• Title/Summary/Keyword: interface cracks

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Estimation of Thermal Stresses Induced in Polymeric Thin Film Using Boundary Element Methods

  • Lee, Sang-Soon
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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    • pp.27-33
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    • 2002
  • The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.

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유사등방성과 이방성 이종재료 내의 V-노치 균열에 대한 응력특이성에 관한 연구 (A Study on Stress Singularities for V-notched Cracks in Pseudo-isotropic and Anisotropic Dissimilar Materials)

  • 조상봉;김진광
    • 한국정밀공학회지
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    • 제16권10호
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    • pp.152-163
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    • 1999
  • The problem of eigenvalue and eigenvector for v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was obtained to discuss stress singularities from traction free boundary and perfect bonded interface conditions assuming like the form of complex stress function for v-notched cracks in an isotropic material. Eigenvalues were solved by a commercial numerical program, MATHEMATICA. The relation between wedged angle and material property for eigenvalue, ${\lambda}$ indicating stress singularities of v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was examined.

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소성온도가 도자기의 기계적 특성 및 접촉손상에 미치는 영향 (Effect of Firing Temperature on Mechanical Property and Contact Damage in Pottery)

  • 정연길
    • 한국세라믹학회지
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    • 제35권12호
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    • pp.1343-1350
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    • 1998
  • A study is made of mechanical properties of unglazed matrix as a funtion of sintering temperature and crack patterns in layer structur pottery consisting of glaze and substrate and in matrix which is sintered at 120$0^{\circ}C$ and 130$0^{\circ}C$ respectively. The mechanical properties of matrix are increased due to density and vitrification to 130$0^{\circ}C$ The interface of glazed bilayer reveals the reactive intermediate layer. Herzian indentation testing is used to investigate the evolution of damage modes as a function of load. In the materials sintered at 120$0^{\circ}C$ quasi-plastic deformation is developed at the matrix and the cone-like cracks initiate at the glazing top surface and additionally upward-extending transverse cracks initiate at the internal in-just initiate at the glazing top surface which pass through the interface with increasing of indentation load. Finally the dominant damage mode shifts from substrate quasi-plasticity to coating fracture with increasing sintering temperature.

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THREE-DIMENSIONAL CRYSTALLIZING $\pi$-BONDINGS AND WEAR OF METALS

  • Oh, Hung-Kuk
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1995년도 춘계학술대회논문집
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    • pp.78-89
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    • 1995
  • Phenomelocial evidences for three-dimensional crystallizing $\pi$-bondings are investigated in case of the soft layer very near the suface of the metal , the surface layer of certain crystaline thermoplastics. the increased contact area of the metalic frictional interface and the delaminated sheet-like wear particles of the metal . The wear mechanisms are the cracks at the boundaries of the grains and their propagations parallel to the surface. The cracks are made by the reorientations of the atoms in the grains and the rotations of the grains.

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Estimation of Interfacial Adhesion through the Micromechanical Analysis of Failure Mechanisms in DLC Film

  • Jeong, Jeung-Hyun;Park, Hae-Seok;Ahn, Jeong-Hoon;Dongil Kwon
    • The Korean Journal of Ceramics
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    • 제3권2호
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    • pp.73-81
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    • 1997
  • In this paper, it is intended to present more reproducible and quantitative method for adhesion assemssement. In scratch test, micromechanical analysis on the stress state beneath the indenter was carried out considering the additional blister field. The interface adhesion was quantified as work of adhesion through Griffith energy approach on the basis of the analyzed stress state. The work of adhesion for DLC film/WC-Co substrate calculated through the proposed analysis shows the identical value regardless of distinctly different critical loads measured with the change of film thickness and scratching speed. On the other hand, uniaxial loading was imposed on DCL film/Al substrate, developing the transverse film cracks perpendicular to loading direction. Since this film cracking behavior depends on the relative magnitude of adhesion strength to film fracture strength, the quantification of adhesion strength was given a trial through the micromechanical analysis of adhesion-dependence of film cracking patterns. The interface shear strength can be quantified from the measurement of strain $\varepsilon$s and crack spacing $\lambda$ at the cessation of film cracking.

