• 제목/요약/키워드: laser bonding

검색결과 176건 처리시간 0.025초

산업용 압전 잉크젯 헤드의 구동신호에 따른 특성 (The Effects of Driving Waveform for Piezoelectric Drop On Demand Industrial Inkjet Head)

  • 김영재;유영석;심원철;박창성;정재우;오용수
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제55권8호
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    • pp.417-422
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    • 2006
  • This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristics were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Also we observed the movement characteristics of PZT actuator with LDV(Laser Doppler Vibrometer) system, oscilloscope and dynamic signal analyzer. Missing nozzles caused by bubbles in chamber were monitored by their resonance frequency. Using the water based ink of viscosity of 4.8 cps and surface tension of 0.025 N/m, it is possible to eject stable droplets up to 20 kHz, 4.4 m/s and above 8 pl at the different applied driving waveforms.

Simultaneous Detection of Biomolecular Interactions and Surface Topography Using Photonic Force Microscopy

  • 허승진;김기범;조용훈
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.402.1-402.1
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    • 2014
  • Photonic force microscopy (PFM) is an optical tweezers-based scanning probe microscopy, which measures the forces in the range of fN to pN. The low stiffness leads proper to measure single molecular interaction. We introduce a novel photonic force microscopy to stably map various chemical properties as well as topographic information, utilizing weak molecular bond between probe and object's surface. First, we installed stable optical tweezers instrument, where an IR laser with 1064 nm wavelength was used as trapping source to reduce damage to biological sample. To manipulate trapped material, electric driven two-axis mirrors were used for x, y directional probe scanning and a piezo stage for z directional probe scanning. For resolution test, probe scans with vertical direction repeatedly at the same lateral position, where the vertical resolution is ~25 nm. To obtain the topography of surface which is etched glass, trapped bead scans 3-dimensionally and measures the contact position in each cycle. To acquire the chemical mapping, we design the DNA oligonucleotide pairs combining as a zipping structure, where one is attached at the surface of bead and other is arranged on surface. We measured the rupture force of molecular bonding to investigate chemical properties on the surface with various loading rate. We expect this system can realize a high-resolution multi-functional imaging technique able to acquire topographic map of objects and to distinguish difference of chemical properties between these objects simultaneously.

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A 12.5-Gb/s Optical Transmitter Using an Auto-power and -modulation Control

  • Oh, Won-Seok;Park, Kang-Yeob;Im, Young-Min;Kim, Hwe-Kyung
    • Journal of the Optical Society of Korea
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    • 제13권4호
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    • pp.434-438
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    • 2009
  • In this paper, a 12.5-Gb/s optical transmitter is implemented using 0.13-${\mu}m$ CMOS technology. The optical transmitter that we constructed compensates temperature effects of VCSEL (Vertical cavity surface emitting laser) using auto-power control (APC) and auto-modulation control (AMC). An external monitoring photodiode (MPD) detects optical power and modulation. The proposed APC and AMC demonstrate 5$\sim$20-mA of bias-current control and 5$\sim$20-mA of modulation-current control, respectively. To enhance the bandwidth of the optical transmitter, an active feedback amplifier with negative capacitance compensation is exploited. The whole chip consumes only 140.4-mW of DC power at a single 1.8-V supply under the maximum modulation and bias currents, and occupies the area of 1280-${\mu}m$ by 330-${\mu}m$ excluding bonding pads.

치경부 마모병소의 상아질 표면처리 방식에 따른 상아질과 접착제 간의 계면 양상 (INTERFACIAL MORPHOLOGY BETWEEN DENTIN AND ADHESIVES ACCORDING TO TREATMENT OF DENTIN SURFACE OF CERVICAL ABRASION LESION)

  • 이용희;이희주;허복
    • Restorative Dentistry and Endodontics
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    • 제26권1호
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    • pp.51-63
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    • 2001
  • In order to know the effect of dentin bonding agents on the restoration of cervical abrasion, Scotchbond Multipurpose Single Bond and Clearfil Liner Bond 2 were used in 51 teeth with abrasion lesion and normal teeth. The surface structure and dentinal tubules of acid etched dentin and resin replica were examined using scanning electron microscopy. The interfacial morphology between dentin and adhesives was investigated by confocal laser scanning microscopy. Following results were obtained. 1. The hybrid layer and resin tag of the dentin showing cross-sectional surface of dentinal tubules are thicker and longer than those of dentin showing oblique surface of dentinal tubules. 2. The sclerotic cast was frequently observed in dentinal tubule, and the cast looked like cuboidal or rhomboidal-shaped crystals clumped from outer side to inner side. 3. The formation of hybrid layer and resin tag was the most prominent in Scotchbond Multipurpose group, whereas Clearfil Liner Bond 2 group showed very poor formation. The formation of hybrid layer and resin tag in Single Bond group was less than Scotchbond Multipurpose group.

