• Title/Summary/Keyword: iSoC (System-on-a-chip)

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ViP: A Practical Approach to Platform-based System Modeling Methodology

  • Um, Jun-Hyung;Hong, Sung-Pack;Kim, Young-Taek;Chung, Eui-Young;Choi, Kyu-Myung;Kong, Jeong-Taek;Eo, Soo-Kwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.5 no.2
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    • pp.89-101
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    • 2005
  • Research on highly abstracted system modeling and simulation has received a great deal of attention as of the concept of platform based design is becoming ubiquitous. From a practical design point of view, such modeling and simulation must consider the following: (i) fast simulation speed and cycle accuracy, (ii) early availability for early stage software development, (iii) inter-operability with external tools for software development, and (iv) reusability of the models. Unfortunately, however, all of the previous works only partially addresses the requirements, due to the inherent conflicts among the requirements. The objective of this study is to develop a new system design methodology to effectively address the requirements mentioned above. We propose a new transaction-level system modeling methodology, called ViP (Virtual Platform). We propose a two-step approach in the ViP method. In phase 1, we create a ViP for early stage software development (before RTL freeze). The ViP created in this step provides high speed simulation, lower cycle accuracy with only minor modeling effort.(satisfying (ii)). In phase 2, we refine the ViP to increase the cycle accuracy for system performance analysis and software optimization (satisfying (i)). We also propose a systematic ViP modeling flow and unified interface scheme based on utilities developed for maximizing reusability and productivity (satisfying (ii) and (iv)) and finally, we demonstrate VChannel, a generic scheme to provide a connection between the ViP and the host-resident application software (satisfying (iii)). ViP had been applied to several System-on-a-chip (SoC) designs including mobile applications, enabling engineers to improve performance while reducing the software development time by 30% compared to traditional methods.

Converting Interfaces on Application-specific Network-on-chip

  • Han, Kyuseung;Lee, Jae-Jin;Lee, Woojoo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.17 no.4
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    • pp.505-513
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    • 2017
  • As mobile systems are performing various functionality in the IoT (Internet of Things) era, network-on-chip (NoC) plays a pivotal role to support communication between the tens and in the future potentially hundreds of interacting modules in system-on-chips (SoCs). Owing to intensive research efforts more than a decade, NoCs are now widely adopted in various SoC designs. Especially, studies on application-specific NoCs (ASNoCs) that consider the heterogeneous nature of modern SoCs contribute a significant share to use of NoCs in actual SoCs, i.e., ASNoC connects non-uniform processing units, memory, and other intellectual properties (IPs) using flexible router positions and communication paths. Although it is not difficult to find the prior works on ASNoC synthesis and optimization, little research has addressed the issues how to convert different protocols and data widths to make a NoC compatible with various IPs. Thus, in this paper, we address important issues on ASNoC implementation to support and convert multiple interfaces. Based on the in-depth discussions, we finally introduce our FPGA-proven full-custom ASNoC.

Design and Implementation of Hardware for various vision applications (컴퓨터 비전응용을 위한 하드웨어 설계 및 구현)

  • Yang, Keun-Tak;Lee, Bong-Kyu
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.1
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    • pp.156-160
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    • 2011
  • This paper describes the design and implementation of a System-on-a-Chip (SoC) for pattern recognition to use in embedded applications. The target Soc consists of LEON2 core, AMBA/APB bus-systems and custom-designed accelerators for Gaussian Pyramid construction, lighting compensation and histogram equalization. A new FPGA-based prototyping platform is implemented and used for design and verification of the target SoC. To ensure that the implemented SoC satisfies the required performances, a pattern recognition application is performed.

