• Title/Summary/Keyword: grain-orientation

검색결과 349건 처리시간 0.029초

DC 스퍼터법과 유도결합 플라즈마 마그네트론 스퍼터법으로 증착된 수퍼하드 TiN 코팅막의 물성 비교연구 (A Comparative Study of Superhard TiN Coatings Deposited by DC and Inductively Coupled Plasma Magnetron Sputtering)

  • 전성용
    • 한국표면공학회지
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    • 제46권2호
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    • pp.55-60
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    • 2013
  • Superhard TiN coatings were fabricated by DC and ICP (inductively coupled plasma) assisted magnetron sputtering techniques. The effect of ICP power, ranging from 0 to 300 W, on coating microstructure, preferred orientation mechanical properties were systematically investigated with HR-XRD, SEM, AFM and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of TiN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Grain sizes of TiN coatings were decreased from 12.6 nm to 8.7 nm with increase of ICP power. The maximum nanohardness of 67.6 GPa was obtained for the coatings deposited at ICP power of 300 W. Preferred orientation in TiN coatings also vary with ICP power, exerting an effective influence on film nanohardness.

Subgrain boundaries in octachloropropane: deformation patterns, subgrain boundary orientation and density

  • Ree, Jin-Han
    • 암석학회지
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    • 제3권1호
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    • pp.20-33
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    • 1994
  • Some of the seven types of subgrain boundaries (Means and Ree, 1988) in octachloropropane samples show distinctive deformation patterns during their development. Type II subgrain boundaries migrate to accommodate the deformation difference between adjacent grains. The formation of Type III requires a rigid-body roation of grains to reduce misorientation of adjacent grains. Type I, IV, V and VI develop either in static or dynamic condition. Type VII form only in static environments after deformation. Ribbon grains can develop via Type III or Type IV process. The orientation pattern and density of subgrain boundaries are more or less stable through a post-deformation heating. Subgrain boundary orientations are symmetric with respect to the grain-shape foliation in pure shear. In simple shear, their maximum inclines toward the direction of shear.

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X-ray Microdiffraction 을 이용한 구리 Interconnect의 Texture 분석 (Texture Analysis of Cu Interconnects Using X-ray Microdiffraction)

  • 정진석
    • 한국결정학회지
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    • 제12권4호
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    • pp.233-238
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    • 2001
  • 1㎛ 이하로 집속된 방사광원으로부터의 x-선을 이용하여 새로운 분석법인 x-선 미세회절(x-ray microdiffraction)을 사용하면 다결정시료 내 grain들의 방위나 strain의 국지적 분포를 정밀하게 측정할 수 있다. 포항가속기연구소 방사광원의 x-ray microbeam 실험 장치를 사용하여 찍은 Laue 사진을 측별히 쓰여진 분석 software를 이용하여 분석함으로써 고집적회로에 쓰이는것과 같은 방법으로 제작된 Si wafer 상의 다른 선폭의 구리 도선들이 가지는 texture 를 밝혀내었다. 실험시 x-ray빔의 크기는 2×3㎛²정도이었으며, 분석 결과에의하면 선폭 1㎛도선에서는 grain들이 방위가 특정한 방향성이 없는 반면, 선폭 20㎛도선의 중앙부분에서는 〈111〉fiber texture 가 관측되었다. Grain들의 크기는 선폭 1㎛의도선에서 2∼5㎛, 선폭 20㎛의도선에서는 6∼8㎛로 측정되었다.

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유도결합 플라즈마를 이용한 마그네트론 스퍼터링으로 증착된 나노결정질 CrN 코팅막의 성장 (Growth Behavior of Nanocrystalline CrN Coatings by Inductively Coupled Plasma (ICP) Assisted Magnetron Sputtering)

  • 서대한;전성용
    • 한국세라믹학회지
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    • 제49권6호
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    • pp.556-560
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    • 2012
  • Nanocrystalline CrN coatings were deposited by DC and ICP-assisted magnetron sputtering on Si (100) substrates. The influences of the ICP power on the microstructural and crystallographic properties of the coatings were investigated. For the generation of the ICP, radio frequency was applied using a dielectric-encapsulated coil antenna installed inside the deposition chamber. As the ICP power increased from 0 to 500W, the crystalline grain size decreased. It is believed that the decrease in the crystal grain size at higher ICP powers is due to resputtering of the coatings as a result of ion bombardment as well as film densification. The preferential orientation of CrN coatings changed from (111) to (200) with an increase in the ICP power. The ICP magnetron sputtering CrN coatings showed excellent surface roughness compared to the DC magnetron sputtering coatings.

EBSD studies on microstructure and crystallographic orientation of UO2-Mo composite fuels

  • Tummalapalli, Murali Krishna;Szpunar, Jerzy A.;Prasad, Anil;Bichler, Lukas
    • Nuclear Engineering and Technology
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    • 제53권12호
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    • pp.4052-4059
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    • 2021
  • The microstructure of the fuel pellet plays an essential role in fission gas buildup and release and is critical for the safe and continued operation of nuclear power stations. Structural analysis of uranium dioxide (UO2)-molybdenum (Mo) composite fuel pellets prepared at a range of sintering temperatures from 1300 to 1800 ℃ was performed. Mo micro and nanoparticles were used in making the composite pellets. A systematic investigation into the influence of processing parameters during Spark Plasma Sintering (SPS) of the pellets on the microstructure, texture, grain size, and grain boundary characters of UO2-Mo is presented. UO2-Mo composite show significant differences in the fraction of general boundaries and also special/coincident site lattice (CSL) boundaries. EBSD orientation maps demonstrated that <111> texturing was observed in the pellets fabricated at 1500 ℃. The experimental investigations suggest that UO2-Mo composite pellets have favorable microstructural features compared to the UO2 pellet.

