• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.429-433
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• 2007

Cement mortar and concrete can be used as grouts but problems regarding shrinkage and the discord of coefficients of thermal expansion between grouts and HDPE pipes has to be solved. Thermal conductivities of wet condition two times larger than those of dry condition, except for pure cement mortar. The addition of sand into the cement grouts greatly increases the thermal conductivity. The addition of bentonite into the cement grouts reduces thermal conductivity thus reducing the density. Bentonite grouting must be used only below the groundwater table since bentonite grouts possesses high shrinkage property in dry condition. The addition of sand prevents the shrinkage of bentonite grouts. Bentonite manufactured in Korea can be used since they possess similar thermal conductivities with imported products. The addition of sand into the bentonite grouts greatly increases the thermal conductivity.

• Proceedings of the Korean Geotechical Society Conference
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• 2009.03a
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• pp.179-187
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• 2009

Bentonite-based grouting has been popularly used to seal a borehole installed for a closed-loop vertical ground heat exchanger in a geothermal heat pump system (GHP) because of its high swelling potential and low hydraulic conductivity. The bentonite-based grout, however, has relatively lower thermal conductivity than that of ground formation. Accordingly, it is common to add some additives such as silica sand to the bentonite-based grout for enhancing thermal performance. In this study, graphite is adapted to substitute silica sand as an addictive because graphite has very high thermal conductivity. The effect of graphite on the thermal conductivity of bentonite-based grouts has been quantitatively evaluated for seven bentonite grouts from different product sources. In addition, comparisons of viscosity between applications of graphite and silica sand as additives has been carried out. In conclusion, using graphite has thermal conductivity about three times higher than that of silica sand.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.14-14
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• 2011

Graphene is known to possess excellent thermal properties, including high thermal conductivity, that make it a prime candidate material for heat management in ultra large scale integrated circuits. For device applications, the key parameters are the thermal expansion coefficient and the thermal conductivity. There has been no reliable experimental determination on the thermal expansion coefficient of graphene whereas the estimates of the thermal conductivity vary widely. In this work, we estimate the thermal expansion coefficient of graphene on silicon dioxide by measuring the temperature dependence of the Raman spectrum. The shift of the Raman peaks due to heating or cooling results from both the intrinsic temperature dependence of the Raman spectrum of graphene and the strain on the graphene film due to the thermal expansion mismatch with silicon dioxide. By carefully comparing the experimental data against theoretical calculations, it is possible to determine the thermal expansion coefficient. The thermal conductivity is measured by estimating the thermal profile of a graphene film suspended over a circular hole of the substrate.

• Carbon letters
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• v.22
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• pp.25-35
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• 2017

The aim of the work was to investigate the thermo-electrical properties of low cost and rapidly produced randomly oriented carbon/carbon (C/C) composite. The composite body was fabricated by combining the high-pressure hot-pressing (HP) method with the low-pressure impregnation thermosetting carbonization (ITC) method. After the ITC method step selected samples were graphitized at $3000^{\circ}C$. Detailed characterization of the samples' physical properties and thermal properties, including thermal diffusivity, thermal conductivity, specific heat and coefficient of thermal expansion, was carried out. Additionally, direct current (DC) electrical conductivity in both the in-plane and through-plane directions was evaluated. The results indicated that after graphitization the specimens had excellent carbon purity (99.9 %) as compared to that after carbonization (98.1). The results further showed an increasing trend in thermal conductivity with temperature for the carbonized samples and a decreasing trend in thermal conductivity with temperature for graphitized samples. The influence of the thickness of the test specimen on the thermal conductivity was found to be negligible. Further, all of the specimens after graphitization displayed an enormous increase in electrical conductivity (from 190 to 565 and 595 to 1180 S/cm in the through-plane and in-plane directions, respectively).