A Performance Study on CPU-GPU Data Transfers of Unified Memory Device (통합메모리 장치에서 CPU-GPU 데이터 전송성능 연구)

  • Kwon, Oh-Kyoung;Gu, Gibeom
    • KIPS Transactions on Computer and Communication Systems
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    • v.11 no.5
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    • pp.133-138
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    • 2022
  • Recently, as GPU performance has improved in HPC and artificial intelligence, its use is becoming more common, but GPU programming is still a big obstacle in terms of productivity. In particular, due to the difficulty of managing host memory and GPU memory separately, research is being actively conducted in terms of convenience and performance, and various CPU-GPU memory transfer programming methods are suggested. Meanwhile, recently many SoC (System on a Chip) products such as Apple M1 and NVIDIA Tegra that bundle CPU, GPU, and integrated memory into one large silicon package are emerging. In this study, data between CPU and GPU devices are used in such an integrated memory device and performance-related research is conducted during transmission. It shows different characteristics from the existing environment in which the host memory and GPU memory in the CPU are separated. Here, we want to compare performance by CPU-GPU data transmission method in NVIDIA SoC chips, which are integrated memory devices, and NVIDIA SMX-based V100 GPU devices. For the experimental workload for performance comparison, a two-dimensional matrix transposition example frequently used in HPC applications was used. We analyzed the following performance factors: the difference in GPU kernel performance according to the CPU-GPU memory transfer method for each GPU device, the transfer performance difference between page-locked memory and pageable memory, overall performance comparison, and performance comparison by workload size. Through this experiment, it was confirmed that the NVIDIA Xavier can maximize the benefits of integrated memory in the SoC chip by supporting I/O cache consistency.

Comparing Energy Efficiency of MPI and MapReduce on ARM based Cluster (ARM 클러스터에서 에너지 효율 향상을 위한 MPI와 MapReduce 모델 비교)

  • Maqbool, Jahanzeb;Rizki, Permata Nur;Oh, Sangyoon
    • Proceedings of the Korean Society of Computer Information Conference
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    • 2014.01a
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    • pp.9-13
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    • 2014
  • The performance of large scale software applications has been automatically increasing for last few decades under the influence of Moore's law - the number of transistors on a microprocessor roughly doubled every eighteen months. However, on-chip transistors limitations and heating issues led to the emergence of multicore processors. The energy efficient ARM based System-on-Chip (SoC) processors are being considered for future high performance computing systems. In this paper, we present a case study of two widely used parallel programming models i.e. MPI and MapReduce on distributed memory cluster of ARM SoC development boards. The case study application, Black-Scholes option pricing equation, was parallelized and evaluated in terms of power consumption and throughput. The results show that the Hadoop implementation has low instantaneous power consumption that of MPI, but MPI outperforms Hadoop implementation by a factor of 1.46 in terms of total power consumption to execution time ratio.

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A CDMA-Based Communication Network for a Multiprocessor SoC (다중 프로세서를 갖는 SoC 를 위한 CDMA 기술에 기반한 통신망 설계)

  • Chun, Ik-Jae;Kim, Bo-Gwan
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.707-710
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    • 2005
  • In this paper, we propose a new communication network for on-chip communication. The network is based on a direct sequence code division multiple access (DS-CDMA) technique. The new communication network is suitable for a parallel processing system and also drastically reduces the I/O pin count. Our network architecture is mainly divided into a CDMA-based network interface (CNI), a communication channel, a synchronizer. The network includes a reverse communication channel for reducing latency. The network decouples computation task from communication task by the CNI. An extreme truncation is considered to simplify the communication link. For the scalability of the network, we use a PN-code reuse method and a hierarchical structure. The network elements have a modular architecture. The communication network is done using fully synthesizable Verilog HDL to enhance the portability between process technologies.

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A Novel High-speed CMOS Level-Up/Down Shifter Design for Dynamic-Voltage/Frequency-Scaling Algorithm (Dynamic-Voltage/Frequency-Scaling 알고리즘에서의 다중 인가 전압 조절 시스템 용 High-speed CMOS Level-Up/Down Shifter)

  • Lim Ji-Hoon;Ha Jong-Chan;Wee Jae-Kyung;Moon Gyu
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.6 s.348
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    • pp.9-17
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    • 2006
  • We proposed a new High-speed CMOS Level Up/Down Shifter circuits that can be used with Dynamic Voltage and Frequency Scaling(DVFS) algorithm, for low power system in the SoC(System-on-Chip). This circuit used to interface between the other voltage levels in each CMOS circuit boundary, or between multiple core voltage levels in a system bus. Proposed circuit have advantage that decrease speed attenuation and duty ratio distortion problems for interface. The level up/down shifter of the proposed circuit designed that operated from multi core voltages$(0.6\sim1.6V)$ to used voltage level for each IP at the 500MHz input frequency The proposed circuit supports level up shifting from the input voltage levels, that are standard I/O voltages 1.8V, 2.5V, 3.3V, to multiple core voltage levels in between of $0.6V\sim1.6V$, that are used internally in the system. And level down shifter reverse operated at 1Ghz input frequency for same condition. Simulations results are shown to verify the proposed function by Hspice simulation, with $0.6V\sim1.6V$ CMOS Process, $0.13{\mu}m$ IBM CMOS Process and $0.65{\mu}m$ CMOS model parameters. Moreover, it is researched delay time, power dissipation and duty ration distortion of the output voltage witch is proportional to the operating frequency for the proposed circuit.

