• Polymer(Korea)
• /
• v.38 no.2
• /
• pp.199-204
• /
• 2014

To prepare acrylic pressure sensitive adhesives (PSAs), quaternary copolymer syrups were photopolymerized from 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate as default constituents and isobornyl acrylate and tetrahydrofurfuryl acrylate (THFA) as variable constituents. After polymerization, 1,6-hexanediol diacrylate and photoinitiator were added and then crosslinked by UV-irradiation to prepare the PSAs. The characteristics of the syrup such as viscosity, molecular weight, and solid content were investigated. As increasing THFA contents, the relationship between molecular weight and solid content of the syrup was reciprocal. Also, the relationship between peel strength and surface energy of the PSAs showed the same tendency. All the PSA samples showed high transmittance (more than 92%), low haze (less than 1.0%) and low color-difference (less than 1.0).

• Metals and materials international
• /
• v.24 no.6
• /
• pp.1376-1385
• /
• 2018

Ultrasonic melt treatment (UST) was applied to an A390 hypereutectic Al-Si alloy in a temperature range of $750-800^{\circ}C$ and its influence on the solidification structure and the consequent increase in strength was investigated. UST at such a high temperature, which is about $100^{\circ}C$ above the liquidus temperature, had little effect on the grain refinement but enhanced the homogeneity of the microstructure with the uniform distribution of constituent phases (e.g. primary Si, ${\alpha}-Al$ and intermetallics) significantly refined. With the microstructural homogeneity, quantitative analysis confirmed that UST was found to suppress the formation of Cu-bearing phases, i.e., $Q-Al_5Cu_2Mg_8Si_6$, $Al_2Cu$ phases that form in the final stage of solidification while notably increasing the average Cu contents in the matrix from 1.29 to 2.06 wt%. A tensile test exhibits an increase in the yield strength of the as-cast alloy from 185 to 208 MPa, which is mainly associated with the solute increment within the matrix. The important role of UST in the microstructure evolution during solidification is discussed and the mechanism covering the microstructure-strengthening interrelationship of the ultrasonically treated A390 alloy is proposed.

• Korean Journal of Metals and Materials
• /
• v.48 no.4
• /
• pp.369-375
• /
• 2010

Ti-6Al-4V ELI alloy, which is commonly used as a biomaterial, is associated with a high elastic modulus and poor biocompatibility. This alloy presents a variety of problems on several areas. Therefore, the development of good non-toxic biocompatible biomaterials with a low elastic modulus is necessary. Particularly, hydroxyapatite (HA) is an attractive material for human tissue implantation. This material is widely used as artificial bone due to its good biocompatibility and similar composition to human bone. Many scientists have studied the fabrication of HA as a biomaterial. However, applications of bulk HA compact are hindered by the low strength of HA when it is sintered. Therefore, HA has been coated on Ti or Ti alloy to facilitate good bonding between tissue and the HA surface. However, there are many problems when doing this, such as the low bonding strength between HA and Ti due to the different thermal expansion coefficients and mechanical properties. In this study, a Ti-HA composite with a porous surface was successfully fabricated by pulse current activated sintering (PCAS) and a subsequent leaching process.

• Applied Chemistry for Engineering
• /
• v.23 no.3
• /
• pp.259-265
• /
• 2012

Differently from fly ash, the bottom ash produced from thermal power generation has been treated as an industrial waste matter, and almost reclaimed or was applied with the additive of the part concrete. Bottom ash has various problems to use with the aggregate. Bottom ash is lighter than typically the sand or the gravel and it's physical properties (compressive strength etc.) is somewhat low because of high absorptance. In order to manufacture the ash concrete, we used a bottom ash as a main material and a pure sulfur as a binder. In this study, fundamental research methods that vary the grain-size of bottom ash and the ratio of sulfur vs ash were investigated to improve the quality of ash concrete such as compressive strength. Bottom ash in this research which occurs from domestic 4 place power plants, was checked physical and chemical properties. The compressive strength seems the result which simultaneously undergoes an influence in content of the sulfur and Bottom ash grain-size. We got the result of the maximum 92 MPa. The compressive strength was high result for grain size below 1.2 mm and high sulfur content.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.6
• /
• pp.379-383
• /
• 2015

Some insulating materials are organized and analyzed with variables to obtain the optimized profile of encapsulated three phase of epoxy barrier which is applied to gas compartment and supporting conductors for high voltage GIS (gas insulated switchgear). The high voltage GIS is used in electrical power system and operating reliability. In this paper, optimization possibility of barrier shape including both electrical insulation performance and mechanical strength, premised on that condition minimizing volume and light weight should be kept for high voltage GIS, could be achieved by analysis simulation. As a result, filling material which is lower permittivity such as $SiO_2$ instead of $Al_2O_3$ properly to the epoxy material, can be improved to increase the electrical insulation performance and mechanical strength for an optimized profile barrier of a high voltage GIS.

