• Title/Summary/Keyword: inter-diffusion

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Structural Characteristics by Nitridation of Oxygen Added Cr Thin Films in NH3 Atmosphere (산소가 첨가된 Cr 박막의 NH3 분위기에서의 질화 처리에 의한 구조적 특성)

  • Kim, Danbi;Kim, Seontai
    • Korean Journal of Materials Research
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    • v.31 no.11
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    • pp.635-641
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    • 2021
  • Cr thin films with O added are deposited on sapphire substrate by DC sputtering and are nitrided in NH3 atmosphere between 300 and 900 ℃ for various times. X-ray diffraction results show that nitridation begins at 500 ℃, forming CrN and Cr2N. Cr oxides of Cr2O3 are formed at 600 ℃. And, at temperatures higher than 900 ℃, the intermediate materials of Cr2N and Cr2O3 disappear and CrN is dominant. The atomic concentration ratios of Cr and O are 77% and 23%, respectively, over the entire thickness of as-deposited Cr thin film. In the sample nitrided at 600 ℃, a CrN layer in which O is substituted with N is formed from the surface to 90 nm, and the concentrations of Cr and N in the layer are 60% and 40%, respectively. For this reason, CrN and Cr2N are distributed in the CrN region, where O is substituted with N by nitridation, and Cr oxynitrides are formed in the region below this. The nitridation process is controlled by inter-diffusion of O and N and the parabolic growth law, with activation energy of 0.69 eV.

Photo-induced inter-protein interaction changes in the time domain; a blue light sensor protein PixD

  • Terazima, Masahide
    • Rapid Communication in Photoscience
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    • v.4 no.1
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    • pp.1-8
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    • 2015
  • For understanding molecular mechanisms of photochemical reactions, in particular reactions of proteins with biological functions, it is important to elucidate both the initial reactions from the photoexcited states and the series of subsequent chemical reactions, e.g., conformation, intermolecular interactions (hydrogen bonding, hydrophobic interactions), and inter-protein interactions (oligomer formation, dissociation reactions). Although time-resolved detection of such dynamics is essential, these dynamics have been very difficult to track by traditional spectroscopic techniques. Here, relatively new approaches for probing the dynamics of protein photochemical reactions using time-resolved transient grating (TG) are reviewed. By using this method, a variety of spectrally silent dynamics can be detected and such data provide a valuable description about the reaction scheme. Herein, a blue light sensor protein TePixD is the exemplar. The initial photochemistry for TePixD occurs around the chromophore and is detected readily by light absorption, but subsequent reactions are spectrally silent. The TG experiments revealed conformational changes and changes in inter-protein interactions, which are essential for TePixD function. The TG experiments also showed the importance of fluctuations of the intermediates as the driving force of the reaction. This technique is complementary to optical absorption detection methods. The TG signal contains a variety of unique information, which is difficult to obtain by other methods. The advantages and methods for signal analyses are described in detail in this review.

Physics-based modelling and validation of inter-granular helium behaviour in SCIANTIX

  • Giorgi, R.;Cechet, A.;Cognini, L.;Magni, A.;Pizzocri, D.;Zullo, G.;Schubert, A.;Van Uffelen, P.;Luzzi, L.
    • Nuclear Engineering and Technology
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    • v.54 no.7
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    • pp.2367-2375
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    • 2022
  • In this work, we propose a new mechanistic model for the treatment of helium behaviour at the grain boundaries in oxide nuclear fuel. The model provides a rate-theory description of helium inter-granular behaviour, considering diffusion towards grain edges, trapping in lenticular bubbles, and thermal resolution. It is paired with a rate-theory description of helium intra-granular behaviour that includes diffusion towards grain boundaries, trapping in spherical bubbles, and thermal re-solution. The proposed model has been implemented in the meso-scale software designed for coupling with fuel performance codes SCIANTIX. It is validated against thermal desorption experiments performed on doped UO2 samples annealed at different temperatures. The overall agreement of the new model with the experimental data is improved, both in terms of integral helium release and of the helium release rate. By considering the contribution of helium at the grain boundaries in the new model, it is possible to represent the kinetics of helium release rate at high temperature. Given the uncertainties involved in the initial conditions for the inter-granular part of the model and the uncertainties associated to some model parameters for which limited lower-length scale information is available, such as the helium diffusivity at the grain boundaries, the results are complemented by a dedicated uncertainty analysis. This assessment demonstrates that the initial conditions, chosen in a reasonable range, have limited impact on the results, and confirms that it is possible to achieve satisfying results using sound values for the uncertain physical parameters.