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The influence of initial stresses on energy release rate and total electro-mechanical potential energy for penny-shaped interface cracks in PZT/Elastic/PZT sandwich circular plate-disc

  • Akbarov, Surkay D.;Cafarova, Fazile I.;Yahnioglu, Nazmiye
    • Smart Structures and Systems
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    • 제22권3호
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    • pp.259-276
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    • 2018
  • This paper studies the energies and energy release rate (ERR) for the initially rotationally symmetric compressed (or stretched) in the inward (outward) radial direction of the PZT/Elastic/PZT sandwich circular plate with interface penny-shaped cracks. The investigations are made by utilizing the so-called three-dimensional linearized field equations and relations of electro-elasticity for piezoelectric materials. The quantities related to the initial stress state are determined within the scope of the classical linear theory of piezoelectricity. Mathematical formulation of the corresponding problem and determination of the quantities related to the stress-strain state which appear as a result of the action of the uniformly normal additional opening forces acting on the penny-shaped crack's edges are made within the scope of the aforementioned three-dimensional linearized field equations solution which is obtained with the use of the FEM modelling. Numerical results of the energies and ERR and the influence of the problem parameters on these quantities are presented and discussed for the PZT- 5H/Al/PZT-5H, PZT-4/Al/PZT-4, $BaTiO_3/Al/BaTiO_3$ and PZT-5H/StPZT-5H sandwich plates. In particular, it is established that the magnitude of the influence of the piezoelectricity and initial loading on the ERR increases with crack radius length.

이종재료간 V-노치균열의 응력특이성과 응력강도계수의 특성 및 결정에 관한 연구 (A Study on the Determination and Characteristics of Stress Intensity Factors and Stress Singularities for V-notched Cracks in Dissimilar Materials)

  • 조상봉;윤성관
    • 대한기계학회논문집
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    • 제16권10호
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    • pp.1890-1899
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    • 1992
  • 본 연구에서는 이종재료간의 Ⅴ-노치균열의 노치각도 및 재료의 종류에 따른 응력특이성지수와 응력강도 계수 해석에 각각 뉴톤-랍슨법(newtonraphson method), 뉴톤-랍슨법과 최소자승법을 이용한 선점법(collocation method)인 수치해석적 방법을 응용하고, 광탄성 등색선 무늬를 컴퓨터 그래픽하여 응력특이성지수와 응력강도계수가 모우드(mode)에 미치는 특성과 경계요소법(boundary element method)으로 응력해석한 결과로써 선점법을 이용하여 응력강도계수를 해석하고 기존의 결과등과 비교, 검토하 고자 한다.

Bond behaviour at concrete-concrete interface with quantitative roughness tooth

  • Ayinde, Olawale O.;Wu, Erjun;Zhou, Guangdong
    • Advances in concrete construction
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    • 제13권3호
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    • pp.265-279
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    • 2022
  • The roughness of substrate concrete interfaces before new concrete placement has a major effect on the interface bond behaviour. However, there are challenges associated with the consistency of the final roughness interface prepared using conventional roughness preparation methods which influences the interface bond performance. In this study, five quantitative interface roughness textures with different roughness tooth angles, depths, and tooth distribution were created to ensure consistency of interface roughness and to evaluate the bond behaviour at a precast and new concrete interface using the splitting tensile test, slant shear test, and double-shear test. In addition, smooth interface specimens and two separate the pitting interface roughness were also utilized. Obtained results indicate that the quantitative roughness has a very limited effect on the interface tensile bond strength if no extra micro-roughness or bonding agent is added at the interface. The roughness method however causes enhanced shear bond strength at the interface. Increased tooth depth improved both the tensile and shear bond strength of the interfaces, while the tooth distribution mainly influenced the shear bond strength. Major failure modes of the test specimens include interface failure, splitting cracks, and sliding failure, and are influenced by the tooth depth and tooth distribution. Furthermore, the interface properties were obtained and presented while a comparison between the different testing methods, in terms of bond strength, was performed.

Crack behaviour of top layer in layered rocks

  • Chang, Xu;Ma, Wenya;Li, Zhenhua;Wang, Hui
    • Geomechanics and Engineering
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    • 제16권1호
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    • pp.49-58
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    • 2018
  • Open-mode cracks could be commonly observed in layered rocks. A concept model is firstly used to explore the mechanism of the vertical cracks (VCs) in the top layer. Then the crack behaviour of the two-layer model is simulated based on a cohesive zone model (CZM) for layer interfaces and a plastic-damage model for rocks. The model indicates that the tensile stress normal to the VCs changes to compression if the crack spacing to layer thickness ratio is lower than a threshold. The results indicate that there is a threshold for interfacial shear strength that controls the crack patterns of the layered system. If the shear strength is lower than the threshold, the top layer is meshed by the VCs and interfacial cracks (ICs). When the shear strength is higher than the threshold, the top layer is meshed by the VCs and parallel cracks (PCs). If the shear strength is comparative to the threshold, a combining pattern of VCs, PCs and ICs for the top layer can be formed. The evolutions of stress distribution in the crack-bound block indicate that the ICs and PCs can reduce the load transferred for the substrate layer, and thus leads to a crack saturation state.