• 한국세라믹학회지
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• 제35권9호
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• pp.899-904
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• 1998

Interface reaction between LSMC and YSZ is discussed with chemical composition of LSMC. The reac-tivity between LSMC and YSZ increased with increasing Co amount and A-site deficient perovskite is very effective on reducing reactivity. The (La0.8Sr0.2)xMn0.8Co0.2O3 (X=0.9-1) composition is not reactive with YSZ in experimental range. The electrode reaction reaction resistance increases due to reaction product.

• 한국항공우주학회지
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• 제34권5호
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• pp.88-92
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• 2006

과학기술위성 2호 사용되는 구동기인 반작용 휠(Reaction Wheel Assembly, RWA)과 위성 시스템을 연결해주는 인터페이스를 담당하는 Reaction Wheel Assembly Interface Unit(RIU)의 Proto Flight Model의 개발이 완료되고 동작시험을 마쳤다. RIU는 RWA에 공급되는 전원을 켜고 끄는 스위치와 명령을 주고 받는 위성탑재 컴퓨터(OBC)의 통신 회선을 선택하는 멀티플렉서, 그리고 RWA에 연결되는 물리적 통신라인으로 구성된다.

• 대한인간공학회지
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• 제35권5호
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• pp.403-411
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• 2016

Objective: This study is concerned with the user interface (UI) design of touch screen based on the reaction time of Automated Teller Machine (ATM) user. Background: Adopting the touch screen technology, the ATM service has recently established a new user interface different from the existing button-type interface. Method: Experiments were conducted by simulating ATM touch screen layouts, and layouts were focused on location of menu buttons (left and right, top and bottom), number of menu buttons (8 and 12 buttons). Results: The results show that there are significant differences in correction ratio and reaction time by user groups, types of menu location, and the number of buttons. Conclusion and Applications: The results of this study can be used to provide baseline information for the interface design of ATM touch screen and the age differences in reaction time.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1996년도 특별강연 및 춘계학술발표 개요집
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• pp.6-9
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• 1996

The Joining of copper rod and zirconia tube was carried out in Ar gas atmosphere. There are two type of the joining. The one is the reaction bond consisting of Cu and zirconia was dominated by surface reaction wi th a undetctable very thin layer. It was found that copper elements were diffused to zirconia side, but that most of Z $r^{4+}$ ions were not diffused to copper side. This result means application of a DC voltage to migrate oxygen to the copper/zirconia interface can oxidize metal at the copper /zirconia interface, and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result means application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cr.

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2005년도 수소연료전지공동심포지움 2005논문집
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• pp.383-390
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• 2005

Effect of applying a DC voltage on the interfacial reaction at the metal to zirconia interface was investigated utilizing an oxygen ionic conductivity of partially stabilized zirconia. The joining of copper rod and zirconia tube was carried out in Ar gas atmosphere at $1000^{\circ}C$. There are two type of the joining. The one is the reaction bond consisting of copper and zirconia was dominated by surface reaction with a undetectable very thin layer. It was found that copper elements were diffused to zirconia side, but that Zr ions were not diffused to copper side. These results mean application of a DC voltage to migrate oxygen to the copper-zirconia interface can oxidize metal at the copper-zirconia interface and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result mean application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cu.

• 공업화학
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• 제16권2호
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• pp.288-291
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• 2005

Resol형 페놀수지(phenol-formaldehyde (PF) resin)는 페놀(phenol: P)에 포름알데히드(formaldehyde: F)를 첨가하여 반응시키는 부가반응과 물을 제거하는 축합반응에 의해 합성된다. 본 연구에서는 부가반응 반응변수인 F/P몰비, 촉매의 농도, 반응온도 및 반응시간 등의 영향에 관하여 연구하였다. 또한 반응시간의 조절에 따른 합성된 페놀수지의 분자량과 점도에 미치는 영향을 조사하였다. 실험결과, 부가반응에서 촉매농도와 반응온도가 높아질수록 반응시간은 크게 감소되는 경향을 나타내었다. 또한 축합반응에서 페놀수지의 점도는 반응시간이 증가할수록 1500cps에서 9000 cps까지 증가하였고, 분자량은 500~1100 g/mol 범위의 저 분자량을 나타내었다.

• 한국유변학회:학술대회논문집
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• 한국유변학회 2002년도 춘계 학술발표회 논문집
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• pp.25-27
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• 2002

In this study we investigated the reaction kinetics by a convenient but useful method-rheology to characterize the interface between two immiscible blends with a Reactive compatibilizer. Also, we made an attempt to correlate changes of interface roughness with rheological properties. The blend systems employed in this study was mono-carboxylated polystyrene (PS-mCOOH) and an poly(methyl methacrylate-ran-glycidylmethacrylate) (PMMA-GMA). PS-mCOOH was synthesized by an anionic polymerization and PMMA-GMA by a free radical polymerization. We prepared two plates of each polymer using compression molding with a smooth surface molder, then put one upon another. As soon as these two plates welds together inside a rheometer under nitrogen environment, the torque and moduli were obtained with reaction time at different temperatures. Through the analysis of this modulus change with reaction time, we estimated interfacial reaction and roughening. The increment of modulus in initial state can be correlated to the extent of reaction. We obtained the reaction kinetic constant by fitting appropriate kinetic equation into experimental data. We also showed that increment of modulus in later state was due to by roughened interface.

• 한국초전도ㆍ저온공학회논문지
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• 제24권4호
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• pp.25-28
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• 2022

We investigated the formation of superconducting intergrowth phases through the interface reaction both between TlSr₂Cu₁O₅ (Tl-121) and (CrO₄)Sr₂CuO₂, and between Tl -121 and ((CO₃)_0.5(CrO₄)_0.5 Sr₂CuO₂ phases. We found oxychromate intergrowth phases can be formed through the interface reactions and a new superconducting oxychromate compound TlSr₄Cu₂O_z(CO₃)_0.5(CrO₄)_0.5 with T_c above 73 K was discovered based on the results of the interface reactions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional Pt layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at $330^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.

• 한국분말재료학회지
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• 제4권3호
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.