• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.853-856
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• 2002

Present. direct method x-ray conversion detector is studied by abroad medical instrument and country with amorphous Selenium. And we search the method for large area x-ray detector. Amorphous-Selenium based photoreceptor is widely used on the X-ray conversion materials. But amorphous-selenium based x-ray conversion detector is broken by high voltage and leakage defect point. In this paper, We investigated top-electrode distance rate to improve defect point and high voltage broken. The result to appoint to made large area x-ray conversion detector with base data.

• 대한의용생체공학회:의공학회지
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• 제29권5호
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• pp.364-370
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• 2008

Recent development in large area flat-panel x-ray detector technology enables clinical application of digital tomosyntesis. Unlike conventional motion tomography using x-ray films, flat-panel x-ray detectors provide projection images in digital formats so that tomographic images can be synthesized in a more flexible way. For the digital tomosynthesis, precise movements of the x-ray source and the x-ray detector with respect to a fulcrum point are necessary. In this study, we apply the digital tomosynthesis technique to the flat-panel detector based micro-CT in which the flat-panel detector and the x-ray source rotate together on a circular arc. The experimental results suggest that flat-panel detector based 3D CTs can be used for digital tomosynthesis in the clinical environment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.388-391
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• 2003

The properties of these detectors can be controlled by electronics and exposure conditions. Flat-panel detectors for digital diagnostic imaging convert incident x-ray images to charge images. Flat panel detectors gain more interest real time medical x-ray imaging. Active area of flat panel detector is $14{\times}17$ inch. Detector is based on a $2560{\times}3072$ away of photoconductor and TFT pixels. X-ray conversion layer is deposited upper TFT array flat panel with a 500m by thermal deposition technology. Thickness uniformity of this layer is made of thickness control technology(5%) of thermal deposition system. Each $139m{\times}139m$ pixel is made of thin film transistor technology, a storage capacitor and charge collection electrode having geometrical fill factor of 86%. Using the separate driving system of two dimensional mosaic modules for large area, that is able to 4.2 second per frame. Imaging performance is suited for digital radiography imaging substitute by conventional radiography film system..

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.27-30
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• 2002

Photoconductor for direct detection flat-panel imager present a great materials challenge, since their requirements include high X -ray absorption, ionization and charge collection, low leakage current and large area deposition. Selenium is practical material. But it needs high thickness and high voltage in selenium for high ionization rate. We report comparative studies of detector sensitivity. One is an a-Se with $70{\mu}m$ thickness on glass. The other has hybrid layer of depositting ZnS phosphor with $100{\mu}m$ on a-Se. The leakage current of hybrid is similar to it of a-Se, but photocurrent is lager than a-Se. Both of them have high spatial resolution, but hybrid has higher sensitivity than a-Se at comparable bias voltage.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.845-848
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• 2002

The study of photoconductor materials is demanded for development for flat-panel digital x-ray Imager. In this paper, We investigated the feasibility of application as x-ray image sensor using Cd(Zn)Te compound with high stopping power on high radiation. These Cd(Zn)Te samples were fabricated by vacuum thermal evaporation method to large area deposition and investigated I-V measurement as applied voltage. The experimental results show that the additional injection Zn in CdTe film reduced the leakage current, for the $Cd_{0.85}Zn_{0.15}Te$ detector, the net charge had the highest value as $144.58pC/cm^2$ at 30 V.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.328-328
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• 2007

Large area matrix-addressed image detectors are a recent technology for x-ray imaging with medical diagnostic and other applications. The imaging properties of x-ray pixel detectors depend on the quantum efficiency of x-rays, the generated signal of each x-ray photon and the distribution of the generated signal between pixels. In a phosphor coated detector the light signal is generated by electrons captured in the phosphor screen. In our study we simulated the lateral spread distributions for phosphor coupled detector by Monte Carlo simulations. Most simulations of such detectors simplify the setup by only taking the conversion layer into account neglecting behind. The Monte Carlo code MCNPX has been used to simulate the complete interaction and subsequent charge transport of x-ray radiation. This has allowed the analysis of charge sharing between pixel elements as an important limited factor of digital x-ray imaging system. The parameters are determined by lateral distribution of x-ray photons and x-ray induced electrons. The primary purpose of this study was to develop a design tool for the evaluation of geometry factor in the phosphor coupled optical imaging detector. In order to evaluate the spatial resolution for different phosphor material, phosphor geometry we have developed a simulation code. The developed code calculates the energy absorption and spatial distribution based on both the signal from the scintillating layer and the signal from direct detection of x-ray in the detector. We show that internal scattering contributes to the so-called spatial resolution drop of the image detector. Results from the simulation of spatial distribution in a phosphor pixel detector are presented. The spatial resolution can be increased by optimizing pixel size and phosphor thickness.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.254-255
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• 2005

