• Title/Summary/Keyword: indentation analysis

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Optimization of Welding Parameters for Resistance Spot Welding of TRIP Steel using Response Surface Methodology (저항 점 용접에서 반응표면분석법을 이용한 고장력 TRIP강의 최적 용접 조건 설정에 관한 연구)

  • 박현성;김태형;이세헌
    • Journal of Welding and Joining
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    • v.21 no.2
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    • pp.76-81
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    • 2003
  • Due to the environmental problem, automotive companies are trying to reduce the weight of car body. Therefore, WP(Transformation Induced Plasticity) steels, which are hish strength and ductility have been developed. The application of TRIP steel to the members has been reported to increase the energy absorption capability. Welding process is a complex process; therefore deciding the optimal welding conditions is an effective method on the basis of the experimental data. However, using a trial-and-error method from the beginning in such a wide area, in order to decide the optimal conditions requires too many numbers of experiments. To overcome these problems and to decide the optimal conditions, response surface methodology was used. Response surface methodology is a collection of mathematical and statistical techniques that are for the modeling and analysis of problems in which a response of interest is influenced by several variables and the objective is to optimize this response. The introduced method was applied to the resistance spot welding process of the TRIP steel and the welding parameters were optimized. (Received December 6, 2002)

Investigation of Impact Behavior by Thickness variation of Laminated Composite Subjected to Low-Velocity Impact (저속충격을 받는 복합적층판의 두께 변화에 따른 충격거동 조사)

  • Kwon, Suk-Jun;Jeon, Jin-Hyung;Kim, Seung-Deog
    • Proceeding of KASS Symposium
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    • 2008.05a
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    • pp.74-79
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    • 2008
  • In this study, impact transient responses of (Graphite/Epoxy) laminated composite subjected to low-velocity impact are investigated using a finite element method. Dynamic von-Karman plate equations considering large deflection of plate are modified to include the effect of transverse shear deformations as in Mindlin plate theory and also the rotary inertia effect is considered. The convergence of transient responses is used contact law established through the statical indentation test. We investigate displacements, contact forces and strains by thickness variation of various laminated composite. We compare and analyze each results.

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Application of the Preliminary Displacement Principle to the Temper Rolling Model

  • Lee, Won-Ho;Yuli Liu
    • Journal of Mechanical Science and Technology
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    • v.15 no.2
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    • pp.225-231
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    • 2001
  • A mathematical model for the analysis of roll gap phenomena in the strip temper rolling process is described. A new approach to solve the roll indentation and diverging problem in modeling of severe temper rolling cases is obtained by adopting the preliminary displacement principle of two contacted rough bodies to describe the friction behavior in the roll gap. The mechanical peculiarities of the temper rolling process, such as a high friction value with high roughness rolls and a non-circular contact arc, low reduction and non-negligible entry and exit elastic zones as well as central preliminary displacement zone etc., are all taken into account. The deformation of work rolls is calculated with the influence function method and an arbitrary contact are shape is permitted. The strip deformation is modeled by the slab method and the entry and exit elastic deformation zones are included. The preliminary displacement principle is used to determine the boundaries and to calculate the friction of the central preliminary displacement zone. The model is calibrated against the production mill data and installed in the setup computer of a temper rolling mill in POSCO. The validity and precision of the model have been proven through a comparison of the measured roll forces and the predicted ones.

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Application and Verification of Virtual Manufacturing to Hot Press Forming Process with Boron Steel (보론강 핫 프레스 포밍 공정에 대한 가상생산 응용 및 검증)

  • Suh, Yeong-Sung;Ji, Min-Wook;Lee, Kyung-Hoon;Kim, Young-Suk
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.2
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    • pp.61-66
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    • 2010
  • A virtual manufacturing system that is composed of JMatPro, a material modeler and $DEFORM^{TM}$-HT, a finite element package is applied to the hot press forming process: high temperature material properties for each phase such as flow stress, elastic modulus, Poisson's ratio, thermal expansion coefficient, in addition to TTT curve are predicted by JMatPro and taken into $DEFORM^{TM}$-HT to predict the material behavior considering phase transformation and heat transfer simultaneously. In order to verify the accuracy of computation, the residual stress and the springback were compared with the experimental measurements. Both the predicted and measured principal residual stresses and amount of springback were in good agreement. It was also found that the residual stresses generated from hot press forming are not negligible as it has been generally assumed, although the springback deformation is quite small.

Molecular Dynamics Study on the Pattern Transfer in Nanoimprint Lithography (분자 동역학을 이용한 나노임프린트 리소그래피에서의 패턴 전사에 관한 연구)

  • Kang Ji-Hoon;Kim Kwang-Seop;Kim Kyung-Woong
    • Tribology and Lubricants
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    • v.21 no.4
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    • pp.177-184
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    • 2005
  • The molecular dynamics simulation of nanoimprint lithography (NIL) using $SiO_2$ stamp and amorphous poly-(methylmethacrylate) (PNMA) film is performed to study pattern transfer in NIL. Force fields including bond, angle, torsion, van der Waals and electrostatic potential are used to describe the intermolecular and intramolecular force of PMMA molecules and $SiO_2$ stamp. Nose-Hoover thermostat is used to control the system temperature and cell multipole method is adopted to treat long range interactions. The deformation of PMMA film is observed during pattern transfer in the NIL process. For the detail analysis of deformation characteristics, the distributions of density and stress in PMHA film are calculated. The adhesion and friction forces are obtained by dividing the PMMA film into subregions and calculating the interacting force between subregion and stamp. Their effects on the pattern transfer are also discussed as varying the indentation depth and speed.