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인체 삽입용 LC 공진형 혈압 센서 디자인 및 제작 (Design and Fabrication of Implantable LC Resonant Blood Pressure Sensor)

  • 김진태;김성일;정연호
    • 한국전기전자재료학회논문지
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    • 제26권3호
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    • pp.171-176
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    • 2013
  • In this paper, we present a MEMS (micro-electro-mechanical system) implantable blood pressure sensor which has designed and fabricated with consideration of size, design flexibility, and wireless detection. Mechanical and electrical characterizations of the sensor were obtained by mathematical analysis and computer aided simulation. The sensor is composed of two coils and a air gap capacitor formed by separation of the coils. Therefore, the sensor produces its resonant frequency which is changed by external pressure variation. This frequency movement is detected by inductive coupling between the sensor and an external antenna coil. Theoretically analyzed resonant frequency of the sensor under 760 mmHg was calculated to 269.556 MHz. Fused silica was selected as sensor material with consideration of chemical and electrical reaction of human body to the material. $2mm{\times}5mm{\times}0.5mm$ pressure sensors fitted to radial artery were fabricated on the substrates by consecutive microfabrication processes: sputtering, etching, photolithography, direct bonding and laser welding. Resonant frequencies of the fabricated sensors were in the range of 269~284 MHz under 760 mmHg pressure.

강유전체 캐패시터 전극으로의 BaRuO$_3$박막의 구조적 및 전기적 특성 (Structural and Electrical Properties of RaRuO$_3$ Thin Film for Electrode of Ferroelectric Capacitors)

  • 박봉태;구상모;문병무
    • 한국전기전자재료학회논문지
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    • 제12권1호
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    • pp.56-61
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    • 1999
  • Highly conductive oxide films of BaRuO$_3$ have been grown heteroepitaxially on (100) LaAlO$_3$ single crystalline substrates by using pulsed laser deposition. The films are c-axis oriented with an in-plane epitaxial relationship of <010><100>BaRuO$_3$ // <110>LaAlO$_3$. Atomic force microscopy (AFM) observation shows that they consist of a fine-arranged network of grains and have a mosaic microstructure. Generally temperature-dependent resistivity shows the transition from metallic curve to semiconductor-metallic twofold curve by the deposition conditions for Ru oxide based materials like SrRuO$_3$, CaRuO$_3$, BaRuO$_3$, etc.. This twofold curve comes from the structural similarity of Ru oxide based materials including BaRuO$_3$. We find that the distance of Ru-Ru bonding in the unit cell of BaRuO$_3$ as well as the grain boundary scattering could be the two important causes of these interesting conductive properties.

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이온빔으로 질화처리된 사파이어기판위에 성장한 ZnO박막의 특성 (Properties of ZnO thin film grown on $Al_2O_3$ substrate pretremented by nitrogen ion beam)

  • 박병준;정연식;박종용;최두진;최원국;윤석진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.413-416
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    • 2004
  • In this study, zinc oxide(ZnO) having large misfit(18.2%) with sapphire was tried to be grown on very thin nitride buffer layers. For the creation of various kinds of nitride buffer layer, sapphire surface was modified by an irradiation of nitrogen ion beam with low energy generated from stationary plasma thruster(SPT) at room temperature. After the irradiation of ion beam, Al-N and Al-O-N bonding was identified to be formed as nitride buffet layers. Surface morphology was measured by AFM and then ZnO growth was followed by pulsed laser deposition(PLD). Their properties are analyzed by XRD, AFM, TEM, and PL. We observed that surface morphology was improved and deep level emission related to defects was almost vanished in PL spectra from the ZnO grown on nitride buffer layer.