• Journal of the Korean Society of Safety
• /
• v.21 no.4 s.76
• /
• pp.1-6
• /
• 2006

The lightness of components that was required in automobile and machinery industry requires high strength of components. In particular, manufacturing process and new materials development for solving the fatigue facture problem attendant upon high strength of suspension of automobile are actively advanced. In this paper, the effect of compressive residual stress of spring steel(JISG SUP-9)by shot-peening on fatigue crack growth characteristics in high temperature($100^{\circ}C,\;150^{\circ}C,\;180^{\circ}C$)was investigated with considering fracture mechanics. So, we can obtaint the followings. (1) Compressive residual stress is decreased with increasing the test temperature. (2) The effect of compressive residual stress on fatigue crack growth behavior in high temperature is increased below ${\Delta}K=17{\sim}19MPa{\sqrt{m}}$. (3) It was investigated by SEM that the constraint of compress residual stress for plastic zone of fatigue crack tip was decreased in high temperature as compared with room temperature.

• The Journal of Advanced Prosthodontics
• /
• v.6 no.6
• /
• pp.434-443
• /
• 2014

PURPOSE. The purpose of this study was to evaluate and compare the effects of different surface pretreatment techniques on the surface roughness and shear bond strength of a new self-adhering flowable composite resin for use with lithium disilicate-reinforced CAD/CAM ceramic material. MATERIALS AND METHODS. A total of one hundred thirty lithium disilicate CAD/CAM ceramic plates with dimensions of $6mm{\times}4mm$ and 3 mm thick were prepared. Specimens were then assigned into five groups (n=26) as follows: untreated control, coating with $30{\mu}m$ silica oxide particles ($Cojet^{TM}$ Sand), 9.6% hydrofluoric acid etching, Er:YAG laser irradiation, and grinding with a high-speed fine diamond bur. A self-adhering flowable composite resin (Vertise Flow) was applied onto the pre-treated ceramic plates using the Ultradent shear bond Teflon mold system. Surface roughness was measured by atomic force microscopy. Shear bond strength test were performed using a universal testing machine at a crosshead speed of 1 mm/min. Surface roughness data were analyzed by one-way ANOVA and the Tukey HSD tests. Shear bond strength test values were analyzed by Kruskal-Wallis and Mann-Whitney U tests at ${\alpha}=.05$. RESULTS. Hydrofluoric acid etching and grinding with high-speed fine diamond bur produced significantly higher surface roughness than the other pretreatment groups (P<.05). Hydrofluoric acid etching and silica coating yielded the highest shear bond strength values (P<.001). CONCLUSION. Self-adhering flowable composite resin used as repair composite resin exhibited very low bond strength irrespective of the surface pretreatments used.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.67-67
• /
• 2012

Graphene, two-dimensional one-atom-thick planar sheet of carbon atoms densely packed in a honeycomb crystal lattice, exhibits fascinating electrical properties, such as a linear energy dispersion relation and high mobility in addition to a wide-range optical absorption and high thermal conductivity. Graphene's outstanding tensile strength allows graphene-based electronic and photonic devices to be flexible, bendable, or even stretchable. Recently many groups have reported high performance electronic and optoelectronic devices based on graphene materials, i.e. field-effect transistors, gas sensors, nonvolatile memory devices, and plasmonic waveguides, in which versatile properties of graphene materials have been incorporated into a flexible electronic or optoelectronic platform. However, there are several fundamental or technological hurdles to be overcome in real applications of graphene in electronics and optoelectronics. In this tutorial we will present a short introduction to the basic material properties and recent progresses in applications of graphene to electronics and optoelectronics and discuss future outlook of graphene-based devices.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.1
• /
• pp.1-7
• /
• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2002.05a
• /
• pp.155-158
• /
• 2002

Fabrication process of metal/intermetallic laminated composites by using self-propagating high temperature synthesis(SHS) reactions between Ni and Al elemental metal foils have been investigated. Al foils were sandwiched between Ni foils and heated in a vacuum hot press to the melting point of aluminium. SHS reaction kinetics was thermodynamically analyzed through the final volume fraction of the unreacted Al related with the initial thickness ratio of Ni:Al and diffusion bonding stage before SHS reaction. Thermal aging of laminated composites resulted in the formation of functionally gradient series of intermetallic phases. Microstructure showed that the main phases of intermetallics were NiAl and $Ni_3Al$ having higher strength at room and high temperatures. The volume fractions of intermetallic phases were measured as 82.4, 58.6, 38.4% in 1:1, 2:1, 4:1 initial thickness ratio of Ni:Al.