• Journal of Digital Contents Society
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• v.15 no.6
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• pp.683-699
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• 2014

This study examines the key factors which influence the strategic consideration and intention of adoption of internet marketing of small-and-medium sized companies, based on theoretical consideration of innovation diffusion theory and previous studies related. The result of analysis shows that the degree of market competitiveness, customer dependency, the level of internet marketing knowledge and experience have significant effects on both of strategic consideration and adoption intention for internet marketing. Also, learning commitment has negative influence on strategic consideration only, while environmental dynamism does on adoption intention. Comprehensively, the findings implies that firms consider selection of internet marketing to reduce the severity of competitiveness and that firms which has more knowledge or experience about internet marketing seems to consider selection of internet marketing through the perception of the effects of internet marketing or possible access to internet marketing. Based on the findings that the level of internet marketing knowledge and experience have much significant effects on both of strategic consideration.

• Journal of the Economic Geographical Society of Korea
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• v.12 no.4
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• pp.477-493
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• 2009

This research aims to examine Korean regional innovation governance, find structural problems, and explore alternative strategies of regional innovation governance. Especially the alternative governance was searched through the case study of Daegu-Kyungbuk mobile cluster, of which formulation Samsung is the anchor institution. Regional innovation governance in this research is defined as a policy system to link knowledge generation & diffusion subsystem and knowledge application & exploitation subsystem, and institutional conditions to steer the system. "Social Capital Assessment Tool (SOCAT)" of the World Bank was utilized for the appreciation of cluster governance. The regional innovation governance of Daegu-Kyungbuk mobile cluster is characterized as production networks dominated by one-to-one relationship between Samsung and hardware/software developers, decentralized R&D networks and policy networks with multiple hubs. Major policy agents have not developed networks with local companies, and rare are interactions between the policy agents. Local companies, especially software developers, responded they have had experiences to cooperate for local problem solving and shared their community goal, however, the degree of trust in major local project leaders is not high. Local hardware/software developers with core technologies need to be cooperative to develop similar technologies or products in Daegu-Kyungbuk mobile cluster. Regional administrative actors, such as the City of Daegu and Kyungsangbuk-do, and diverse innovation-related institutes should build cooperative environment where diverse project-based cooperation units are incessantly created, taken apart, and recreated.

• Journal of Intelligence and Information Systems
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• v.28 no.2
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• pp.207-235
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• 2022

In a knowledge-based society where knowledge and information industries are the main pillars of the economy, knowledge sharing and diffusion and its systematic management are recognized as essential strategies for improving national competitiveness and sustainable social development. In the field of Information Systems (IS) research, where the convergence of information technology and management takes place in various ways, the evolution of knowledge occurs only when researchers cooperate in turning old knowledge into new knowledge from the perspective of the scientific knowledge network. In particular, it is possible to derive new insights by identifying topics of interest in the relevant research field, applied methodologies, and research trends through network-based interdisciplinary graftings such as citations, co-authorships, and keywords. In previous studies, various attempts have been made to understand the structure of the knowledge system and the research trends of the relevant community by revealing the relationship between research topics, methodologies, and co-authors. However, most studies have compared two or more journals and been limited to a certain period; hence, there is a lack of research that looked at research trends covering the entire history of IS research. Therefore, this study was conducted in the following order for all the papers (from its first issue in 1977 to the first quarter of 2022) published in the MIS Quarterly (MISQ) Journal, which plays a leading role in revealing knowledge in the IS research field: (1) After extracting keywords, (2) classifying the extracted keywords into research topics, methodologies, and theories, and (3) using topic modeling and keyword network analysis in order to identify the changes from the beginning to the present of the IS research in a chronological manner. Through this study, it is expected that by examining the changes in IS research published in MISQ, the developing patterns of IS research can be revealed, and a new research direction can be presented to IS researchers, nurturing the sustainability of future research.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Economic Geographical Society of Korea
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• v.14 no.4
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• pp.486-505
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• 2011