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Study on the effect of vacuum fusion infiltration technology on the properties of tungsten/copper joining interface

  • Hao-Jie Zhang;Xue-qin Tian;Xiao-Yu Ding;Hui-Yun Zheng;Lai-Ma Luo;Yu-Cheng Wu;Jian-Hua Yao
    • Nuclear Engineering and Technology
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    • 제56권6호
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    • pp.2367-2374
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    • 2024
  • In this paper, based on the need for high-strength connections between all-tungsten-oriented plasma materials and thermal sinking materials of copper and its alloys in nuclear fusion devices, a study on the effect of tungsten surface laser micro structuring on the interfacial bonding properties of W/Cu joints was carried out. In the experiment, the connectors were prepared by vacuum fusion infiltration technology, and the effects of microgroove structure on the mechanical and thermal conductivity of W/Cu connectors were investigated under different parameters (including microgroove pitch, microgroove depth, and microgroove taper). The maximum shear strength is 126.0 MPa when the pitch is 0.15 mm and the depth is 34 ㎛. In addition, the negative taper structure, i.e., the width of the entrance of the microstructure is smaller than the width of the interior of the microstructure, is also investigated. The shear tests show that there is an approximately linear relationship between the shear strength of W/Cu and taper. Compared with the positive taper, the shear strength of the samples with the same morphological density and depth of the tungsten surface is significantly higher.

WiFi용 스위치 칩 내장형 기판 기술에 관한 연구 (The Fabrication and Characterization of Embedded Switch Chip in Board for WiFi Application)

  • 박세훈;유종인;김준철;윤제현;강남기;박종철
    • 마이크로전자및패키징학회지
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    • 제15권3호
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    • pp.53-58
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    • 2008
  • 본 연구에서는 상용화된 2.4 GHz 영역대에서 사용되어지는 WiFi용 DPDT(Double Pole Double throw) switch 칩을 laser 비아 가공과 도금 공정을 이용하여 폴리머 기판내에 내장시켜 그 특성을 분석하였으며 통상적으로 실장되는 wire 본딩방식으로 패키징된 기판과 특성차이를 분석 비교하였다. 폴리머는 FR4기판과 아지노 모토사의 ABF(Ajinomoto build up film)를 이용하여 패턴도금법으로 회로를 형성하였다. ABF공정의 최적화를 위해 폴리머의 경화정토를 DSC (Differenntial Scanning Calorimetry) 및 SEM (Scanning Electron microscope)으로 분석하여 경화도에 따라 도금된 구리패턴과의 접착력을 평가하였다. ABF의 가경화도가 $80\sim90%$일 경우 구리층과 최적의 접착강도를 보였으며 진공 열압착공정을 통해 기공(void)없이 칩을 내장할 수 있었다. 내장된 기관과 와이어 본딩된 기판의 측정은 S 파라미터를 이용하여 삽입손실과 반사손실을 비교 분석하였으며 그 결과 삽입손실은 두 경우 유사하게 나타났지만 반사손실의 경우 칩이 내장된 경우 6 GHz 까지 -25 dB 이하로 안정적으로 나오는 것을 확인할 수 있었다.

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양방향 송수신모듈 제작을 위한 광결합계수의 계산 및 측정 (Calculation and measurement of optical coupling coefficient for bi-directional tancceiver module)

  • 김종덕;최재식;이상환;조호성;김정수;강승구;이희태;황남;주관종;송민규
    • 한국광학회지
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    • 제10권6호
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    • pp.500-506
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    • 1999
  • 레이저 다이오드와 수신광검출기가 집적된 소자를 V-홈을 가진 실리콘 광학벤치에 flip-chip 본딩하고, 경사면을 가진 하나의 단일모드 광섬유와 수동정렬하는 방법을 사용하여 가입자망을 위한 저가의 양방향 송수신 모듈을 설계, 제작하였다. 광섬유의 단면 경사각에 따른 송신광결합 효율과 수신광결합 효율사이의 병목점을 찾기 위해 Gaussian빔 모델을 사용하여 수평정렬거리, 광섬유 단면 경사각, 수직정렬오차등의 변수에 따른 광결합계수를 계산함으로써, 최적의 광정렬조건을 예측하였다. 또한 실리콘 광학벤치에서 광결합효율을 측정하여 광섬유의 수직정렬오차에 따른 광결합계수의 감소가 광섬유의 경사각에 의해 보상될 수 있다는 계산결과의 타당함을 확인하였다. 실제의 sub-module 제작 및 광결합 실험에서 송신빔이 광섬유 단면에 반사되어 PD로 입사되는 것을 최소화하기 위하여 광섬유 단면을 경사절두원추형으로 제작함으로써 PD의 수신 잡음을 $30mu$m 이상의 정렬거리에서 -35dB이하로 유지할 수 있었다. 같은 조건에서 단면 경사각이 $12^{\circ}$인 광섬유에 의해 -12.1dB의 송신출력과 0.2A/W의 responsivity를 얻을 수 있었다.

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