AES Analysis of Au, Au/Cr, Au/Ni/Cr and Au/Pd/Cr Thin Films by the Change of Substrate Temperature and Annealing Temperature (기판온도와 열처리온도의 변화에 따른 Au/Cr, Au/Ni/Cr 및 Au/Pd/Cr 다층박막의 AES 분석)

  • Yoo, Kwang Soo;Jung, Hyung Jin
    • Analytical Science and Technology
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    • v.6 no.2
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    • pp.217-223
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    • 1993
  • Thin films of the Au/Cr, Au/Ni/Cr and Au/Pd/Cr systems were deposited on alumina substrates at ambient temperature and $250^{\circ}C$ in a high-vacuum resistance heating evaporator and annealed at $300^{\circ}C$, $450^{\circ}C$ and $600^{\circ}C$ for 1 hour in air, respectively. The film thicknesses of Au, Ni(or pd), and Cr were $1000{\AA}$, $300{\AA}$, and $50{\AA}$, respectively. The substrate temperature during deposition and the post-deposition annealing temperature affected the sheet resistance of thin-films due to the inter-diffusion of each layer. As a result of Auger depth profile analysis, in the Au/Cr system Cr already diffused out to Au surface during deposition at the substrate temperature of $250^{\circ}C$ and Au distribution changed after heat treatment. In the Au/Ni/Cr and Au/Pd/Cr systems, diffusion phenomena of Ni and Pd were found and especially Ni (approximately 45 at.%) diffused out to Au surface and oxidized.

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The study on the diffusion of Catholicism in the New World: focused on the relationship between the king and the pope (왕권과 교권의 대립을 통해 본 신대륙의 가톨릭 전파과정 연구)

  • LEE, Seong hun
    • Cross-Cultural Studies
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    • v.37
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    • pp.7-29
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    • 2014
  • The 'discovery' or 'conquest' of the New World in 1492 was the starting point of world history that irrevocably changed the fate of the Latin American continent. The global stream known as 'Columbian Exchange', which was the widespread inter-continental contacts, inter-civilizational conflicts, or bilateral communication, has rendered multifarious effects throughout many historical periods up to the very contemporary time. The propagation of Catholicism initiated along with this 'discovery' transformed Latin America of nowadays in the region that has the biggest Catholic population in the world. The previous studies in Korea regarding Latin American Catholicism has focused on the spread of Catholicism in relation to the European colonization, rather than analyzing the concrete and detailed ways in which Catholicism exerted tremendous influences in the whole continent. They were less attentive to various historical contexts in which the diffusion of Catholicism differed greatly according to cultural landscapes and political specificities. Thus, this essay attempts to examine the diffusion of Catholicism from the perspective of confrontation between royal authorities and the power of church. The essay points out that the royal communities and institutional authorities which facilitated the intial process of Catholic evangelization maintained antagonistic relationship with ecclesial powers. By delving into the gradual transformation of church systems, it reveals that Catholicism in Latin America became a major field for conquerors in power to attain economic and political dominance. And unlike the initial submission and hospitality, the religious convert of the indigenous people attested to the violent inhumanity and opposition. Therefore, the essay aims to pave a clearer way to the understanding of complicated dynamics and conflicts between Catholicism in Latin America and the establishment of Spanish colonization.

An Empirical Analysis on the Diffusion Impact of IT Technological Knowledge (정보통신 기술지식의 파급효과에 대한 실증분석)

  • 조형곤;박광만;이영용;박용태;김문수
    • Journal of Technology Innovation
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    • v.8 no.1
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    • pp.73-94
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    • 2000
  • The main objective of this research is to examine the spillover effects of technological knowledge from IT industry to other industrial sectors and, based on empirical findings, to draw policy implications and suggest policy directions. To this end, we divide IT industry into IT equipment and IT service, assuming that these two sub-sectors are considerably different each other in terms of technology knowledge flow. Other industries are classified into 17 different sectors based on the KSIC of 1990. As the proxy measure of technological knowledge, the notion of R&D stock is employed. The Input/output(I/O) Table is used to define the inter-industrial flow pattern and to draw the knowledge flow matrix. As the research methodology, cost function model is employed to gauge the spillover effects of technological knowledge of IT industry. Based on the results of analysis, it is found that the economic impact of technology diffusion also exhibits a different pattern between IT equipment and IT service. The diffusion of IT equipment tends to show labor-substitution effect whereas IT service displays labor-creation effect. This fact should be considered in devising industry, education, and labor policy. The expectations from this research are as follows. First, the sectoral pattern, difference between IT equipment and service in particular, identified from this research may shed light on the sector-specific policy direction. It is emphasized that a sector-specific approach, rather than an aggregate approach, is relevant for formulating IT policy. Second, it is expected that the importance of technology diffusion programs and policy measures are recognized among policy makers in IT industry.

