• 제목/요약/키워드: interface IC

검색결과 140건 처리시간 0.026초

TSV 기반 3차원 소자의 열적-기계적 신뢰성 (Thermo-Mechanical Reliability of TSV based 3D-IC)

  • 윤태식;김택수
    • 마이크로전자및패키징학회지
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    • 제24권1호
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    • pp.35-43
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    • 2017
  • The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

경계요소법에 의한 반도체 패키지의 균열진전경로 예측 (Prediction of crack propagation path in IC package by BEM)

  • 송춘호;정남용
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.286-291
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    • 2001
  • Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

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Daisy Chain Interface를 위한 DC Level Shifter 설계 (Design of DC Level Shifter for Daisy Chain Interface)

  • 여성대;조태일;조승일;김성권
    • 한국전자통신학회논문지
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    • 제11권5호
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    • pp.479-484
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    • 2016
  • 본 논문은 Daisy Chain 구조의 CVM(:Cell Voltage Monitoring) 시스템에서, 다양한 DC Level을 갖는 Master IC와 Slave IC 사이에 명령 Data 신호의 전달을 가능하게 해주는 DC Level Shifter 설계를 소개한다. 설계한 회로는 래치 구조가 적용되어 고속 동작이 가능하고, 출력단의 Transmission Gate를 통하여 다양한 DC Level이 출력되도록 설계하였다. 시뮬레이션 및 측정 결과, 0V에서 30V까지의 DC Level 변화에 따른 제어 및 Data 신호의 전달을 확인하였다. Delay Time 오차는 약 170ns가 측정되었지만, 측정 Probe의 Capacitance 성분 및 측정 Board의 영향을 고려하면, 무시할 수 있을 정도의 오차로 간주된다.

디지탈 출력 압력 센서 (Digitized Pressure Sensor)

  • 김현철;전국진
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1996년도 추계학술대회 논문집 학회본부
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    • pp.419-421
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    • 1996
  • We propose the digitized pressure sensor and the interface circuit to read directly the pressure signal in the digital form. The interface circuit has the control clock, comparator, and bit value decision circuit. The digitized sensor and interface circuit are integrated on the one chip using the post processing after IC fabrication. The dimension of the fabricated digitized pressure sensor is $3{\times}6{\times}1mm^3$.

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디지털카메라의 자동초점제어를 위한 피에조 구동회로의 설계 (A Design of Piezo Driver IC for Auto Focus Camera System)

  • 이준성
    • 전기전자학회논문지
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    • 제14권3호
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    • pp.190-198
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    • 2010
  • 피에조소자를 구동하여 자동카메라의 초점을 자동으로 제어하는 시스템에서 피에조를 구동하는 집적회로를 설계하였다. 가공된 피에조에 변위를 만들기 위해서는 고전압 DC가 필요하다. 휴대형기기에서 사용하는 3[V]~4.2[V]정도의 낮은 전원전압을 약 80[V]로 승압하여 피에조 구동전압으로 제공하는 한편 입력되는 1[Vp-p]의 제어신호를 -20[V]에서 +80[V]까지 조절되도록 설계하였다. 또한 IC 외부에 적용되는 소자가 최소가 되도록 하여 시스템의 전체 크기를 줄일 수 있도록 하였다. 제어용 프로세서로 IIC(Inter-IC) 인터페이스를 적용하기 위하여 구동회로 내부에 IIC 인터페이스 디지털 로직을 내장하였는데, 이는 제품의 검증, 양산시 양품판정을 쉽게 해주는 장점이 있다. 제작공정은 AMIS 사의 I2T100 2P_3M 공정을 사용하였는데 0.6[um], 100[V]급 BCD공정이며, 6INCH 웨이퍼를 사용하였다. 전원전압 3.6[V], 소비전력은 약 40[mW]정도이다. 칩 사이즈는 1600*1500 [$um^2$]이며, 칩을 소형패키지에 내장하여 조립하였기 때문에 휴대형기기에 적용이 편리하게 되어있다.

