• Title/Summary/Keyword: large solution

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A Solution to Large Strain Resonant Column and Torsional Shear Tests Apparatus (대변형율 시험을 위한 공진주/비틂전단 시험기의 해결방안)

  • Bae, Yoon-Shin
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.31 no.3C
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    • pp.103-108
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    • 2011
  • In this study, the limitations of large strain resonant column and torsional shear tests apparatus are described and solutions to the limitations are also described. The limitations are rotational distance, limited torque, and measurable deformation system, respectively. To resolve the rotational distance, the bottom platen was modified. And the four-armed drive plate was modified into eight-armed drive plate and the drive coil connection was changed to obtain powerful torque.

One-step fabrication of a large area wire-grid polarizer by nanotransfer molding

  • Hwang, Jae-K.;Park, Kyung-S.;Sung, Myung-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.464-464
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    • 2011
  • We report a method to fabricate a large-area metal nanowire-grid polarizer. Liquid-bridge-mediated nanotransfer molding (LB-nTM) is based on the direct transfer of metal nanowires from a mold to a transparent substrate via liquid layer. A metal particle solution is used as an ink in the LB-nTM, which can be used for the formation of metal nanowires. The nanowires have higher depth are preferred for high transmittance. The height of nanowires that we made is about 140 nm. Large-area WGP is fabricated with good average transmittance of 74.89% in our measuring range.

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FVTD-LTS Method for Electromagnetic Field Analysis by Dielectric with large Permittivity (큰 유전율을 가지는 유전체의 전자계 해석을 위한 FVTD-LTS 기법)

  • Yoon, Kwang-Yeol;Chai, Yong-Yoong
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.6
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    • pp.334-338
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    • 2006
  • The finite volume time domain(FVTD) method gives accurate results for the calculation of electromagnetic wave propagation but it should be noted that the number of sampling points per wavelength should be increased when more accurate numerical results are required. Moreover it requires large amount of computer memory resources. In this paper we propose a modified FVTD that employs a time subdivision. The local time-subdivided FVTD(FVTD-LTS) method is enough to divide the space domain grid with a large step size. This method can reduce computation time and memory resources. To validate the proposed method, sever numerical examples are presented. We have then shown that the proposed method yields a reasonable solution.

Clock Scheduling and Cell Library Information Utilization for Power Supply Noise Reduction

  • Kim, Yoo-Seong;Han, Sang-Woo;Kim, Ju-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.1
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    • pp.29-36
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    • 2009
  • Power supply noise is fundamentally caused by large current peaks. Since large current peaks are induced by simultaneous switching of many circuit elements, power supply noise can be minimized by deliberate clock scheduling which utilizes nonzero clock skew. In this paper, nonzero skew clock scheduling is used to avoid the large peak current and consequently reduce power supply noise. While previous approaches require extra characterization efforts to acquire current waveform of a circuit, we approximate it only with existing cell library information to be easily adapted to conventional design flow. A simulated annealing based algorithm is performed, and the peak current values are estimated for feasible clock schedules found by the algorithm. The clock schedule with the minimum peak current is selected for a solution. Experimental results on ISCAS89 benchmark circuits show that the proposed method can effectively reduce the peak current.

The Architectural Pattern of a Highly Extensible System for the Asynchronous Processing of a Large Amount of Data

  • Hwang, Ro Man;Kim, Soo Kyun;An, Syungog;Park, Dong-Won
    • Journal of Information Processing Systems
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    • v.9 no.4
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    • pp.567-574
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    • 2013
  • In this paper, we have proposed an architectural solution for a system for the visualization and modification of large amounts of data. The pattern is based on an asynchronous execution of programmable commands and a reflective approach of an object structure composition. The described pattern provides great flexibility, which helps adopting it easily to custom application needs. We have implemented a system based on the described pattern. The implemented system presents an innovative approach for a dynamic data object initialization and a flexible system for asynchronous interaction with data sources. We believe that this system can help software developers increase the quality and the production speed of their software products.