Low Power Level-Up/Down Shifter with Single Supply for the SoC with Multiple Supply (다중전원 SoC용 저전력 단일전원 Level-Up/Down Shifter)

  • Woo, Young-Mi;Kim, Doo-Hwan;Cho, Kyoung-Rok
    • The Journal of the Korea Contents Association
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    • v.8 no.3
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    • pp.25-31
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    • 2008
  • We propose a low power level-up/down shifter with single supply that can be used at SoC with multiple supply. The proposed circuit interfaces IPs which are operated on the different supply voltages. The circuit is designed with a single supply that decreases the low power consumption and the complexity of supply routing and layout. The proposed circuit operated at 500MHz for level-up and at 1GHz for level-down. The level-up/down shifter improves noise immunity of the system at I/O circuit. The circuit is evaluated for 1.8V, 2.5V, 3.3V supply with 0.18um CMOS technology, respectively.

A VLSI DESIGN OF CD SIGNAL PROCESSOR for High-Speed CD-ROM

  • Kim, Jae-Won;Kim, Jae-Seok;Lee, Jaeshin
    • Proceedings of the IEEK Conference
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    • 2002.07b
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    • pp.1296-1299
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    • 2002
  • We implemented a CD signal processor operated on a CAV 48-speed CD-ROM drive into a VLSI. The CD signal processor is a mixed mode monolithic IC including servo-processor, data recovery, data-processor, and I-bit DAC. For servo signal processing, we included a DSP core, while, for CAV mode playback, we adopted a PLL with a wide recovery range. Data processor (DP) was designed to meet the yellow book specification.[2]So, the DP block consists of EFM demodulator, C1/C2 ECC block, audio processor and a block transferring data to an ATAPI chip. A modified Euclid's algorithm was used as a key equation solver for the ECC block To achieve the high-speed decoding, the RS decoder is operated by a pipelined method. Audio playability is increased by playing a CD-DA disc at the speed of 12X or 16X. For this, subcode sync and data are processed in the same way as main data processing. The overall performance of IC is verified by measuring a transfer rate from the innermost area of disc to the outermost area. At 48-speed, the operating frequency is 210 ㎒, and this chip is fabricated by 0.35 um STD90 cell library of Samsung Electronics.

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MEMS Embedded System Design (MEMS 임베디드 시스템 설계)

  • Hong, Seon Hack
    • Journal of Korea Society of Digital Industry and Information Management
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    • v.18 no.4
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    • pp.47-54
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    • 2022
  • In this paper, MEMS embedded system design implemented the sensor events via analyzing the characteristics that dynamically happened to an abnormal status in power IoT environments in order to guarantee a maintainable operation. We used three kinds of tools in this paper, at first Bluetooth Low Energy (BLE) technology which is a suitable protocol that provides a low data rate, low power consumption, and low-cost sensor applications. Secondly LSM6DSOX, a system-in-module containing a 3-axis digital accelerometer and gyroscope with low-power features for optimal motion. Thirdly BM1422AGMV Digital Magnetometer IC, a 3-axis magnetic sensor with an I2C interface and a magnetic measurable range of ±120 uT, which incorporates magneto-impedance elements to detect the magnetic field when the current flowed in the power devices. The proposed MEMS system was developed based on an nRF5340 System on Chip (SoC), previously compared to the standalone embedded system without bluetooth technology via mobile App. And also, MEMS embedded system with BLE 5.0 technology broadcasted the MEMS system status to Android mobile server. The experiment results enhanced the performance of MEMS system design by combination of sensors, BLE technology and mobile application.