The Screening of Nitrite Scavenging Effect of Marine, Algae and Active Principles of Ecklonia Stolonifera

  • CHOI Jae Sue;LEE Ji Hyeon;JUNG Jee Hyung
    • 한국수산과학회지
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    • 제30권6호
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    • pp.909-915
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    • 1997
  • The nitrite scavenging effect of methanol extracts of marine algae were evaluated to discover new natural nitrite scavengers. Among the tested seaweeds, Ecklonia stolonifera, an edible brown algae, showed the strongest scavenging effect. The MeOH extract was then sequentially partitioned into $CH_2Cl_2,\;CH_2Cl_2$ insoluble interface, EtOAc, n-BuOH, and $H_2O$ layers. The EtOAc and n-BuOH fraction demonstrated high levels of nitrite-scavenging activity while the $CH_2Cl_2,\;CH_2Cl_2$ insoluble interface, and $H_2O$ fractions were inactive. A column chromatography of the EtOAc fraction through silica gel and Sephadex LH-20 yielded phloroglucinol and a new compound tentatively named phlorotannin A. The nitrite scavenging activity of phloroglucinol $(IC_{50}=3.9{\mu}g/ml)$ was more potent than that of L-ascorbic acid $(IC_{50}=65.0{\mu}g/ml)$. However, phlorotannin A $(IC_{50}=193.2{\mu}g/ml)$ showed only low levels of activity. From the above results, it is possible to suggest that both the MeOH extract and their fractions and isolated phloroglucinol and phlorotannin A obtained from E. stolonifera may be applicable as scavengers of nitrite, which is a precursor for the formation of carcinogenic N-nitroso compounds.

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새로운 설계 검증법을 이용한 OLED 구동 IC 설계 (Design of the OLED Driver IC using Novel Verification Method)

  • 김정학;정호련;하정균;이주철;이욱;이환우;양휘찬
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2006년도 하계종합학술대회
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    • pp.997-998
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    • 2006
  • This paper proposes an design of the OLED(Organic Light Emitting Diodes) driver IC using novel verification method. This method using the HDL(hardware description language) simulator, PLI(Programing Language Interface) and image viewer. The proposed method can be used efficiently to function verification in display driver IC.

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Advanced Mobile Display System Architecture

  • Kim, Chang-Sun;Kwon, Oh-Kyong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.850-853
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    • 2005
  • This paper presents issues of display hardware architecture, relating to memory, display driver IC architecture, and chip-to-chip interface. To achieve a low power and low cost mobile phone, not only the display architecture must be carefully selected, but also the driver-ICs optimized to accommodate the different modes of operation found in typical handheld devices. The technique of forming a photo sensor in each pixel using TFT and display module architecture are developed to add multi functions in display such as fingerprint recognition, image scanning, and integrated touch screen. Detailed architectures of IC partitioning, high-speed serial interface, D/A converter, and multi functions such as fingerprint recognition and image scanning using photo sensors are important to a power optimized system.

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P1394 시리얼 버스 IC의 설계 (A design of P1394 serial bus IC)

  • 이강윤;정덕균
    • 전자공학회논문지C
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    • 제35C권1호
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    • pp.34-41
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    • 1998
  • In this paper, I designed a P1394 serial bus chip as new bus interface architecture which can transmit the multimedia data at the rate of 400 Mbps and guarantee necessary bandwidth. because multimedia data become meaningless data after appropriate time, it is necessary to transfer multimedia data in real time, P1394 serial bus chip designed in this paper support isochronous transfer mode to solve this problem. Also, designed P1394 serial bus chip can transfer high quality video data or high quality audio data because it support the speed of 400 Mbps. While user must set device ID manually in previous interface such as SCSI, device ID is automatically determined if user connect each node with designed P1394 serial bus cable and power on. To design this chip, I verified the behavioral of the entrire system and synthesized layout. Also, I did layout the analog blocks and blocks which must be optimized in full custom.

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자동차용 ABS 인터페이스의 IC 설계 (The Integrated Circuit Design of Automobile ABS Interface)

  • 정경진;이성필;김찬;전의석
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.7-10
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    • 2003
  • ABS interface IC for automobiles was designed and their electrical properties were investigated. The voltage regulator was designed to operate in the temperature range from $-20^{\circ}\;to\;120^{\circ}C$ for automobile environment. ABS and brake signal were separated using the duty factor of same frequency or different frequencies. UVLO circuit and constant current circuit were applied for the elimination of noise.

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