Nano-Wear and Friction of Magnetic Recording Hard Disk by Contact Start/Stop Test

  • Kim, Woo Seok;Hwang, Pyung;Kim, Jang-Kyo
    • KSTLE International Journal
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    • v.1 no.1
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    • pp.12-20
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    • 2000
  • Nano-wear and friction of carbon overcoated laser-textured and mechanically-textured computer hard disk were characterised after contact start/stop (CSS) wear test. Various analytical and mechanical testing techniques were employed to study the changes in topography, roughness, chemical elements, mechanical properties and friction characteristics of the coating arising from the contact start/stop wear test These techniques include: the atomic force microscopy (AFM), the continuous nano-indentation test, the nano-scratch test, the time-of-flight secondary ion mass spectroscopy (TOF-SIMS) and the auger electron spectroscopy (AES). It was shown that the surface roughness of the laser-textured (LT) bump and mechanically textured (MT) Bone was reduced approximately am and 7nm, respectively, after the CSS wear test. The elastic modulus and hardness values increased after the CSS test, indicating straining hardening of the top coating layer, A critical load was also identified fer adhesion failure between the magnetic layer and the Ni-P layer, The TOF-SIMS analysis also revealed some reduction in the intensity of C and $C_2$$F_59$, confirming the wear of lubricant elements on the coating surface.

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Characterization of Thin Film Materials by Nanoindentation and Scanning Probe Microscopy (나노인덴테이션과 주사탐침현미경을 이용한 박막 재료의 특성평가)

  • Kim, Bong-seob;Yun, Jon-do;Kim, Jong-kuk
    • Korean Journal of Materials Research
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    • v.13 no.9
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    • pp.606-612
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    • 2003
  • Surface and mechanical properties of thin films with submicron thickness was characterized by nanoindentation with Berkovich and Vickers tips, and scanning probe microscopy. Nanoindention was made in a depth range of 15 to 200 nm from the surface by applying tiny force in a range from 150 to $9,000 \mu$N. Stiffness, contact area, hardness, and elastic modulus were determined from the force-displacement curve obtained. Reliability was first tested by using fused quartz, a standard sample. Elastic modulus and hardness values of fused quartz measured were the same as those reported in the literature within two percent of error. Mechanical properties of ITO thin film were characterized in a depth range of 15∼200nm. As indentation depth increased, elastic modulus and hardness decreased by substrate effect. Ion beam deposited DLC thin films were indented in a depth range of 40∼50 nm. The results showed that the DLC thin film using benzene and bias voltage 0∼-50 V has elastic modulus and hardness value of 132 and 18 GPa respectively. Pure DLC thin films showed roughnesses lower than 0.25 nm, but silicon-added DLC thin films showed much higher roughness values, and the wavy surface morphology.

Wear Properties of Silicon Nitride Nano-Ceramics (나노 질화규소 세라믹스의 내마모 특성)

  • Kim, Jae-Hee;Kumar B, Venkata Manoj;Kim, Won-Sik;Hong, Seong-Hyeon
    • Journal of the Korean Ceramic Society
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    • v.46 no.5
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    • pp.505-509
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    • 2009
  • In this study, bulk nano-crystalline $Si_3N_4$ ceramics were fabricated by spark plasma sintering (SPS) and their mechanical properties, in particular wear, were investigated. A wide range of grain sizes, from 80 nm and 250 nm were obtained by varying sintering conditions ($1550^{\circ}C$-5 min to $1650^{\circ}C$-20 min). The elastic modulus of obtained ceramics was ${\sim}250$ GPa and hardness was in the range of $13{\sim}14$ GPa. The indentation fracture toughness increased from $2.58MPa{\cdot}m^{1/2}$ to $3.24MPa{\cdot}m^{1/2}$ with increasing sintering temperature possibly due to the elongated grains. Sliding wear tests revealed at least an order magnitude improvement in wear resistance with grain refinement. Microstructure analysis indicated that nano-$Si_3N_4$ specimens worn mainly through delamination and microcracking, while that of coarser specimens revealed severe wear with grain debonding and fracture.

Metal/$Al_2O_3-SiO_2$ System Interface Investigations

  • Korobova, N.;Soh, Deawha
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2004.05a
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    • pp.70-73
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    • 2004
  • The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

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Fracture and Residual Stresses in $Metal/Al_2O_3-SiO_2$ System

  • Soh, D.;Korobova, N.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.308-312
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    • 2003
  • The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

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