• Proceeding of EDISON Challenge
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• 2017.03a
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• pp.499-505
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• 2017

Photoisomerizing molecules which can transform their structure by the light irradiation have great deal for the application of photo-switching devices. And azobenzene is the representive type of the photoisomerizing molecules. It can transform their trans- structures into cis- structure as the light for certain wave lengths they receive. This property shows the potential of ON/OFF switching functionalization which can be used into the nano scale photo switch. Furthermore, many studies are interested in the organic linkers that connect the azobenzene and metal electrodes. We used S, $CH_2S$, $(CH_2)_4S$ as the linker to watch the influence of linkers for electronic properties. So We suggest a photoswitching device based on the vertical junction using the first-principles calculations with density functional theory and non-equilibrium Greens function (NEGF). By analyzing the electronic structure and tunneling current caused by the structural difference of the system between cis- and trans- azobenzene, the difference in switching mechanism, ON/OFF ratio and transmission will be watched as the linker changes. And finally We will suggest which linker would be the better for the optimal device architecture which can achieve high control of the ON/OFF photocurrent ratio. This result will show the potential of azobenzene-based photoswitch and provide the critical insight in constructing the optimal device architecture.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.11
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• pp.981-986
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• 2008

The conventional IGBT has two problems to make the device taking high performance. The one is high on state voltage drop associated with JFET region, the other is low breakdown voltage associated with concentrating the electric field on the junction of between p base and n drift. This paper is about the structure to effectively improve both the lower on state voltage drop and the higher breakdown voltage than the conventional IGBT. For the fabrication of the circular trench IGBT with the circular trench layer, it is necessary to perform the only one wet oxidation step for the circular trench layer. Analysis on both the on state voltage drop and the breakdown voltage show the improved values compared to the conventional IGBT structure. Because the circular trench layer disperses electric field from the junction of between p base and n drift to circular trench, the breakdown voltage increase. The on state voltage drop decrease due to reduction of JFET region and direction changed of current path which pass through reversed layer channel. The electrical characteristics were studied by MEDICI simulation results.

• Progress in Superconductivity
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• v.10 no.2
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• pp.99-102
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• 2009

We report our development of the fabrication process of sub-micron scale $Al-AlO_x-Al$ tunnel junction by using electron-beam lithography and double-angle shadow evaporation technique. We used double-layer resist to construct a suspended bridge structure, and double-angle electron-beam evaporation to form a sub-micron scale overlapped junction. We adopted an e-beam insensitive resist as a bottom sacrificing layer. Tunnel barrier was formed by oxidation of the bottom aluminum layer between the bottom and top electrode deposition, which was done in a separate load-lock chamber. The junction resistance is designed and controlled to be 50 $\Omega$ to match the impedance of the transmission line. The junctions will be used in the broadband shot noise thermometry experiment, which will serve as a link between the electrical unit and the thermodynamic unit.

• Progress in Superconductivity and Cryogenics
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• v.23 no.2
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• pp.6-9
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• 2021

Heterostructures fabricated by various combinations of van der Waals (vdW) materials enable us to investigate disorder-free physical properties and realize novel functional devices. Superconducting vdW junctions have attracted a lot of attention because of its simple structure without a barrier layer. In superconducting vdW junction, without extra fabrication effort, a natural barrier can be formed, whose character is sensitive to distance and angle of lattice between two superconducting vdW materials. Using high-quality single crystals and the dry transfer technique, we fabricated the vertically stacked NbSe₂/NbSe₂ and FeSe/FeSe vdW junctions and investigated their Josephson junction properties. We found that in the FeSe junctions, Josephson coupling is extremely sensitive to the fabrication conditions, in contrast to the NbSe₂ junctions. We attributed this distinct character of the FeSe junctions to surface instability and small Fermi surface of FeSe.

• Magazine of the Korean Society of Agricultural Engineers
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• v.39 no.4
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• pp.106-113
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• 1997