알루미늄 유도 결정화를 이용한 대면적 다결정 Si 가상 기판 성장 전략 (A Strategy on the Growth of Large Area Polycrystalline Si Virtual Substrate Using Al-Induced Crystallization)

  • 김도현;박광욱
    • 한국전기전자재료학회논문지
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    • 제37권1호
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    • pp.26-35
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    • 2024
  • Aluminum-induced crystallization (AIC) as a route to reduce the fabrication cost and to obtain polycrystalline Si (p-Si) thin-film of large grain size is a promising alternative of single-crystalline (s-Si) substrate or p-Si thin-film obtained by conventional methods such as solid phase crystallization (SPC) and laser-induced crystallization (LIC). As the AIC process occurs at the interface between a-Si and Al thin-films, there are various process and interface parameters. Also, it directly means that there is a certain parametric window to obtain p-Si of large grain size having uniform crystal orientation. In this article, we investigate the effect of the various process and interface parameters to obtain p-Si of large grain size and uniform crystal orientation from the literature review. We also suggest the potential use of the p-Si as a virtual substrate for the growth of various compound semiconductors in a form of low-dimension as well as thin-film as a way for their monolithic integration on Si.

역 알루미늄 유도 결정화 공정을 이용한 실리콘 태양전지 다결정 시드층 생성 (Fabrication of Poly Seed Layer for Silicon Based Photovoltaics by Inversed Aluminum-Induced Crystallization)

  • 최승호;박찬수;김신호;김양도
    • 한국재료학회지
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    • 제22권4호
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    • pp.190-194
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    • 2012
  • The formation of high-quality polycrystalline silicon (poly-Si) on relatively low cost substrate has been an important issue in the development of thin film solar cells. Poly-Si seed layers were fabricated by an inverse aluminum-induced crystallization (I-AIC) process and the properties of the resulting layer were characterized. The I-AIC process has an advantage of being able to continue the epitaxial growth without an Al layer removing process. An amorphous Si precursor layer was deposited on Corning glass substrates by RF magnetron sputtering system with Ar plasma. Then, Al thin film was deposited by thermal evaporation. An $SiO_2$ diffusion barrier layer was formed between Si and Al layers to control the surface orientation of seed layer. The crystallinity of the poly-Si seed layer was analyzed by Raman spectroscopy and x-ray diffraction (XRD). The grain size and orientation of the poly-Si seed layer were determined by electron back scattering diffraction (EBSD) method. The prepared poly-Si seed layer showed high volume fraction of crystalline Si and <100> orientation. The diffusion barrier layer and processing temperature significantly affected the grain size and orientation of the poly Si seed layer. The shorter oxidation time and lower processing temperature led to a better orientation of the poly-Si seed layer. This study presents the formation mechanism of a poly seed layer by inverse aluminum-induced crystallization.

Study on the Preferred Orientation Using White Neutron

  • Lee, Yun-Peel
    • Nuclear Engineering and Technology
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    • 제6권4호
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    • pp.219-230
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    • 1974
  • 강한 방향성이 있는 다결정에 의한 중성자회절강도에 대한 재래의 공식을 결정의 반사율에 관한 Kunitomi 의식을 사용하여 수정하였다. 시료내의 grain 에서 회절이 일어나는 정화한 위치가 회절강도의 Maxwell곡선의 소각부분에 관한 이론치와 계산치를 비교함으로써 발견된다는 사실과 위의 회절강도 공식을 사용하여 금속내의 Preferred orientation을 백색중성자를 가지고 조사한 수 있는 방법을 고안하였다. 결정 내에서 일어나는 중성자비 다중반사와 흡수에 대해서 교정하여 원자로의 중성자 스펙트럼을 측정함으로써 열중성자의 확실성있는 파장이 1.025$\pm$0.001$\AA$임을 알았다. 대부분 cube-on-face 방향을 갖인 씰리콘 강철을 본 연구방법으로 조사차였는바 grain들이 압연방향에서 5도 이내에 배열되어 있다는 사실을 발견하였다. 커다란 결정에 적합한 이론들이 강한 방향성이 있는 다결정 물체에도 적응될 수 있음을 알게 되었다.

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Use of Local Electrochemical Methods (SECM, EC-STM) and AFM to Differentiate Microstructural Effects (EBSD) on Very Pure Copper

  • Martinez-Lombardia, Esther;Lapeire, Linsey;Maurice, Vincent;De Graeve, Iris;Klein, Lorena;Marcus, Philippe;Verbeken, Kim;Kestens, Leo;Gonzalez-Garcia, Yaiza;Mol, Arjan;Terryn, Herman
    • Corrosion Science and Technology
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    • 제16권1호
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    • pp.1-7
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    • 2017
  • When aiming for an increased and more sustainable use of metals a thorough knowledge of the corrosion phenomenon as function of the local metal microstructure is of crucial importance. In this work, we summarize the information presented in our previous publications[1-3] and present an overview of the different local (electrochemical) techniques that have been proven to be effective in studying the relation between different microstructural variables and their different electrochemical behavior. Atomic force microscopy (AFM)[1], scanning electrochemical microscopy (SECM)[2], and electrochemical scanning tunneling microscopy (EC-STM)[3] were used in combination with electron backscatter diffraction (EBSD). Consequently, correlations could be identified between the grain orientation and grain boundary characteristics, on the one hand, and the electrochemical behavior on the other hand. The grain orientation itself has an influence on the corrosion, and the orientation of the neighboring grains also seems to play a decisive role in the dissolution rate. With respect to intergranular corrosion, only coherent twin boundaries seem to be resistant.