• 대한전자공학회논문지TC
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• 제43권12호
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• pp.75-82
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• 2006

본 논문에서는 개구를 갖는 접지면의 높은 특성 임피던스를 이용하여 주파수에 대한 민감도가 좋고 높은 품질 계수를 갖는 미앤더 라인 인덕터들을 설계하였다. 주파수에 대한 민감도는 자기 공진 주파수 (SRF) 대신에 해석 주파수 범위에 대한 유효 인덕턴스 변화량으로 새로 정의 되었다. 등가 집중 소자 회로는 고주파 인덕터의 특성을 설명하기 위해 전개되었다. 개구 접지면을 갖는 4 nH 미앤더 라인 인덕터는 0.45 nH/GHz의 좋은 민감도와 0.7 GHz에서 86의 Q 값을 갖는다.

• 한국자기학회지
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• 제6권6호
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• pp.367-374
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• 1996

자기소자중 가장 기본이 되는 박막인덕터의 제작에 관한 연구를 수행하기 위하여, photolitho-graphy와 에칭공정을 도입하고, 도체간격 및 도체폭이 수십 $\mu\textrm{m}$, 도체코일 턴수가 각각 13회와 20회, 크기가 $4\;mm{\times}4\;mm$인 공심형 박막인덕터를 제작하였다. 이것을 마이크로스트립선로에 정착하고, network analyzer로 주파수 1 MHz ~ 1 GHz에서 신호의 반사계수법을 이용하여 간편하고 비교적 정확한 측정을 하였다. 특히, 공정이 간단한 습식 에칭공정을 도입하여, 안정된 에칭기술을 통해 양호한 미세패턴구조를 얻었다. 박막인덕터의 특성은, 크기가 같을때, L 및 Q값은 spiral형이 meander형 보다 큰 값을 갖는 반면, 공진주파수는 인덕턴스의 증가에 의한 영향으로 spiral형이 meander형보다 감소하였다.

• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

• 한국전자파학회논문지
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• 제15권2호
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• pp.165-171
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• 2004

본 논문에서는 안테나 스위치 모듈 내에서 GSM/DCS 대역을 분리하는 적층형 다이플렉서를 설계하였고, LTCC 기술을 이용하여 제작한 후 그 특성을 고찰하였다. 다이플렉서를 구현하기 위해 소형의 L, C 집중 수동 소자를 사용하였으며, 또한 적층형 집중 수동 소자의 구조 모델링 및 등가 회로 모델을 제안함으로써 접지면 상에서 최적의 주파수 특성을 갖는 집중 수동 소자를 얻을 수 있었다. 이를 이용하여 RF 모듈에 적용 가능한 고품질의 다이플렉서를 구현하였다. GSM 저역 통과 필터는 0.55 dB 이하의 삽입 손실, 12 dB 이상의 반사 손실 그리고 DCS 통과 대역에서 26 dB 이상의 저지 특성을 나타내었다. DCS 고역 통과 필터는 0.82 dB 이하의 삽입 손실, 11 dB 이상의 반사손실 그리고 GSM 통과 대역에서 38 dB 이상의 저지 특성을 나타내었다.

• KIEE International Transactions on Electrophysics and Applications
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• 제5C권4호
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• 전기학회논문지
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• 제57권11호
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• pp.2127-2130
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• 2008

In this paper, a tunable bandpass filter with mutual inductive coupling circuits is newly designed and demonstrated for UHF TV tuner ranged from Ch.14(473MHz) to Ch.69(803MHz) applications. Conventional HF tuning circuit with an electromagnetic bandpass filter has several problems such as large size, high volume and high cost, since the electromagnetic filter is comprised of several passive components and air core inductors to be assembled and controlled manually. To address these obstacles, peaking chip inductor was newly applied for constructing the mutual inductive coupling circuit. The proposed circuit was newly and optimally designed, since the chip inductor showed lower components Q-value than the air core inductor. A varactor diode has been also used to fabricate the proposed tunable bandpass filter for RF tuning circuit. The fabricated tunable filter exhibited low insertion loss of approximately -3dB, high return loss of below -10dB, and large tuning bandwidth of 330MHz.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1406-1407
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• 2008

In this paper, a micro balanced filter in magnetically coupled LC resonators is proposed, designed, simulated by using FR-4 PCB substrate for low cost, small volume IEEE 802. 11a wireless LAN application. Two pair of coupled LC resonators using magnetic coupling of embedded inductors are applied to obtain bandpass transmission response and improve their phase and magnitude imbalance characteristics. In addition, high dielectric composite film is applied to fabricate the high Q MIM capacitors with small size and high capacitance density. It has an insertion loss of 1.4 dB, a return loss of 10 dB, a phase imbalance of 0.25 degree, and magnitude imbalance of 0.17 dB at frequency bandwidth of 200 MHz ranged from 5.15 GHz to 5.35 GHz, respectively. The proposed balanced filter has a small volume of $1.1mm{\times}1.3mm{\times}0.6mm$ (height).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(1)
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• pp.213-216
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• 2004

This paper describes design and implementation of the 5.5 GHz VCO with parallel-branch inductors using 0.8${\mu}m$ SiGe HBT process technology. The proposed parallel-branch inductor shows $12 \%$ improvement in quality factor in comparison with the conventional inductor. A phase noise of -93 dBc/Hz is measured at 100 kHz offset frequency, and the harmonics in the VCO are suppressed less than -23 dBc. The single-sided output power of the VCO is -6.5$\pm$1.5 dBm. The manufactured VCO consumes 15.0 mA with 2.5 V supply voltage. Its chip areas are 1.8mm ${\times}$ 1.2mm.

• 반도체디스플레이기술학회지
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• 제2권1호
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• pp.11-14
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• 2003

The high Q(quality factor) suspended spiral inductors were fabricated on the silicon substrate by 3D surface micromachined process. The integration of 2.4GHz VCO has been performed by fabricating suspended spiral inductor of the top of CMOS VCO circuit. The phase noise of VCO integrated MEMS inductor is 93.5 dBc/Hz at 100kHz of offset frequency.