• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.2013-2014
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• 2011

Indium tin oxide (ITO) thin films have been deposited onto bare glass substrates by sol-gel process. The solution was prepared by mixing indium precursor and tin precursor dissolved in 2-methoxyethanol at $75^{\circ}C$ for 12 hours. Indium tin oxide films were prepared by slowly heat up to $200^{\circ}C$ for 10 minutes and annealed at $350^{\circ}C$ for 1 hour. In this paper, we researched simple and inexpensive sol-gel process. To find the optimal ratio of In/Sn to reduce electric resistance in ITO made by sol-gel process, we assessed electric properties varying the ratio of In and Sn precursor.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.660-665
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• 1996

Thin films of indium oxide and indium tin oxide have been prepared by d.c. magnetron sputtering onto the fused silica substrates kept at 90, 200 and $300^{\circ}C$. In order to elucidate the optical absorption process in low energy region below 3 eV, we have analyzed the absorption coefficients obtained from reflectance and transmittance measurements for these films based on the Lucovsky model. It has been found for the first time that a defect center in the band gap is located at 0.8~1.4 eV below the Fermi level in all films and arises from oxygen vacancies in their films. The optical absorption in low energy region is explained to be dominated by the transition of electrons trapped at the positively charged (+2e) oxygen vacancies with s-like nature to the conduction band formed from the 5s-orbit in indium atoms.

• Resources Recycling
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• v.2 no.2
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• pp.22-26
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• 1993

The flowsheet for the recovery of gallium and indium from zinc residues has been established based on the sulfuric acid treatment. In comparison with the alkali treatment, the method proposed in this work allowed the recovery of indium together with gallium. The majority of iron contained in leach liquor could be removed through the two-stage neutrallization under oxidative or reductive atmosphere. Crude gallium and indium could be obtained through the alkali and/or acid leaching of the products generated from the above treatment. In addition, cementation of indium with zinc powders could also be used for the concentration of it from weak acid solutions.

• Bulletin of the Korean Chemical Society
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• v.33 no.5
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• pp.1566-1570
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• 2012

The combined use of indium and polysorbate 20 (Tween 20) was considered as a new inhibition technique for zinc corrosion. Zn and Zn-In alloy coatings were prepared by electrodeposition and their morphology and composition were characterized by scanning electron microscopy (SEM) and inductively coupled plasma atomic emission spectrometry (ICP-AES). The corrosion inhibition effect of indium and Tween 20 on zinc was investigated by polarization curves and electrochemical impedance spectroscopy (EIS). The corrosion inhibition efficiencies obtained from Tafel and EIS analyses are well in agreement. Zinc corrosion can be inhibited to some extent by the individual use of indium and Tween 20 and higher corrosion inhibition efficiency can be obtained by the combined use of indium and Tween 20.

• Applied Chemistry for Engineering
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• v.26 no.4
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• pp.389-393
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• 2015

Recovery of indium from secondary sources have been attracting over years not only because of increasing demand together with development of flat panel display industry but also industrial criticality of indium. Applied technology to recover indium for recycling of end-of-life FPD devices can be broadly divided into three major steps, disassembly or dismantling, enrichment or upgrading, and refining or purification. In addition, advanced technology such as zone-refining can be employed for ultra-high purity products. In this mini-review, we present currently applied technologies for recovery of indium and the outlook for total recycling of FDP devices.

• Bulletin of the Korean Chemical Society
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• v.26 no.9
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• pp.1354-1358
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• 2005

Nano- and microstructured indium nitride crystals were synthesized by the reaction of indium oxide ($In_2O_3$) powder and its pellet with ammonia in the temperature range 580-700 ${^{\circ}C}$. The degree of nitridation of $In_2O_3$ to InN was very sensitive to the nitridation temperature. The formation of zero- to three-dimensional structured InN crystals demonstrated that $In_2O_3$ is nitridated to InN via two dominant parallel routes (solid ($In_2O_3$)-to-solid (InN) and gas ($In_2O$)-to-solid (InN)). The growth of InN crystals with such various morphologies was explained by the vapor-solid (VS) mechanism where the degree of supersaturation of In vapor determines the growth morphology and the vapor was mainly by the reaction of $In_2O$ with ammonia and partially by sublimation of solid InN. The pellet method was proven to be useful to obtain homogeneous InN nanowires.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.57-61
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• 2021

A formation process of indium bump arrays on micro-pillar structures is proposed. The space to form indium bump on the narrow structures can be secured applying the benzocyclobutene (BCB) planarization and its etch-back process. We exhibit a detailed overview of the process steps involved in the fabrication of 320×256 hybrid camera sensor for short-wavelength infrared (SWIR) detection. The shear strength of the BCB, which has undergone the different processes, is extracted by quartz crystal microbalance measurement. The shear strength of the BCB is three orders of magnitude higher than that of the indium bump itself. The measured dark current distribution of the fabricated SWIR camera sensor indicates the suggested process of indium bumps can be useful for embodying highly sensitive infared camera sensors.

• Journal of Technologic Dentistry
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• v.23 no.1
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• pp.31-43
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• 2001

This study was performed to observe the micro-structure change of surface, behavior of oxide change of element, the component transformation of the alloy and the bonding strength between the porcelain interface in order to investigate effects of indium, tin on interfacial properties of porcelain fused to low gold alloy. Hardness of castings was measured with a micro-Vicker's hardness tester. The compositional change of the surface of heat-treated specimen was analyzed with an EDS and an EPMA. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The results were as follows: 1) The hardness value of alloy increased as increasing amount of indium addition. 2) The formation of oxidation increased as increasing indium and tin contents after heat treatment. 3) Diffusion of indium and tin elements increased as increasing indium and tin contents in metal-porcelain surface after porcelain fused to metal firing. 4) The most interfacial shear bonding strength was increased as increasing a composition of adding elements, and a heat-treatment time, and an oxygen partial pressure. From the results of this study it was found that the addition of alloying elements such as indium and tin increase hardness of as-cast alloy, produce surface oxide layer of adding elements by heat-treatment which may improve interfacial bonding strength between alloy and porcelain.

• 대한핵의학회:학술대회논문집
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• 1973.11a
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• pp.55.1-55.1
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• 1973

• Applied Chemistry for Engineering
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• v.21 no.2
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• pp.224-229
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• 2010

Transparent conductive oxide films have been widely used in the field of flat panel display (FPD). Transparent conductive Indium Zinc Oxide (IZO) thin films with excellent chemical stability have attracted much attention as an alternative material for Indium Tin Oxide (ITO) films. In this study, using $In_2O_3$ and ZnO powder mixture with a ratio of 90 : 10 wt% as a target, IZO films are prepared on polynorbornene (PNB) substrates by electron beam evaporation. The effect of thickness and $O_2$ introduction flow rate on the optical, electrical, structural properties and surface composition of deposited IZO films were investigated by UV/Visible spectrophotometer, 4-point probe method, SEM, XRD and XPS.