An LMI-based Decentralized Sliding Mode Control Design Method for Large Scale Systems (대규모 시스템을 위한 LMI기반 비집중화 슬라이딩 모드 제어기 설계)

  • Choi, Han-Ho
    • Journal of Institute of Control, Robotics and Systems
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    • v.11 no.8
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    • pp.651-655
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    • 2005
  • In this paper, we consider the problem of designing decentralized sliding mode control laws far a class of large scale systems with mismatched uncertainties. We derive a sufficient condition far the existence of a linear switching surface in terms of a linear matrix inequalities(LMIs), and we parameterize the linear switching surfaces in terms of the solution matrices to the given LMI existence conditions. We also give an algorithm for designing decentralized switching feedback control laws. Finally, we give a design example in order to show the effectiveness of our method.

A co-rotational 8-node assumed strain element for large displacement elasto-plastic analysis of plates and shells

  • Kim, K.D.
    • Structural Engineering and Mechanics
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    • v.15 no.2
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    • pp.199-223
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    • 2003
  • The formulation of a non-linear shear deformable shell element is presented for the solution of stability problems of stiffened plates and shells. The formulation of the geometrical stiffness presented here is exactly defined on the midsurface and is efficient for analyzing stability problems of thick plates and shells by incorporating bending moment and transverse shear resultant force. As a result of the explicit integration of the tangent stiffness matrix, this formulation is computationally very efficient in incremental nonlinear analysis. The element is free of both membrane and shear locking behaviour by using the assumed strain method such that the element performs very well in the thin shells. By using six degrees of freedom per node, the present element can model stiffened plate and shell structures. The formulation includes large displacement effects and elasto-plastic material behaviour. The material is assumed to be isotropic and elasto-plastic obeying Von Mises's yield condition and its associated flow rules. The results showed good agreement with references and computational efficiency.

Calculation of Welding Deformations by Simplified Thermal Elasto-plastic Analysis

  • Seo Sung Il
    • Journal of Ship and Ocean Technology
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    • v.8 no.3
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    • pp.40-49
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    • 2004
  • Welding deformations injure the beauty of appearance of a structure, decrease its buckling strength and prevent increase of productivity. Welding deformations of real structures are complicated and the accurate prediction of welding deformations has been a difficult problem. This study proposes a method to predict the welding deformations of large structures accurately and practically based on the simplified thermal elasto-plastic analysis method. The proposed method combines the inherent strain theory with the numerical or theoretical analysis method and the experimental results. The weld joint is assumed to be divided into 3 regions such as inherent strain region, material softening region and base metal region. Characteristic material properties are used in structural modeling and analysis for reasonable simplification. Calculated results by this method show good agreement with the experimental results. It was proven that this method gives an accurate and efficient solution for the problem of welding deformation calculation of large structures.

A Study on the Usages of DDS Middleware for Efficient Data Transmission and Reception

  • Jeong, Yeongwook
    • Journal of the Korea Society of Computer and Information
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    • v.23 no.11
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    • pp.59-66
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    • 2018
  • Data Distribution Service(DDS) provides the communications service programmers need to distribute time-critical data between embedded and/or enterprise devices or nodes. In this paper, I propose efficient methods for transmitting and receiving messages of various characteristics in real-time using DDS middleware. For high-frequency characteristic data, I describe several DDS packet types and various default and extended DDS QoS policies. In particular, the batching method is probably the best solution when considering several performance aspects. For large-capacity characteristic data. I will show a method using extended DDS QoS policies, a segmentation and reassembly method, and transmitting and receiving a large-capacity data with low priority method considering network conditions. Finally, I simulate and compare the result of performance for each methods. This results will help determine efficient methods for transmitting and receiving messages of various characteristics using DDS middleware.

Large Area Wafer-Level High-Power Electronic Package Using Temporary Bonding and Debonding with Double-Sided Thermal Release Tape (양면 열박리 테이프 기반 임시 접합 공정을 이용한 대면적 웨이퍼 레벨 고출력 전자패키지)

  • Hwang, Yong-Sik;Kang, Il-Suk;Lee, Ga-Won
    • Journal of Sensor Science and Technology
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    • v.31 no.1
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    • pp.36-40
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    • 2022
  • High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.