• Computers and Concrete
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• v.32 no.6
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• pp.567-576
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• 2023

In this study, a 3D microstructure-based model is established to simulate the effective thermal conductivity of cement paste, covering varying influencing factors associated with microstructure and thermal transfer mechanisms. The virtual cement paste divided into colloidal C-S-H and heterogeneous paste are reconstructed based on its structural attributes. Using the two-level hierarchical cement pastes as inputs, a lattice Boltzmann model for heat conduction is presented to predict the thermal conductivity. The results suggest that due to the Knudsen effect induced by the nanoscale pore, the thermal conductivity of air in C-S-H gel pore is significantly decreased, maximumly accounting for 3.3% thermal conductivity of air at the macroscale. In the cement paste, the thermal conductivities of dried and saturated cement pastes are stable at the curing age larger than 100 h. The high water-to-cement ratio can decrease the thermal conductivity of cement paste.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.3401-3406
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• 2007

This study was performed to acquire the reliable in-situ thermal conductivity of closed type ground heat exchanger used in ground source heat pump. We selected four sites(Cheonan, Daejeon, Daegu, Gwangju) which are central area of South Korea. Test results show that the effective thermal conductivities are 2.33 W/m$^{\circ}C$, 2.50 W/m$^{\circ}C$, 2.75 W/m$^{\circ}C$ and 2.86 W/m$^{\circ}C$. From this data, we can see that thermal conductivity varies about the range of 23% with the sites. Also, thermal conductivity increases up to 20% by changing grouting material from low salica sand to high one.

• Korean Journal of Materials Research
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• v.32 no.10
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• pp.429-434
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• 2022

There is ongoing research to develop lithium ion batteries as sustainable energy sources. Because of safety problems, solid state batteries, where electrolytes are replaced with solids, are attracting attention. Sulfide electrolytes, with a high ion conductivity of 10^-3 S/cm or more, have the highest potential performance, but the price of the main materials is high. This study investigated lithium hydride materials, which offer economic advantages and low density. To analyze the change in ion conductivity in polymer electrolyte composites, PVDF, a representative polymer substance was used at a certain mass ratio. XRD, SEM, and BET were performed for metallurgical analyses of the materials, and ion conductivity was calculated through the EIS method. In addition, thermal conductivity was measured to analyze thermal stability, which is a major parameter of lithium ion batteries. As a result, the ion conductivity of LiH was found to be 10^-6 S/cm, and the ion conductivity further decreased as the PVDF ratio increased when the composite was formed.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.28 no.4
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• pp.153-157
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• 2016

In case of metal insulation, which is produced by stacking stainless steel sheets and air layers in a multi-stack manner at a specific thickness, insulation performance will be evaluated based on thermal transmittance rather than the intrinsic physical properties of each material such as thermal conductivity. However, there is no standard for measuring thermal transmittance targeted for non-homogeneous insulation which is used in relatively high temperature conditions such as a power station. In this study, the thermal conductivity of homogeneous insulation acquired by the standardized guard hot plate method and the thermal conductivity of homogeneous insulation measured by the newly developed performance tester were compared to verify the confidence level of the tester. As a result, thermal conductivity acquired by the newly developed thermal transmittance tester was about 6% higher than the thermal conductivity measured by the existing guard hot plate method under the anticipated service temperature conditions.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.130-134
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• 2016

Due to the need for advanced technologies in the automotive industry, the demand for lighter and safer vehicles has increased. Even though various nonferrous metals, like Aluminum, Magnesium and also Carbon Fiber Reinforced Plastic (CFRP), have been implemented in the automotive industry, a lot of technical research and development is still focused on ferrous metals. In particular, the market volume of High Strength Steel (HSS) parts and Ultra High Strength Steel (UHSS) by hot press forming parts has expanded significantly in all countries' automotive industries. A new tool steel, High Thermal-Conductivity Tool Steel (HTCS), for stamping punches and dies has been developed and introduced by Rovalma Company (Spain), and it is able to support better productivity and quality during hot press forming. The HTCS punches and dies could help to reduce cycle time due to their high thermal conductivity, one of the major factors in hot press forming operation. In this study, test dies were manufactured in order to verify the high thermal conductivity of HTCS material compared to SKD6. In addition, thermal deformation was inspected after the heating and cooling process of hot press forming. After heating and cooling, the test dies were measured by a 3D scanner and compared with the original geometry. The results showed that the thermal deformation and distortion were very small even though the cooling time was reduced by 2 seconds.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.