A Study on the Metal to Zirconia Joining by Applying Direct Current

직류전원부하에 의한 지르코니아와 금속의 접합

  • Kim Sung Jin (Department of Materials Science and Metallurgical Engineering, KumOh National Institute of Technology) ;
  • Kim Moon Hyop (Department of Materials Science and Metallurgical Engineering, KumOh National Institute of Technology) ;
  • Park Sung Bum (Department of Materials Science and Metallurgical Engineering, KumOh National Institute of Technology) ;
  • Gwon Won Il (Department of Materials Science and Metallurgical Engineering, KumOh National Institute of Technology)
  • 김성진 (금오공과대학교 재료금속공학과) ;
  • 김문협 (금오공과대학교 재료금속공학과) ;
  • 박성범 (금오공과대학교 재료금속공학과) ;
  • 권원일 (금오공과대학교 재료금속공학과)
  • Published : 2005.07.01

Abstract

Effect of applying a DC voltage on the interfacial reaction at the metal to zirconia interface was investigated utilizing an oxygen ionic conductivity of partially stabilized zirconia. The joining of copper rod and zirconia tube was carried out in Ar gas atmosphere at $1000^{\circ}C$. There are two type of the joining. The one is the reaction bond consisting of copper and zirconia was dominated by surface reaction with a undetectable very thin layer. It was found that copper elements were diffused to zirconia side, but that Zr ions were not diffused to copper side. These results mean application of a DC voltage to migrate oxygen to the copper-zirconia interface can oxidize metal at the copper-zirconia interface and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result mean application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cu.

Keywords