• Journal of Adhesion and Interface
• /
• v.21 no.3
• /
• pp.93-100
• /
• 2020

3D printing technology enables proper objects to be made through an additive manufacturing method, but resulting in dimension deviation of the product due to contraction phenomenon as cooling melted filament resin injected from high-temperature use environment. In this research, we studied on acrylic adhesives for 3D printer build sheet in order to fabricate high-quality products with a precise shape and to well-mount without distortion. The solvent-free UV-curable acrylic adhesive formulation was designed by adding 4-acryloylmorpholine (ACMO) with high adhesion, toughness, glass transition temperature so that adhesion properties are stable at high temperature and products are easily mounted/detached from the adhesives. The designed formulation was polymerized through two-steps using post-addition of monomers. Using this, the acrylic adhesive was coated to make a film and then analyzed using various experimental techniques. As a result, the fabricated adhesive exhibited high glass transition temperature and there was little gap in peel strength before and after thermal treatment. Moreover, it was confirmed by rheological analysis that this adhesive can provide great bonding/debonding ability without distortion. We demonstrated the fabrication of a rectangular product using a 3D printing method using our acrylic adhesive as a build sheet. Mounting ability and workability were satisfactory and dimension deviation of the product was tiny. Because the product is easily detachable from the acrylic adhesive developed here than conventional build sheets, it is expected that this will provide work convenience to users who use the 3D printer.

• Journal of Korean Society of Steel Construction
• /
• v.25 no.5
• /
• pp.569-578
• /
• 2013

In a super-tall building construction, thick and large-sized embed plates are usually used to connect mega structural steel members to RC core wall or columns by welding a gusset plate on the face of the embed plate with T-shape. A large amount of heat input accumulated by weld passes causes the plates to expand or deform. In addition, the temperature of concrete around the plates also could be increased. Consequently, cracks and spalls occur on the concrete surface. In this study, the effect of weld heat on embed plates and 80MPa high strength concrete is investigated by considering weld position (2G and 3G position), edge distance, concrete curing time, etc. Measured temperature of the embed plates was compared with the transient thermal analysis results. Finally, push-out tests were performed to verify and compare the shear studs capacity of the embed plate with design requirement. Test result shows that the shear capacity of the plate is reduced by 14%-19% due to the weld heat effect and increased as the concrete curing time is longer.

• Journal of the Korea Concrete Institute
• /
• v.18 no.4 s.94
• /
• pp.449-458
• /
• 2006

The discharge of fly ash that is produced by coal-fired electric power plants is rapidly increasing in Korea. The utilization of fly ash in the raw materials would contribute to the elimination of an environmental problem and to the development of new high-performance materials. So it is needed to study the binder obtained by chemically activation of pozzolanic materials by means of a substitute for the cement. Fly ash consists of a glass phase. As it is produced from high temperature, it is a chemically stable material. Fly ash mostly consists of $SiO_2\;and\;Al_2O_3$, and it assumes the form of an oxide in the inside of fly ash. Because this reaction has not broken out by itself, it is need to supply it with additional $OH^-$ through alkali activators. Alkali activators were used for supplying it with additional $OH^-$. This paper concentrated on the strength development according to the kind of chemical activators, the curing temperature, the heat curing time. Also, according to scanning electron microscopy and X-Ray diffraction, the main reaction product in the alkali activated fly ash mortar is Zeolite of $Na_6-(AlO_2)_6-(SiO_2)_{10}-12H_2O$ type.

• Journal of Adhesion and Interface
• /
• v.23 no.2
• /
• pp.44-52
• /
• 2022

Epoxy resin has the disadvantage of being easily destroyed by instantaneous impact due to its high crosslinking density despite its high glass transition temperature (T_g) and excellent properties. To compensate for this, in this study, polyol was synthesized by ring opening polymerization of propylene glycol (PPG) diamine, Jeffamine D 2000 and propylene carbonate, and urethane modified epoxy was synthesized using this. The properties of the synthesized urethane modified epoxy were confirmed by FT-IR, H-NMR. To confirm the degree of improvement in impact resistance as an adhesive, a urethane modified epoxy adhesive was prepared by mixing a digylcidyl ether bisphenol A (DGEBA) with curing agent and curing accelerator. Properties test of urethane modified epoxy were shear strength, tensile strength and impact strength. As a result, excellent results were obtained in all test when the ratio of DGEBA : urethane modified epoxy was 8:2.

• Polymer(Korea)
• /
• v.39 no.3
• /
• pp.514-521
• /
• 2015

In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural double-sided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.

• Journal of Institute of Control, Robotics and Systems
• /
• v.15 no.9
• /
• pp.877-880
• /
• 2009

A curing process in post-printing section of R2R process is required for an electrical property of the printed pattern when devices such as RFID, Solar cell are printed. PEN as well as heat-stabilized PET which is used as a plastic substrate would be deformed at high temperature due to change of its elastic modulus. And crack in the printed pattern, which is on the plastic substrate is occurred due to the deformation of the substrate. The occurrence of crack causes electrical resistance to increase and the quality of the device to deteriorate. In case of RFID antenna, the range of reading distance is shortened as the electrical resistance of the antenna is increased. Therefore, the deformation of the plastic substrate, which causes the occurrence of crack, should be minimized by setting up low operating tension in R2R process. In low tension, slippage between a moving substrate and a roller would be generated when the operating speed is increased. And scratch would be occurred when slippage is generated due to an air entrainment, which is related to the thickness of the air film. The thickness of the air film is increased when operating speed is increased as shown by simulation based on mathematical model. The occurrence of scratch in conductive pattern printed by roll to roll process is a critical damage because it causes degradation or failure of electrical property of it.

• Polymer(Korea)
• /
• v.33 no.6
• /
• pp.575-580
• /
• 2009

Carbon fabric-reinforced silicon carbide composites (C/SiC) have attracted a considerable attention for high temperature structural application because of their outstanding oxidation resistance property and thermal shock resistance. In this study, we reported on the preparation of C/SiC composites by the polymer impregnation and pyrolysis (PIP) method. For this, polycarbosilane solution was impregnated into the carbon fabric and then cured by electron beam irradiation under argon atmosphere. Afterwards, the cured composite was pyrolyzed at $1300^{\circ}C$ for 1 h under argon atmosphere to produce the C/SiC composite. The porosity and density of the C/SiC composite were 13.5% and $2.44\;g/cm^3$, respectively, when the impregnation of the carbon fabric with the 30 wt% polycarbosilane solution conducted four times. In addition, in the isothermal experiment at $1500\;^{\circ}C$ in air for 5 h, the 95.9 wt% of the C/SiC composite was remained, indicating that the prepared C/SiC composite has a outstanding oxidation resistance.

• Textile Coloration and Finishing
• /
• v.34 no.3
• /
• pp.157-164
• /
• 2022

This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.4
• /
• pp.124-130
• /
• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.38 no.1 s.113
• /
• pp.1-8
• /
• 2006

To overcome troubles in strength and process of linerboard caused by raw materials, a neutral sizing which is usual in fine paper making can be considered. A new sizing agent is necessary to show good performance in a system with high conductivity and COD. In this study, fast cure type AKD was examined as a new sizing agent and compared with conventional AKD. The effects of fixing agent addition and drying condition were also investigated. Fast cure type AKD which has a higher cationicity showed better sizing degree than conventional AKD in spite of low addition level and no curing treatment. And when fixing agent of sufficient amount was added, sizing degree was improved for both AKDs. High cationicity is a crucial factor for neutral sizing of linerboard for obtaining fast and stable sizing degree. Drying with temperature over $100^{\circ}$ was desirable for developing sizing degree.