• Journal of Welding and Joining
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• v.19 no.3
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

• Journal of the Korean Society for Heat Treatment
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• v.6 no.1
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• pp.9-16
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• 1993

To investigate the properties of diffusion bonding of 7050 Al alloy, the diffusion bonding joints have been produced in self-made diffusion bonding hot-press which admits a defined application of the bonding pressure during the heating phase and also rapid cooling after the bonding process with various bonding condition. The strength of the bond increases with increasing the bonding time and temperature. Shear test at toom temperature showed that high strength up to 70% that of parent metal (320 MPa), 220 MPa for the specimen bonded 14 hr at $560^{\circ}C$, with 3 MPa. In this case, however, there is large deformation more than 20% reduction in thickness. The results were correlated with joint characteristics found by optical microstructure and by fractography by SEM. When the strengths of the bonds are more than 50% that of parent metal, a great deal of dimples stretched along the direction of shear stress are observed over the fractured surface of the bond. On the microstructure of the bond line, initial mophology of the bond line disapeared for the grain boundary migration with increasing the bonding time.

• Journal of Korean Society of Steel Construction
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• v.12 no.4 s.47
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• pp.339-350
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• 2000

The objective of this study is to investigate the structural behavior of the beam to column connection with reformed T-stubs and to ascertain the application of semi-rigid connection with reformed T-stubs to middle high rise buildings. The tests of steel frame using semi-rigid connections with reformed T-stub and existing T-stub were performed under cyclic loading condition. Finite element analysis was also carried out and the results of FEM were compared with results of tests. The thickness of reformed T-stub and the distance of bolt were used for parameters in the analysis. The structural behaviors of reformed T-stub were understood qualitatively and the possibility of application of semi-rigid connections with reformed T-stubs was ascertained.

• Journal of Korean Society of Steel Construction
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• v.16 no.5 s.72
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• pp.565-574
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• 2004

The purpose of this paper was to investigate the block shear and the fracture in the net section, according to AISC Specifications, by analysing the shear lag effect in the block shear rupture of the single angle with three or four bolt connection. Specimen with three or four bolt connections showed that failure generally went from block shear with some net section failures to classic net section failures. From the test results, showed that the connection length, the thickness of angle, and reduction factor, which affect the block shear rupture, were investigated. According to the test results, it is suggested that the calculation of the net section rupture capacity by using the reduction factor of U, that was suggested by Kulak, is needed.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• Transactions of the Korean Society of Automotive Engineers
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• v.3 no.6
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• pp.96-111
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• 1995

A bellows is a component installed in the automobile exhaust system to reduce the impact from an engine. It's stiffness has a great influence on the natural frequency of the system. Therefore, it must be designed to keep the specified stiffness that requires in the system. This study present the finite element analysis of U-typed bellows using a curved conical frustum element and the shape optimal design with specified stiffness. The finite element analysis is verified by comparing with the experimental results. In the shape optimal design, the weight is considered as the cost function. The specified stiffness from the system design is transformed to equality constraints. The formulation has inequality constraints imposed on the fatigue limit, the natural frequencies, the buckling load and the manufacturing conditions. A procedure for shape optimization adopts a thickness, a corrugation radius, and a length of annular plate as optimal design variables. The external loading conditions include the axial and lateral loads with a boundary condition fixed at an end of the bellows. The recursive quadratic programming algorithm is selected to solve the problem. The result are compared with the existing bellows, and the characteristics of the bellows is investigated through the optimal design process. The optimized shape of the bellows are expected to give quite a good guideline to the practical design.

• Transactions of the Korean Society of Automotive Engineers
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• v.17 no.1
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• pp.96-104
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• 2009

An anatomically detailed elderly human body model is under development. Using the anthropometric database of domestic nation-wide size survey, SizeKorea, a standard size and shape of 50th %tile elderly was constructed. Through the local recruitment process, a male volunteer with 71 years of age, 163cm of height and 63kg of weight has been selected. The exterior (skin) and interior (skeleton and organ) geometries were acquired from whole body 3D laser scan and various medical images such as CT, X-ray, and Ultrasonic of the volunteer. A particular attention has been paid into the combining process of exterior and interior geometries especially for joint articulation positions since they were measured at different postures (sitting vs. supine). A whole ribcage of PMHS which possessed similar anthropometry and age of standard 50th %tile elderly was prepared and dissected for the precise gauge of cortical rib bone thickness distributions. After completing the morphological construction of elderly human body, the finite element modeling will be processed by meshing elements and assigning mechanical properties to various biological tissues which reflect the aging effect.

• Journal of the Korean institute of surface engineering
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• v.36 no.5
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• pp.386-392
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• 2003

The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

• Nuclear Engineering and Technology
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• v.30 no.3
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• pp.262-272
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• 1998

The experiences and causes of pressure tube cracking accidents in the CANDU reactors and the development of the fuel channel at AECL(Atomic Energy Canada Limited) have been described. Most of the accidents were caused by Delayed Hydride Cracking(DHC). In the cases of the Pickering units 3&4 and the Bruce unit 2, excessive residual stresses induced by an improper rolled joint process played a role in DHC. In the Pickering unit 2, cracks formed by contact between the pressure and calandria tubes due to the movement of the garter spring were the direct cause of the failure. To extend the life of a fuel channel, several R&D programs examining each component of the fuel channel have been carried out in Canada. For a pressure tube, the main concern is focused on changing the fabrication processes, e.g., increasing cold working rate, conducting intermediate annealing and adding a third element like Fe, V, and Cr to the tube material. In addition to them, chromium plating on the end fitting and increasing wall thickness at both ends of the calandria tube are considered. There has also been much interest in the improvement of fuel channel performance in our country and several development programs are currently under way.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.783-788
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.