• 대한기계학회논문집B
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• 제34권2호
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• pp.153-156
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• 2010

나노유체로 기공이 채워진 규사와 같은 2상 물질의 고온에서의 유효 열전도도를 비정상열침법을 사용하여 측정하였다. 본 연구의 나노유체는 물과 0.1% 체적률의 입경이 45 nm 인 알루미나 나노입자의 혼합유체이다. 본 연구의 측정방법은 액체가 모래의 미세한 기공 내에 존재하므로, 열전도도의 측정에서의 액체의 대류에 의한 문제가 적다. 본 연구의 모래에 대한 예측모델을 사용하여 나노유체와 모래입자의 2상 물질의 유효 열전도도의 측정결과로부터, 고온의 나노유체의 열전도도를 결정하였다. 실험결과, $30^{\circ}C\sim80^{\circ}C$의 온도 범위에서 순수한 물에 대한 본 연구의 나노유체의 열전도도의 증가율은 4.87% ~ 5.48% 의 범위에서 변화하는 것으로 나타났다.

• 한국주조공학회지
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• 제36권5호
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• pp.159-166
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• 2016

The microstructural evolution of a cast Ni base superalloy, IN738LC, has been investigated after long term exposure at several temperatures. Most of the fine secondary ${\gamma}^{\prime}$ particles resolved after 2000 hour exposure at $816^{\circ}C$. At higher temperatures of $871^{\circ}C$ and $927^{\circ}C$, secondary ${\gamma}^{\prime}$ resolved after 1000 hours of exposure, and cuboidal primary ${\gamma}^{\prime}$ grew with exposure time. During the thermal exposure, ${\sigma}$ phase formed at all tested temperatures, and ${\eta}$ phase was observed around interdendritic regions due to carbide degeneration. The influence of microstructural evolution during thermal exposure on the mechanical properties has been analyzed. The effects of ${\gamma}^{\prime}$ particle growth are more pronounced on the high temperature creep properties than on the room temperature tensile properties.

• 한국기계가공학회지
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• 제11권4호
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• pp.180-184
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• 2012

3-way ball valves have been mostly used for high temperature/high pressure valves using in petrochemical carriers and oil tankers, which requires high quality products with confidentiality and durability. As a larger disaster may be generated by leakage of oil or gas from valves, thus the present research applied a numerical analysis method with thermal-structural coupled field analysis and the performance test. The Max stress by parts was confirmed through thermal-structural coupled field analysis and develop the 3-way ball valve design, which is safe on operating condition. And its performance was verified by carrying out pressure test, leakage test and durability test for the manufactured 3-way ball valves with satisfying it's regulations.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• 한국분말재료학회지
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• 제23권5호
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• pp.364-371
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• 2016

This study investigates the thermal shock property of a polycrystalline diamond compact (PDC) produced by a high-pressure, high-temperature (HPHT) sintering process. Three kinds of PDCs are manufactured by the HPHT sintering process using different particle sizes of the initial diamond powders: $8-16{\mu}m$ ($D50=4.3{\mu}m$), $10-20{\mu}m$ ($D50=6.92{\mu}m$), and $12-22{\mu}m$ ($D50=8.94{\mu}m$). The microstructure observation results for the manufactured PDCs reveal that elemental Co and W are present along the interface of the diamond particles. The fractions of Co and WC in the PDC increase as the initial particle size decreases. The manufactured PDCs are subjected to thermal shock tests at two temperatures of $780^{\circ}C$ and $830^{\circ}C$. The results reveal that the PDC with a smaller particle size of diamond easily produces microscale thermal cracks. This is mainly because of the abundant presence of Co and WC phases along the diamond interface and the easy formation of Co-based (CoO, $Co_3O_4$) and W-based ($WO_2$) oxides in the PDC using smaller diamond particles. The microstructural factors for controlling the thermal shock property of PDC material are also discussed.