The Korean miracle of economic growth or development has been quite well known across the world up to now, while being subject to theorization of its model. Compared with this, however, it is quite surprising to see how little about the spatial aspect of Korean development has been exposed in the field of development studies. In fact, for Korea, competent regional policy has turned out to be an important success factor for the spatial upgrading of a low-tech growth regime into a hi-tech one. This paper dissects Korea's regional policy experiences in three aspects from which it draws up a three-tier lesson. The first aspect is the conventional (overall) regional spatial upgrading policy of a developmental regime put in place since the 1960s onwards. The second is the new regional policy tailored to the regionalization of technological and industrial diffusion for new knowledge-based economy. The third is the prospective regional policy for the future advancement of the Korean economy.

• Journal of Korea Technology Innovation Society
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• v.16 no.3
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• pp.784-808
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• 2013

The importance of the creation, diffusion and utilization of the knowledge and information has been magnified at the 21st century of knowledge and information society. If the utilization level of the web site of the national-level R&D information system is enhanced, the duplication of the researches as well as overlapped R&D investment could be greatly reduced. In this regards, this study aims to identify the factors which affect customer value and intention of continued usage for the national science & technology information services (NTIS & NDSL). The empirical research results show that information service quality have a significant influence on the continuous usage intention of science & technology information service. Customer value, as well, influence the continued usage intention as a mediating variable. In addition, the situational factors of information use by itself shows a significant effect on customer value, but it does not moderating the relationship between information service quality and customer value. After a description of research result, we discussed implications and limit of the study as well as future study direction.

• Cartoon and Animation Studies
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• s.9
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• pp.59-79
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• 2005

The paper concerns the role model of the local cultural industry agencies, which were established by the local government for the purpose of fostering the regional cultural industries. In this article, the term of the innovative milieu refers to the interaction and network system for the creation, diffusion and application of knowledge. In doing so, the case on the Gyeonggi Digital Content Agency(GDCA), which has managed the Digital Animation Academy and the cultural heritage based digital content development project will be examined in terms of the network between academic and industry. As a result of the case study, it is not certain that the activities and policy programs of the GDCA has affected the improvement of the knowledge and network environment in the field of cultural content industries. This demonstrates industries rather than the innovation system as a whole. In this respect, the paper develops the Cultural Content R & D Network Model for the improvement of the creative partnership among universities, companies and public sector organizations. In addition, the paper suggests that the Digital Animation Academy should be managed in terms of the improvement of the innovative environment of the regional cultural content cluster.

• Knowledge Management Research
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• v.16 no.3
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• pp.23-40
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• 2015

Despite much interest and investment in the Internet of Things (IoT) which expand the Internet to a ubiquitous network including objects in the physical world, there is growing concerns of privacy protections. Because the risk of privacy invasion is higher in IoT environments than ever before, privacy need to be a key issue in the diffusion of IoT. Considering that the privacy concern is a critical barrier for user to adopt information technologies, it is important to investigate users' privacy concerns related to IoT applications. From the triad perspective (i.e., risk on technology, risk on service provider, and trust on legislation), this study aims to examine users' privacy concerns in the context of activity trackers.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.9
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• pp.454-464
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• 2018

The OECD estimates that a high concentration of intangible capital is in the richest countries of the world. Studies show that intangibles have a positive relation with economic growth. However, different types of intangibles can have different impacts on economic performance. Therefore, this paper attempts to distinguish the differences within the intangibles in influencing economic growth by analyzing three different characteristics of the intangibles. Three main types of intangibles (computerized information, innovative property and economic competencies) are analyzed based on the degree of tacitness, the process of creation and diffusion, and the level of embedded value-added. This research uses Polanyi's classification of tacitness of knowledge, the Nonaka-Takeuchi Model and the "smiling curve" to find that not only investing more in intangible capital but also developing more "tacit" type of intangibles are important for economic growth.