnam National University) ;
  • Rho, Ho Kyun (Energy Convergence Core Facility, Chonnam National University) ;
  • Cha, Anna (Department of Chemicals Engineering, Chonnam National University) ;
  • Lee, Min Jung (Department of Chemicals Engineering, Chonnam National University) ;
  • Park, Jun-beom (Next generation LED research Center, Korea Photonics Technology Institute) ;
  • Jeong, Tak (Next generation LED research Center, Korea Photonics Technology Institute) ;
  • Ha, Jun-Seok (Department of Chemicals Engineering, Chonnam National University)
  • 김형구 (전남대학교 신화학소재공학과) ;
  • 노호균 (전남대학교 CORE 에너지 융복합 전문 핵심연구지원센터) ;
  • 차안나 (전남대학교 신화학소재공학과) ;
  • 이민정 (전남대학교 신화학소재공학과) ;
  • 박준범 (한국광기술원 차세대 LED 연구센터) ;
  • 정탁 (한국광기술원 차세대 LED 연구센터) ;
  • 하준석 (전남대학교 신화학소재공학과)
  • Received : 2021.03.15
  • Accepted : 2021.03.30
  • Published : 2021.03.30
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Abstract

In order to produce wearable displays with high adhesion while maintaining flexible characteristics, the adhesive method using electro plating method was carried out. Laser lift-off (LLO) transcription was also used to remove sapphire substrates from LEDs bonded to fibers. Afterwards, the SEM and EDS data of the sample, which conducted the adhesion method using electro plating, confirmed that copper actually grows through the lattice of the fiber fabric to secure the light source and fiber. The adhesion characteristics of copper were checked using Universal testing machine (UTM). After plating adhesion, the characteristics of the LLO transcription process completed and the LED without the transcription process were compared using probe station. The electroluminescence (EL) according to the enhanced current was measured to check the characteristics of the light source after the process. As the current increases, the temperature rises and the bandgap decreases, so it was confirmed that the spectrum shifted. In addition, the change in the electrical characteristics of the samples according to the radius change is confirmed using probe station. The radius strain also had mechanical strength that copper could withstand bending stress, so the Vf variation was measured below 6%. Based on these results, it is expected that it will be applied to batteries, catalysts, and solar cells that require flexibility as well as wearable displays, contributing to the development of wearable devices.

유연한 특성을 유지하면서 높은 접착력을 가진 웨어러블 디스플레이를 제작하기 위하여 전해도금법을 이용한 접착법을 진행하였다. 또한 섬유에 접착된 LED의 사파이어 기판을 제거하기 위하여 LLO 전사법을 이용하였다. 그 후 전해도금을 이용한 접착법을 진행한 샘플의 SEM, EDS 데이터를 통하여 실제로 구리가 섬유직물의 격자사이를 관통하여 성장하며 광원과 섬유를 고정시켜주는 것을 확인하였다. 구리의 접착특성을 확인하기 위하여 Universal testing machine (UTM)을 이용하여 측정하였다. 도금 접착 후 laser lift-off (LLO) 전사공정을 완료한 샘플과 전사공정을 진행하지 않은 LED의 특성을 probe station을 이용하여 비교하였다. 공정 이후의 광원의 특성을 확인하기 위하여 인가 전류에 따른 electroluminescence (EL)을 측정하였다. 전류가 증가할수록 온도가 상승하여 Bandgap이 감소하기 때문에 spectrum이 천이하는 것을 확인하였다. 또한 radius 변화에 따른 샘플의 전기적 특성 변화를 probe station을 이용하여 확인하였다. Radius 변형에도 구리가 bending stress를 견딜 수 있는 기계적 강도를 가지고 있어 Vf 변화는 6% 이하로 측정되었다. 이러한 결과를 토대로 웨어러블 디스플레이 뿐만 아니라 유연성이 필요한 배터리, 촉매, 태양전지 등에 적용되어 웨어러블 디바이스의 발전에 기여할 수 있을 것으로 기대한다.

Keywords

References

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