Dynamic loading of structures often causes excursions of stresses well into the inelastic range, and the influence of the geometric changes on the dynamic response is also significant in many cases. Therefore, both material and geometric nonlinearity effects should be considered in case that a dynamic load acts on the structure. A structure in a nuclear power plant is a structure of importance which puts emphasis on safety. A nuclear container is a pressure vessel subject to internal pressure and this structure is constructed by a reinforced concrete or a pre-stressed concrete. In this study, the material nonlinearity effect on the dynamic response is formulated by the elasto-viscoplastic model highly corresponding to the real behavior of the material. Also, the geometrically nonlinear behavior is taken into account using a total Lagrangian coordinate system, and the equilibrium equation of motion is numerically solved by a central difference scheme. The constitutive relation of concrete is modeled according to a Drucker-Prager yield criterion in compression. The reinforcing bars are modeled by a smeared layer at the location of reinforcements, and the steel layer model under Von Mises yield criteria is adopted to represent an elastic-plastic behavior. To investigate the dynamic response of a nuclear reinforced concrete containment structure, the steel-ratios of 0, 3, 5 and 10 percent, are considered. The results obtained from the analysis of an example were summarized as follows 1. As the steel-ratio increases, the amplitude and the period of the vertical displacements in apex of dome decreased. The Dynamic Magnification Factor(DMF) was some larger than that of the structure without steel. However, the regular trend was not found in the values of DMF. 2. The dynamic response of the vertical displacement and the radial displacement in the dome-wall junction were shown that the period of displacement in initial step decreased with the steel-ratio increases. Especially, the effect of the steel on the dynamic response of radial displacement disapeared almost. The values of DMF were 1.94, 2.5, 2.62 and 2.66, and the values increased with the steel-ratio. 3. The characteristics of the dynamic response of radial displacement in the mid-wall were similar to that of dome-wall junction. The values of DMF were 1.91, 2.11, 2.13 and 2.18, and the values increased with the steel-ratio. 4. The amplitude and the period of the hoop-stresses in the dome, the dome-wall junction, and the mid-wall were shown the decreased trend with the steel-ratio. The values of DMF were some larger than those of the structure without steel. However, the regular trend was not found in the values of DMF.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.195-196
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• 2009

This paper describes the fabrication and characteristics of polycrystalline 3C-SiC thin film diodes for extreme environment applications, in which the this thin film was deposited onto oxidized Si wafers by APCVD using HMDS In this work, the optimized growth temperature and HMDS flow rate were $1,100^{\circ}C$ and 8sccm, respectively. A Schottky diode with a Au, Al/poly 3C-SiC/$SiO_2$/Si(n-type) structure was fabricated and its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) values were measured as 0.84V, over 140V, 61nm, and $2.7{\times}10^{19}cm^2$, respectively. To produce good ohmic contact, Al/3C-SiC were annealed at 300, 400, and $500^{\circ}C$ for 30min under a vacuum of $5.0{\times}10^{-6}$Torr. The obtained p-n junction diode fabricated by poly 3C-SiC had similar characteristics to a single 3C-SiC p-n junction diode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.910-917
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• 2009

We have designed a new structures of Junction Field Effect Transistor(JFET) using SILVACO simulation to improve electrical properties and process reliability. The device structure and process conditions of Si control JFET(Si JFET) were determined to set cut off voltage and drain current(at Vg=0 V) to -0.46 V and $300\;{\mu}A$, respectively. Among many design parameters influencing the performance of the device, the drive-in time of p-type gate is presented most predominant effects. Therefore we newly designed SiGe JFET, in which SiGe layers were placed above and underneath of Si-channel. The presence of SiGe layer could lessen Boron into the n-type Si channel, so that it would be able to enhance the structural consistency of p-n-p junction. The influence of SiGe layer could be explained in conjunction with boron diffusion and corresponding I-V characteristics in comparison with Si-control JFET.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.133-134
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• 2006

A simple doping method to fabricate a very thin channel body of the n-type fin field-effect-transistor (FinFET) with a 20 nm gate length by solid-phase-diffusion (SPD) process is presented. Using As-doped spin-on-glass as a diffusion source of arsenic and the rapid thermal annealing, the n-type source-drain extensions with a three-dimensional structure of the FinFET devices were doped. The junction properties of arsenic doped regions were investigated by using the $n^+$-p junction diodes which showed excellent electrical characteristics. Single channel and multi-channel n-type FinFET devices with a gate length of 20-100 nm was fabricated by As-SPD and revealed superior device scalability.

• ETRI Journal
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• v.19 no.4
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• pp.402-413
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• 1997

A CMOS device which has an extended heavily-doped amorphous silicon source/drain layer on the field oxide and an amorphous silicon local interconnection (ASLI) layer in the self-aligned source/drain region has been studied. The ASLI layer has some important roles of the local interconnections from the extended source/drain to the bulk source/drain and the path of the dopant diffusion sources to the bulk. The junction depth and the area of the source/drain can be controlled easily by the ASLI layer thickness. The device in this paper not only has very small area of source/drain junctions, but has very shallow junction depths than those of the conventional CMOS device. An operating speed, however, is enhanced significantly compared with the conventional ones, because the junction capacitance of the source/drain is reduced remarkably due to the very small area of source/drain junctions. For a 71-stage unloaded CMOS ring oscillator, 128 ps/gate has been obtained at power supply voltage of 3.3V. Utilizing this proposed structure, a buried channel PMOS device for the deep submicron regime, known to be difficult to implement, can be fabricated easily.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2018.10a
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• pp.381-382
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• 2018

Subthreshold swings (SSs) and on-currents of four types of junctionless nanowire tunnel field-effect transistor(JLNW-TFET) are observed. Ge-Si structure for the source-channel junction has the highest drive current among Si-Si, Si-Ge, and Ge-Ge junction, and the drive current increases up to 1000 times compared to others. Minimum SS of Si-Si junction is reduced by up to 5 times more than others.