• Journal of Electrochemical Science and Technology
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• 제11권2호
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• pp.132-139
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• 2020

Solid oxide fuel cells (SOFCs) are among one of the promising technologies for efficient and clean energy. SOFCs offer several advantages over other types of fuel cells under relatively high temperatures (600℃ to 800℃). However, the thermal behavior of SOFC stacks at high operating temperatures is a serious issue in SOFC development because it can be associated with detrimental thermal stresses on the life span of the stacks. The thermal behavior of SOFC stacks can be influenced by operating or material properties. Therefore, this work aims to investigate the effects of the thermal conductivity of each component (anode, cathode, and electrolyte) on the thermal behavior of samarium-doped ceria-based SOFCs at intermediate temperatures. Computational fluid dynamics is used to simulate SOFC operation at 600℃. The temperature distributions and gradients of a single cell at 0.7 V under different thermal conductivity values are analyzed and discussed to determine their relationship. Simulations reveal that the influence of thermal conductivity is more remarkable for the anode and electrolyte than for the cathode. Increasing the thermal conductivity of the anode by 50% results in a 23% drop in the maximum thermal gradients. The results for the electrolyte are subtle, with a ~67% reduction in thermal conductivity that only results in an 8% reduction in the maximum temperature gradient. The effect of thermal conductivity on temperature gradient is important because it can be used to predict thermal stress generation.

• 항공우주시스템공학회지
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• 제13권1호
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• pp.18-28
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• 2019

초고속 비행체는 발사 및 재진입 시 공력 가열에 의해 높은 열 하중을 받는다. 초고속 비행체의 외피 구조물인 열방어 시스템 패널은 기계적으로 구속되어 있기 때문에 고온 가열 시 열 좌굴이 발생할 수도 있다. 이는 초고속 비행체의 유동장에 변화를 주어 공력특성을 불안정하게 한다. 따라서 열방어 시스템 패널은 초고속 비행에 의한 공력가열 시 비행안정성을 유지하기 위해 열 좌굴을 방지하도록 설계되어야 한다. 본 논문에서는 운용 시 안팎에 큰 온도차가 존재하는 열방어 시스템 패널에 대해 유한차분법을 사용하여 열전달 특성을 분석하였으며, 리츠 법을 사용하여 열 좌굴 특성에 대한 근사적 모델을 제안하였다. 또한 정의된 근사적 모델의 정확도를 검증하기 위해 유한요소 해석결과와 비교하였다. 마지막으로, 수립된 근사 기법을 바탕으로 열방어 시스템 패널의 좌굴 발생 온도에 대한 매개변수 분석을 수행하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.619-620
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• 2007

• Tribology and Lubricants
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• 제17권5호
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• pp.358-364
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• 2001

Disk brake system transforms a large amount of kinetic energy to thermal energy in a short time. As the size and speed of automotive increases in recent years, the disk brakes absorbs more thermal energy. And this thermal energy can cause an unacceptable braking performance due to the high transient temperature, that is attained at the friction surface of brake disk and pad. Although these high temperatures are one of the biggest problems. In this study, the overall thermal behavior of ventilated disk brake system was investigated by numerical method. The 3-Dimensional unsteady model was simulated by using a general purpose software package “FLUENT” to obtain the temperature distributions of disk and pad. The model includes the more realistic braking method, which repeats braking and release. The effects of several parameters such as the repeated braking, inlet air velocity and thermal conductivity on the temperature distribution were investigated.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.31-37
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• 2000

Metal matrix composites(MMCs) are rapidly becoming one of the strongest candidates for structural materials for many high temperature application. Among the high temperature environment, thermal shock is known to cause significant degradation in most MMC system. Therefore, the nondestructive evaluation on thermal shock damage behavior of SiC/A16061 composite has been carried out using ultrasonic surface and SH-waves. For this study, Sic fiber reinforced metal matrix composite specimens fabricated by a squeeze casting technique were thermally cycled in the temperature range 25~$400^{\circ}C$ up to 1000 cycles. Three point bend test was conducted to investigate the effect of thermal shock damage on mechanical properties. The relationship between thermal shock damage behavior and the change of ultrasonic velocity and attenuation were discussed by considering SEM observation of fracture surface.