• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.29-33
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• 2013

We have fabricated transparent polymer composite films with high thermal emissivity, which can be used for heat dissipation of transparent electronics. PMMA (poly(methyl methacrylate)) solution with high transparency and thermal emissivity is mixed with various fillers (carbon nanotubes (CNTs), aluminum nitride (AlN), or silicon carbide (SiC)) with high thermal conductivity. We have achieved the thermal emissivity as high as 0.94 by the addition of CNTs. Compared with the PMMA film on glass, however, the addition of AlN or SiC is shown to rather decrease the thermal emissivity. It is also observed that the thickness of the PMMA film does not affect its thermal emissivity. To avoid any degradation of the thermal conductivity, therefore, the PMMA film thickness is desirable to be $1{\mu}m$. There also exists a tradeoff between the optical transmittance and thermal conductivity on the selection of the amount of fillers.

• Geomechanics and Engineering
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• v.10 no.1
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• pp.49-57
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• 2016

The high permeability-high strength concrete belongs to the typical of porous materials. It is mainly used in underground engineering for cold area, it can act the role of heat preservation, also to be the bailing and buffer layer. In order to establish a suitable model to predict the thermal conductivity and directly applied for engineering, according to the structure characteristics, the thermal conductivity predicting model was built by resistance network model of parallel three-phase medium. For the selected geometric and physical cell model, the thermal conductivity forecast model can be set up with aggregate particle size and mixture ratio directly. Comparing with the experimental data and classic model, the prediction model could reflect the mixture ratio intuitively. When the experimental and calculating data are contrasted, the value of experiment is slightly higher than predicting, and the average relative error is about 6.6%. If the material can be used in underground engineering instead by the commonly insulation material, it can achieve the basic requirements to be the heat insulation material as well.

• Journal of the Korean Solar Energy Society
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• v.32 no.6
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• pp.93-99
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• 2012

A nanofluid is a fluid containing suspended solid particles, with sizes on the order of nanometers. Especially graphene nanoparticle that has the high thermal conductivity properties among the various nanoparticles added to the nanofluid is receiving attention. Graphene is a flat monolayer of $sp^2$-bonded carbon atoms tightly packed into a honeycomb lattice. And are known to have very high thermal conductivity. Therefore, we compared thermal conductivity with viscosity of graphene M-5 nanofluids and graphene M-15 nanofluids. Graphene M-5 and graphene M-15 have different average particle diameters and the other properties are the same. Two kinds of graphene nanofluids was examined by measuring thermal conductivity via transient hot-wire method. And the viscosity was measured by using a rotational digital viscometer. As a result, graphene M-5 nanofluids exhibited better thermal conductivity and viscosity than graphene M-15 nanofluids.

• Design & Manufacturing
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• v.18 no.3
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• pp.37-43
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• 2024

With the development of technology in the electrical and electronic field, research on heat dissipation materials that can efficiently emit and control heat to solve the heat generation problem is being actively conducted. Since heat dissipation materials require electrical insulation and thermal conductivity, the polymer composite material was manufactured by mixing chemically stable silicone resins and ceramic fillers, and thermal conductivity and mechanical properties were observed. At the same filling amount, the larger the particle size and the higher the high thermal conductivity filler was added, the higher the thermal conductivity was, mechanical properties were confirmed to have higher tensile strength and elongation as the particles were smaller and the tissue was denser. After selecting materials in consideration of thermal conductivity and mechanical properties, an appropriate mixing ratio is considered important.

• Korean Journal of Materials Research
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• v.29 no.7
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• pp.443-450
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• 2019

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance($R_{th}$) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.319-322
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• 2004

In this paper, we studied on the thermal conductivity and a mechanical property of the elastic epoxy. According to industrial development, insulation materials have various properties. They are solid, liquid, gas state, there are various type. Epoxy, a kind of insulation material, demand of not only high hardness but also elastic property. When the electric current flows into the conductor and the place where the heat occurs, this heat becomes the cause which shortens the life of the electrical appliance. Therefore, for the heat occurred transmit quickly, thermal conductivity of the insulation material is highly demanded. We studied on the thermal conductivity of elastic epoxy on the high voltage. In this result, thermal conductivity confirmed that it followed thermal property of mixed epoxy and addictives. Hardness is decreased when addictives increased.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.8
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• pp.1141-1151
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• 1998

An effective thermal conductivity measurement for suspensions of microparticles in oil mixture is conducted in order to evaluate the shear rate-dependence of the thermal conductivity of suspensions. Measurements are made for rotating Couette flows between two concentric cylinders. The rotating outer cylinder is immersed into a constant temperature water bath while the stationary inner cylinder is subject to a uniform heat fluff. Test fluids are made to be homogeneous suspensions, in which neutrally buoyant microparticles ($d=25{\sim}300{\mu}m$) are uniformly dispersed. The present measurements show strong shear-rate dependent thermal conductivities for the suspensions, which are higher than those at zero shear rate. The shear rate dependent thermal conductivity increases with the particle size and volume concentration.4 new model for shear rate-dependent thermal conductivity of microparticle suspensions is proposed; the correlation covers from zero shear rate value to asymptotic plateau value at moderately high shear rates.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.163-166
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• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2\;and\;Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability

• Current Applied Physics
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• v.18 no.12
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• pp.1534-1539
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• 2018

SnSe single crystal showed a high thermoelectric zT of 2.6 at 923 K mainly due to an extremely low thermal conductivity $0.23W\;m^{-1}\;K^{-1}$. It has anisotropic crystal structure resulting in deterioration of thermoelectric performance in polycrystalline SnSe, providing a low zT of 0.6 and 0.8 for Ag and Na-doped SnSe, respectively. Here, we presented the thermoelectric properties on the K-doped $K_xSn_{1-x}Se$ (x = 0, 0.1, 0.3, 0.5, 1.5, and 2.0%) polycrystals, synthesized by a high-temperature melting and hot-press sintering with annealing process. The K-doping in SnSe efficiently enhances the hole carrier concentration without significant degradation of carrier mobility. We find that there exist widespread Se-rich precipitates, inducing strong phonon scattering and thus resulting in a very low thermal conductivity. Due to low thermal conductivity and moderate power factor, the $K_{0.001}Sn_{0.999}Se$ sample shows an exceptionally high zT of 1.11 at 823 K which is significantly enhanced value in polycrystalline compounds.

• Proceedings of the Korean Nuclear Society Conference
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• 1996.05c
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• pp.265-270
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• 1996

The temperature distribution in the pellet was obtained from beginning the general heat conduction equation. The thermal conductivity of pellet used the SIMFUEL data that made clear the effect of burnup on the thermal conductivity degradation. Since the pellet rim acts as the thermal barrier to heat flow. the pellet was subdivided into several rings in which the outer ring was adjusted to play almost the same role as the rim. The local burup in each ring except the outer ring was calculated from the power depression factor based on FASER results. whereas the rim burnup at the outer ring was achieved by the pellet averaged burnup based on the empirical relation. The rim changed to the equivalent Xe film so the predicted temperature shooed the thermal jump across the rim. The observed temperature profiles depended on linear heat generation rate. fuel burnup. and power depression factor. The thermal conductivity degradation modelling can be applied to the fuel performance code to high burnup fuel,