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Simultaneous Formation of NiSi Contact and Cu Plug/Ti Barrier (NiSi 접촉과 Cu 플러그/Ti 확산방지층의 동시 형성 연구)

  • Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.20 no.6
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    • pp.338-343
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    • 2010
  • As an alternative to the W plug used in MOSFETs, a Cu plug with a NiSi contact using Ta / TaN as a diffusion barrier is currently being considered. Conventionally, Ni was first deposited and then NiSi was formed, followed by the barrier and Cu deposition. In this study, Ti was employed as a barrier material and simultaneous formation of the NiSi contact and Cu plug / Ti barrier was attempted. Cu(100 nm) / Ti / Ni(20 nm) with varying Ti thicknesses were deposited on a Si substrate and annealed at $4000^{\circ}C$ for 30 min. For comparison, Cu/Ti/NiSi thin films were also formed by the conventional method. Optical Microscopy (OM), Scanning Probe Microscopy (SPM), X-Ray Diffractometry (XRD), and Auger Electron Microscopy (AES) analysis were performed to characterize the inter-diffusion properties. For a Ti interlayer thicker than 50 nm, the NiSi formation was incomplete, although Cu diffusion was inhibited by the Ti barrier. For a Ti thickness of 20 nm and less, an almost stoichiometric NiSi contact along with the Cu plug and Ti barrier layers was formed. The results were comparable to that formed by the conventional method and showed that this alternative process has potential as a formation process for the Cu plug/Ti barrier/NiSi contact system.

Characteristics of W-C-N Thin Diffusion Barrier for Cu Interconnection (Cu 금속배선을 위한 카본-질소-텅스텐 확산방지막 특성)

  • Lee, Chang-Woo
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.4 s.37
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    • pp.345-349
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    • 2005
  • Low resistive ($300{\mu}{\Omega}$-cm) W-C-N films have been deposited on tetraethylorthosilicate (TEOS) interlayer dielectric by atomic layer deposition (ALD) with $WF_6-N_2-CH_4$ gas. The exposure cycles of $N_2$ and $CH_4$ are synchronized with pulse plasma. The W-C-N films on TEOS layer follow the ALD mechanism and keep constant deposition rate of 0.2 nm/cycle from 10 to 100 cycles. As a diffusion barrier for Cu interconnection the W-C-N films maintain amorphous phase and Cu inter-diffusion is not occurred even at $800^{\circ}C$ for 30 min.

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Solid-state sintering mechanism of blended elemental Ti-6Al-4V powders

  • Kim, Youngmoo;Song, Young-Beom;Lee, Sung Ho
    • Journal of Powder Materials
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    • v.25 no.2
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    • pp.109-119
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    • 2018
  • The objective of this study is to reveal the sintering mechanism of mixed Ti-6Al-4V powders considering the densification and the homogenization between Ti and Al/V particles. It is found that the addition of master alloy particles into Ti enhances densification by the migration of Al into the Ti matrix prior to the self-diffusion of Ti. However, as Ti particles become coarser, sintering of the powders appears to be retarded due to slower inter-diffusion of the particles due to the reduced surface energies of Ti. Such phenomena are confirmed by a series of dilatometry tests and microstructural analyses in respect to the sintering temperature. Furthermore, the results are also consistent with the predicted activation energies for sintering. The energies are found to have decreased from 299.35 to $135.48kJ{\cdot}mol^{-1}$ by adding the Al/V particles because the activation energy for the diffusion of Al in ${\alpha}-Ti$ ($77kJ{\cdot}mol^{-1}$) is much lower than that of the self-diffusion of ${\alpha}-Ti$. The coarser Ti powders increase the energies from 135.48 to $181.16kJ{\cdot}mol^{-1}$ because the specific surface areas of Ti decrease.

Multiple Cases Study on the Motivation, IT Resistance and Change Management for IT Acceptance and Diffusion: focused on Automotive Industry PLM Cases (IT수용 및 확산관련 추진동기, IT저항, 변화관리에 관한 다중사례연구: 자동차산업의 PLM적용사례 중심으로)

  • Han, Seok-Hee;Lee, Yun-Cheol
    • Information Systems Review
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    • v.10 no.3
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    • pp.257-287
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    • 2008
  • Grounded in the prior literatures on acceptance and diffusion of IT and innovation in the level of organization research, 3 major constructional factors such as Motivation, IT resistance, and IT change management were investigated to suggest propositions from 15 multi-cases of PLM from 6 different companies in Automotive OEMs and suppliers, and we posited that the diffusion is continued only when motivation is stronger enough to overcome IT resistance as a fundamental finding and basis of this research on PLM acceptance and diffusion. The Motivation was found to be initiated and categorized from three different factors such as environmental factors, organizational factors, and technological factors, providing key propositions for further research: (1)The Automotive suppliers, contrary to OEM, are affected more by the demand of inter-connectivity as an environmental factor, while the other factors are similarly influencing to them, (2)The big organizations are influenced more by the champion, while the small organizations get influenced more by leader. (3)When the trend, inter-connectivity and complexity get stronger, the motivation gets more strongly influenced by the perceived benefit in the technological context. Regarding Change management we suggests IT change management is supportive to overcome IT resistance and also to enforce Motivation, and the critical mass exists differently according to the market maturity adopted, and more market matured technology has lower critical mass, implies less requirement of IT change management than less market matured technology.