In this paper, we investigated electrical characteristics of the X-ray detector of mercuric iodide (HgI2) film fabricated by PIB(Particle-in-Binder) Method on ITO substrates 17cm$\times$20cm in size with thicknesses ranging from approximately 200${\mu}m$ to 240${\mu}m$. In the present study, using I-V measurements, their electrical properties such as leakage current, X-ray sensitivity, and signal-to-noise ratio (SNR),were investigated. The results of our study can be useful in the future design and optimization of direct active-matrix flat-panel detectors (AMFPD) for various digital X-ray imaging modalities.

• 한국방사선학회논문지
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• 제3권1호
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• pp.17-21
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• 2009

최근 의료진단 분야와 다른 적용분야를 위해 대면적 매트릭스 구조의 엑스선 영상이 활발하게 연구되어 오고 있다. 본 연구에서는, 의료진단을 위한 새로운 평판형 디지털 엑스선 가스 검출기를 제안하고 그에 따른 특성을 검증하고자 한다. 대기압에 반해 가스를 주입하는 어려움 때문에 챔버 형태의 구조로 만들어 질 뿐, 평판형 디지털 엑스선 가스 검출기는 아직 어디에서도 연구된 바 없다. 이에 본 연구에서는 디스플레이 패널 제작 기술을 이용하여 샘플제작을 성공하였다. 실험적인 측정을 위해 만들어진 샘플은 상판에는 유리기판위에 전극, 절연층, 산화마그네슘 보호막을 형성하였으며, 하판에는 엑스선 형광층과 전극을 형성하였다. 누설전류와 엑스선 민감도를 측정하였으며, 전기장에 대한 민감도의 선형성 측정 등의 전기적 특성평가를 실시하였다. 이에 대한 결과로 안정된 누설전류와 엑스선 민감도를 얻었다. 그리고 조사 선량에 따라 좋은 선형성을 보이는 등 넓은 진단 동적영역을 확인할 수 있었다. 이러한 결과로 평판형 엑스선 가스 검출기의 디지털 엑스선 영상 검출기로의 적용 가능성을 확인 할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.176-176
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• 2007

Flat-panel direct conversion detectors used in compound substance of semiconductor are being studied for digital x-ray imaging. Recently, such detectors are deposited by physical vapor deposition(PVD) generally. But, most of materials (HgI2, PbI2, TlBr, PbO) deposited by PVD have shown difficult fabrication and instability for large area x-ray imaging. Consequently, in this paper, we propose applicable potentialities for screen printing method that is coated on a substrate easily. It is compared to electrical properties among semiconductors such as $HgI_2$, $PbI_2$, PbO, HgBrI, InI, and $TlPbI_3$ under investigation for direct conversion detectors. Each film detector consists of an ~25 to $35\;{\mu}m$ thick layer of semiconductor and was coated onto the substrate. Substrates of $2cm{\times}2cm$ have been used to evaluate performance of semiconductor radiation detectors. Dark current, sensitivity and physics properties were measured. Leakage current of $HgI_2$ as low as $9pA/mm^2$ at the operation bias voltage of ${\sim}1V/{\mu}m$ was observed. Such a value is not better than PVD process, but it is easy to be fabricated in high quality for large area x-ray Imaging. Our future efforts will concentrate on optimization of growth of film thickness that is coated onto a-Si TFT array.

• 한국방사선학회논문지
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• 제3권1호
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• pp.5-9
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• 2009

디지털 방사선 검출기의 주된 연구동향은 영상의 해상도 향상, 대면적화, 동영상 구현 등${\cdots}$ 이라 할 수 있다. 이런 연구는 방사선 변환과정에 따라 크게 직접변환 방식과 간접 변환 방식으로 나눌 수 있으며 각각 고유한 장단점을 내포하고 있다. 간접변환 방식의 경우 형광체의 사용으로 인한 Light scattering 문제로 해상력의 저하 그리고 직접방식의 경우는 낮은 system 안정성과 동영상 구현의 어려움 등이 대표적이라 할 수 있다. 이런 문제를 해결하기 위한 연구로써 액정을 이용한 엑스선 검출기 연구가 진행되었으나 그 구조의 특성상 균일한 액정의 주입이 어려워 제작에 있어 많은 어려움이 있다. 따라서 본 논문에서는 기존의 문제점을 해결할 수 있는 구조를 제안하고 이를 Simulation 통해 제안된 구조의 가능성을 검토해 보았다.